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February 1997

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Subject:
ASSEM:Solder balls
From:
[log in to unmask] (James Edwards)
Date:
Wed, 5 Feb 1997 18:26:38 -0500
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These questions relate to using no-clean solder paste.

 1. Is solder balls/beads allowed on the finished product?
    If so, what max. diameter/number (spec. used?)

 2. Could someone explain what the JSTD-001 has to
    say about solder balls and solder beads left on bds?

 3. What has been done to reduce beading on passive parts?

    Thanks in advance for any help! 
James Edwards ([log in to unmask])
Data General Corporation
Apex, NC  27502

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