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February 1997

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Subject:
From:
Ed Cosper <[log in to unmask]>
Date:
Wed, 26 Feb 1997 17:04:57 -0600
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Jeff,

Having dealt with the manufacturing end of double sided tented vias,  I can assure you it is a nightmare to build. The problem is that with both sides tented, escaping gasses and moisture from the holes will leave a volcano effect dimple on one or both sides during the mask curing process. This will create problems when screening on the  solder paste. The raised " dimples" will not allow the stencil to lay flush to the board. You can end up with solder paste shorts between fine pitched SMD pads. I have found that the no clean fluxes available today and a specified bare board cleanliness has solved most of our customers concerns. Another , although more costly, alternative is to design a test fixture that utilizes mechanical compression against the test pins rather that vacuum. Just my thoughts. Hope it provides some insight.

Sincerely,

Ed Cosper
Director Quality Assurance and Engineering
Graphic Electronics Inc.  

----------
From:  Jeff Seeger[SMTP:[log in to unmask]]
Sent:  Tuesday, February 25, 1997 2:02 PM
To:  [log in to unmask]
Cc:  [log in to unmask]
Subject:  Fab/Assy:  Class3, 1/2 tented vias

Good day, TechNet -

	Can't help needing to post in this time of too much traffic.
	Perhaps you'll soon see why:

	I've been asked to make a soldermask change on a very dense,
	double-active, sensor type design.  The assembly is subject
	to In-Circuit-Test, and the non-test-side clearances are such
	that the contract manufacturer is requesting that we tent the
	testpoint vias on the non-test side.  There are troubles with
	solder shorts.

	The board is HASL, 2x reflow, with hand solder, and an aqueous
	cleaning process.  The soldermask is LPI.  Volumes are modest.
	The via geometry is small, such that the current soldermask
	appears to give a reliable covering.

	The application is life support.

	My fear is that one-sided tenting will allow entrapment of
	processing chemistry and will not allow adequate cleaning.
	It would seem to me that switching to OSP or shrinking the
	via clearance to just above the finished hole size would be
	a safer alternative for long term reliability.

	Can a sometimes-too-conservative ol' design guy draw out any
	support or denial opinions?

	Thanks in advance, and regards,
-- 
 
      Jeff Seeger                             Applied CAD Knowledge Inc
      Chief Technical Officer                      Tyngsboro, MA  01879
      [log in to unmask]                               508 649 9800

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