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February 1997

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Mon, 03 Feb 1997 20:55:08 -0800
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There seem to be three leaders in Pulse Plating Technology for acid 
copper solutions, I.E. Atotech/Scheering, Lea Ronal and Schlotter.
Does anyone have practical experience practical or anecdotal in using 
these solutions? Do they deliver what we all want, better distribution 
and more plating in high aspect ratio holes in thick boards 3.2 mm (120 
mil)?

Roger Hammond

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