(CVS) Cyclic Voltammetry Stripping (1 Message)
(Fwd) Storage Time (1 Message)
(no subject) (1 Message)
(no subject) CONGRATULATIONS!! in ASSY question (1 Message)
12 micon copper foil (1 Message)
12 micron copper foil (2 Messages)
3 layer board with 4 oz copper (1 Message)
<none> (1 Message)
? (1 Message)
A610 (2 Messages)
Address change (1 Message)
ADMIN (1 Message)
Admin: Is the Net dead today? (1 Message)
ADMIN: Job Posting (1 Message)
ADMIN: Job Posting Gone?? (2 Messages)
ADMIN: Job Postings on TechNet (2 Messages)
ADMIN: Job Postings on TechNet -Reply (1 Message)
ADMIN: Mail Storm (3 Messages)
ADMIN: Message size limit (1 Message)
ADMIN: Re: Open position (10 Messages)
ADMIN: Request to Limit Submissions (1 Message)
ADMIN: TechNet problem (1 Message)
Alloy contamination (2 Messages)
Aluminum wire bond to silver component (4 Messages)
Amendment 1 to IPC-SM-782 Revision A (1 Message)
Annular Ring (6 Messages)
Antifoam and Black Hole (2 Messages)
Aqueous LPI Masks And Compatibility With Electroless Ni/Au (1 Message)
Argentum (1 Message)
Article search (1 Message)
Asmbly - Properties Data (2 Messages)
ASS: ISHM paper Electromigration vs. SIR (1 Message)
ASSEM:Solder Balls (2 Messages)
Assemblies, MIL/IPC Comparison (1 Message)
Assembly (3 Messages)
ASSEMBLY - SOLDERLESS WRAP WIRING (1 Message)
Assembly ESD (3 Messages)
assly:baking of PBGAs (1 Message)
ASSM: Temperature-verified soldering irons (1 Message)
ASSY (1 Message)
ASSY : cleanliness specification (2 Messages)
ASSY QUESTION (1 Message)
Assy/Fab: Environmental stress screening (2 Messages)
ASSY/TEST- Salt Fog Test (4 Messages)
ASSY: BGA BALL ATTACHMENT (2 Messages)
Assy: contract manufacturing (3 Messages)
ASSY: ITT Connector Crimp (1 Message)
ASSY: Omegameter reading for RMA vs. WS flux. (4 Messages)
ASSY: Problems with 50V ceramic capacitor at Wave Solder (1 Message)
ASSY: Problems with 50V ceramic capacitor at Wave Soldering (3 Messages)
Assy: Question (15 Messages)
Assy: Question -Reply (1 Message)
Assy: Question : Pb/Ag--- THANKS !!! (1 Message)
ASSY: Re: Flexible Circuit Repair (2 Messages)
ASSY: Reliability, IPC Specs, IPC Task Groups (4 Messages)
ASSY: SOLDER ALLOYS AND BGAs (2 Messages)
ASSY: Solder Thieving for Components? (2 Messages)
ASSY: Soldermask Encroachment (5 Messages)
ASSY: SR Conformal Coating in Mfg Area (5 Messages)
ASSY: Tack time of paste vs humidity (2 Messages)
ASSY: THERMAL ADHESIVE (2 Messages)
ASSY: TQFP Standard unit (2 Messages)
Assy: Water Based VOC Flux (2 Messages)
Assy: Wavesoldering thick boards (1 Message)
Assy:Burn-In/ESS (2 Messages)
ASSY:ESD seat covers (1 Message)
Assy:ICT testing (1 Message)
Assy:LCC height control (3 Messages)
ASSY:SMD panelization (1 Message)
ASTM Individual Standard Search Form (1 Message)
ASY: Alloy contamination (4 Messages)
backplane exposure (3 Messages)
BBIT (1 Message)
Benchmarking PCB Industry (1 Message)
Benchmarking PCB Industry (fwd)[3~ (1 Message)
BGA Conference Call for Papers (1 Message)
Biferuated terminals (2 Messages)
Black Hole and developer antifoam (1 Message)
Blind vias & fine lines (8 Messages)
Blind vias & fineline (1 Message)
Boards with electroless Ni Au and Electroplated gold (1 Message)
Built-up Up Multilayer (5 Messages)
carbon ink inspection (1 Message)
Carl Tautscher Number (2 Messages)
Chip Scale package availability (1 Message)
Chip scale packaging (3 Messages)
Circuit Board/Poly-Circuits - Laser cutting (1 Message)
Circuits Assembly - NAFTA (2 Messages)
Coating over fine-pitch SMD parts (4 Messages)
COB, TAB, and CSP... (2 Messages)
Collimation or not? (6 Messages)
component identification (2 Messages)
Conf Coating Compatibility (1 Message)
Conf Coating Compatibility -Reply (2 Messages)
Connector Placement (1 Message)
Contracts for Turnkey Manufacturing (1 Message)
Controlled Impedance (1 Message)
CONVECTION REFLOW PROFILES? (2 Messages)
Copper Plating (3 Messages)
Correction RE: RUSCON Russian PCB Conference (1 Message)
corrosion (7 Messages)
CRES303 (1 Message)
Crosstalk calculations (1 Message)
current in screened silver circuits (1 Message)
Current Job Listings (2 Messages)
Defective PWB at customer's facility (4 Messages)
DES/FAB Controlled Impedance info request (1 Message)
DES/FAB Moisture and Fungus Testing (3 Messages)
DES/FAB: Moisture & Fungus testing (1 Message)
DES: ASSY: Chip Scale package availability (1 Message)
Des: BGAs (2 Messages)
DES: Crosstalk calculations (4 Messages)
DES: Cu fills on circuit layers (1 Message)
DES: Cu fills on circuit layers -Reply (1 Message)
Des: Induced Current (3 Messages)
Des: Jumpers per IPC-A-610 (1 Message)
Des: Via Hole and Pad size. (4 Messages)
Des: Via Hole and Pad size. -Reply (1 Message)
Design (bonding diagram editor for BGA pkgs.) (2 Messages)
Design Standards for BGA -Forwarded (1 Message)
Design-Rules Requirements for BGA PCB's (3 Messages)
DESIGN: Aspect Ratio versus Material choice (5 Messages)
DESIGN:Simulated twisted pair (1 Message)
Discoloration in solder plating (4 Messages)
drill and image files format (1 Message)
Drilling (1 Message)
Drilling Heads (1 Message)
Dross reducer (Kleenox) (3 Messages)
Dry Film For Deep Gold Process (5 Messages)
Dry Film For Deep Gold Process -Reply (1 Message)
electroless nickel finish (4 Messages)
Employment Advertising (2 Messages)
Enough Already !!! (1 Message)
Entek, other OSP's (1 Message)
equipment queries (1 Message)
ESD (2 Messages)
ESD Replies (1 Message)
European Joint Conference Call for Papers (1 Message)
Fab - Line Width Measurment (1 Message)
FAB / Waste Reuse (3 Messages)
FAB and ASSEM (1 Message)
Fab Oxide treatment (5 Messages)
FAB, soldermask lamination (4 Messages)
FAB, soldermask lamination -Reply (1 Message)
Fab/Assy: Class3, 1/2 tented vias (3 Messages)
FAB/DES: IPC-D-356 (1 Message)
FAB: 3 layer board with 4 oz copper (3 Messages)
FAB: Annular Ring (3 Messages)
FAB: Annular Ring - Alternate Concern (2 Messages)
FAB: DES: request for ball park costs & capabilities (1 Message)
Fab: DFM (3 Messages)
FAB: Differential Impedance (1 Message)
FAB: Discoloration in solder plating (3 Messages)
FAB: Entek, other OSP's (1 Message)
FAB: Horizontal versus vertical etching (1 Message)
FAB: innerlayer core locating slot integrity (1 Message)
Fab: IPC-6012 Conformance Testing Frequency (1 Message)
FAB: Liquid Photoresist (2 Messages)
FAB: Liquid Photoresist -Reply (3 Messages)
FAB: Palladium Plating (1 Message)
FAB: planarity of pads for gold wire bond (PBGA) (1 Message)
FAB: Prototype Supplier Recommondation (2 Messages)
FAB: Relia-via finish (1 Message)
Fab: Rivets (1 Message)
FAB: Searching for PC Based Visualisation of Gerber files in order to Quote (3 Messages)
FAB: Soldermask Encroachment (3 Messages)
FAB: We need a manufacturer for large size single sided PCBs (1 Message)
FAB:Blind vias & fine lines (2 Messages)
FAB:Laser vias (6 Messages)
FAB:Reliability test for via holes on BGA circuit (1 Message)
FAB:Roller swelling (1 Message)
FAB:Surface Preparation (1 Message)
Fatigue Life of Solder Joints (2 Messages)
Flex circuit boards (5 Messages)
Flexible Circuit Repair (1 Message)
flexing of backplanes when installing cards (2 Messages)
FR-4 material movement (5 Messages)
FR4 material (3 Messages)
Gen.:Reliability of TSOP solder joints (2 Messages)
GEN: (1 Message)
GEN: ADHESIVE SUPPLIER (2 Messages)
GEN: Cyclic Voltammetry (1 Message)
GEN: Digest (5 Messages)
GEN: Job + Label + Gerber Viewer (1 Message)
GEN: malachite (1 Message)
GEN: Replies (1 Message)
GEN: SMTA VERSION OF TechNet AVAILABLE? (2 Messages)
GEN: Soldermask Encroachment (1 Message)
GEN: Wheres the TechNet archive? (4 Messages)
Gerber viewer: GCPrevue for Win32 (1 Message)
Gold as Etch Resist (2 Messages)
Gold/Tin Lead (1 Message)
GraphiCode Shareware (1 Message)
HAR ZION - CATALOG (1 Message)
heat shielding (3 Messages)
Help Desk Friday schedule (1 Message)
High Density Interconnect (2 Messages)
Hot shortness (1 Message)
Impedance of parallel Traces (1 Message)
Industry average pincounts/PPM data (1 Message)
innerlayer core locating slot integrity (1 Message)
IPC CONFERENCE (2 Messages)
IPC Sjpecifications (1 Message)
IPC Sjpecifications -Reply (1 Message)
IPC Specifications (1 Message)
IPC-D-356 (1 Message)
IPC-MF-150 (1 Message)
IPC-SM-840 (1 Message)
IPCchat session announcement (4 Messages)
J-STD vs MILSPEC (1 Message)
j-std-002 parts (4 Messages)
James B. Bryan (1 Message)
Japan - Hong Kong Workshop in March (1 Message)
JOB (1 Message)
Job Opportunity (1 Message)
JOB POSTINGS (5 Messages)
Job Postings / Employers / My 2 Cents (1 Message)
job postings ??? (1 Message)
Job Postings on TechNet (1 Message)
Joint Technical Societies, Nepcon West, L.A. Area (1 Message)
KAMAN INSTRUMENTS KD-2300 (1 Message)
Laser Direct Imaging (1 Message)
Laser Direct Writing (3 Messages)
LCC height control (1 Message)
LEDs and SMT components mounted to polyester screened circuits (1 Message)
LEDs on Flexible Poly Circuits (1 Message)
liconix laser source (1 Message)
Line width measurement (1 Message)
Looking for 15 to 20 hp vacuum (1 Message)
Looking for a cam operator (1 Message)
Low cost flex circuits? (2 Messages)
Low meelting point or temperature solder (2 Messages)
Low temperature solder (3 Messages)
mag hydroxide in waste treatment (1 Message)
mag hydroxide in waste treatment -Reply (2 Messages)
mag hydroxide in waste treatment -Reply 2 (1 Message)
Mailstorm (3 Messages)
Mechanical fasteners for multilayer PWBs (2 Messages)
Message text (1 Message)
MIL STD. 2000 ?? (2 Messages)
MIL-I-45208A (1 Message)
misregistration test (1 Message)
Mixed Tech Assy -Reply (2 Messages)
NAFTA (1 Message)
NEED Gerber viewer with highlight capability (2 Messages)
No clean paste (2 Messages)
No IPC Technet Stuff (1 Message)
Notification: Inbound Mail Failure - Message could not be processed (1 Message)
Open position (2 Messages)
ORC exposure machine (1 Message)
OSP and solderability (1 Message)
OSP Shelf Life (3 Messages)
OSPs (1 Message)
oxide and lpi problems (FAB) (4 Messages)
packaging boards for shipment and storage (2 Messages)
panasert question (2 Messages)
PBGA Testing (1 Message)
PCB DESIGN (4 Messages)
PCB Panelization (3 Messages)
PCBs at 150°C for more than 2 hours (3 Messages)
PCBs at 150øC for more than 2 hours (1 Message)
People (4 Messages)
Pinholes - 610B vs. J-STD-001B (2 Messages)
Plating Particulates (3 Messages)
Plating rinse tank bacteria (5 Messages)
Please read this. (3 Messages)
Please read this. -Reply (2 Messages)
Propagation time formula (5 Messages)
Propagation time formula - Burkhardt reply (1 Message)
Proposed drill comp. (1 Message)
Pulse plating acid copper solutions. (1 Message)
Pulse plating acid copper solutions.Response (1 Message)
PWB Copper Surface Treatments (1 Message)
PWB manufacturing question? (1 Message)
QUAL: MIL-STD Comparison (1 Message)
qualification plan for (1 Message)
re- laser vias (1 Message)
Reed Beds for Effluent Treatment ? (1 Message)
Relibility Ratings in Standards (7 Messages)
removing RMA flux (1 Message)
Replacement for Hasl operation (5 Messages)
Reply: DES: Cu fills on circuit layers (1 Message)
Request for assistance (1 Message)
Request for information on BGA, COB, FlipChip. (3 Messages)
Resin recession (2 Messages)
Reverse Osmosis Unit for Charity (1 Message)
Rigid Laminate stabilty (3 Messages)
Router Bit (1 Message)
Routing Ultem (1 Message)
RQST, SMTA VERSION OF TECHNET AVAILABLE? (3 Messages)
RUSCON Flyer (1 Message)
Russian PCB Conference - RUSCON - (1 Message)
Saponifier waste treatment (1 Message)
Shearing Optimization (1 Message)
Shelf Life (1 Message)
SIR Guru (2 Messages)
SMART Survey Results (1 Message)
smd automatic mounting machines (1 Message)
SMT adhesives (1 Message)
SMT: Glue (1 Message)
SMT: Glue, response (1 Message)
SOLDER BALLS (on SMT) (4 Messages)
Solder pot to allow removal of copper (2 Messages)
solder recycle system (5 Messages)
Soldering (1 Message)
Soldering Stainless steel (2 Messages)
Soldering Transformers (1 Message)
Soldermask Encroachment (1 Message)
Soldermask Lamination (1 Message)
Soldermask question (1 Message)
SPC for HAL solder coating process (1 Message)
SPC OF PCB (2 Messages)
Spec for inductive components (1 Message)
Specialized IGI Ext Software Question (1 Message)
Specifications for edge condition on laminate panels (1 Message)
spindle reconditioning (1 Message)
spray fluxing, VOC free (2 Messages)
Stainless steel (2 Messages)
Standard 4 layer construction (1 Message)
standard panelization (1 Message)
Stop send me an information about technet. (1 Message)
Storage Time (1 Message)
Subj: Flux Marking Pens and No-clean Flux (1 Message)
SUBJ: Q-Corp Lead Trimmin (1 Message)
SUBJ: Q-Corp Lead Trimming & ESD (3 Messages)
subject: Flux Marking Pens & No-clean Process (2 Messages)
subscribtion (1 Message)
substitutes for HCFC 141b (1 Message)
Surface Insulation Resistance testing (1 Message)
Surface Preparation (2 Messages)
Survey: Reflow Equip. & No-clean Paste (1 Message)
Tech ? from Lucent (1 Message)
test-coupon dimension (2 Messages)
Thanks for the History lesson -- in ASSY question (1 Message)
Tinning and soldering transformers (3 Messages)
Training (7 Messages)
Transmission line formulas (1 Message)
Unidentified subject! (3 Messages)
Used Equipment (2 Messages)
Using Silver on Boards for Better Solderability (2 Messages)
Vender Advertising on TechNet (2 Messages)
Via Hole and Pad size. (2 Messages)
Vote YES (job) (4 Messages)
WATERBOURNE SOLDER MASK (3 Messages)
We need a manufacturer for large size single sided PCBs (2 Messages)
Wedge voids/Alternatives to Electroless (1 Message)
Wedge voids/Alternatives to Electroless / REPLY (1 Message)
Whereabouts of a temperature-controlled warehouse (1 Message)
Whereabouts of a temperature-controlled warehouse -Reply (1 Message)
Work smarter, not harder -Reply (1 Message)
Z axis material (2 Messages)
[iccon-misc] Internet Phone Rates (1 Message)