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Subject:	Re: Alloy contamination
From:	[log in to unmask] (Jack Crawford)
Date:	Wed, 5 Feb 1997 13:54:39 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (56 lines)

Following from the EMPF Helpline, prepared by our metallurgist John Greaves:

Increasing the Sn content will lower the liquidus and solidus, and once the
Sn content increases beyond a point (I am not sure what that point is) a
low melting binary eutectic phase will form ( eutectic SnPb, melts at
183°C).  The person to ask about this is Carol Handwerker at NIST.  Her
phone is 301-975-6158, and her email is :    [log in to unmask]


If she can't help you then your answer doesn't currently exist.

Hope this helps,

John Greaves

----------
>From: [log in to unmask]
>Date: Wed, 5 Feb 1997 07:08:08 -0600
>To: <[log in to unmask]>
>Subject: ASY: Alloy contamination
>
>
>Here's one for the metallurgist. I have been unable to locate a
>Pb93.5/Sn5/Ag1.5 (305C liquidus; 309C solidus) ternary phase diagram
>to date. I have been told that one of the technical issues is simply
>soldering to SnPb plated and/or SnPb hot-dipped coated components with
>this PbSnAg solder will realize a drop in the melting point. My
>question is how much ? Assuming, for instance a lead finish
>composition of Sn63/Pb37 with solder coat thickness of 3 to 4 mils or
>a CERDIP package with leads that are 100% Sn electroplated (200 to
>500micons).

***ALL NEW EMPF PHONE NUMBERS***

Jack Crawford, HelpLine Coordinator
Electronics Mfg. Productivity Facility
****NEW--317.655.3688
****FAX  317-655-3699
714 N Senate Ave, Suite 100
Indianapolis IN  46202-3112
VISIT OUR HOME PAGE AT: http://www.empf.org
[log in to unmask]


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