(Fwd) Inquiry on maximum temperature (3 Messages)
0201 inspection and rework tools (1 Message)
0402 pad design (1 Message)
63/37 solder paste with silver plated boards (6 Messages)
<No subject> (1 Message)
A "NEDA" Oriented label... (1 Message)
abrasive for cleaning PCB surfaces (2 Messages)
AM79C970AVIW Ethernet Controller IC (1 Message)
Anti-voiding solder paste (6 Messages)
Antwort: [TN] BGA X-ray Cross Section services - Vendors? (1 Message)
assembly spacing (3 Messages)
ASSY: Component Polarity (11 Messages)
ASSY: Component Polarity - part 2 (1 Message)
ASSY: Reflow for Through-Hole Devices (8 Messages)
bare board serialization (4 Messages)
BGA replacement (17 Messages)
BGA SMD vs NSMD (2 Messages)
BGA solder anomalies (3 Messages)
BGA Solderability (13 Messages)
BGA warpage - defects in the corners. (7 Messages)
BGA X-ray Cross Section services - Vendors? (7 Messages)
BGA's on ruggedized assemblies... (10 Messages)
Board analysis (2 Messages)
board baking (2 Messages)
Board Cost (2 Messages)
Board defect? Purple spot (5 Messages)
BOARD EDGE CLEARANCE (2 Messages)
Cell phone antenna enhancers... (6 Messages)
Cell phone antenna enhancers...NTC (41 Messages)
Cell phone antenna enhances...NTC (10 Messages)
Ceramic filled Teflon board (5 Messages)
Class 3 Solder Fillets - SMT 25 mil square pin Headers? (5 Messages)
Cleaning of No-clean Assemblies (14 Messages)
CLEARANCE FRON PWB EDGES (2 Messages)
Coating thickness (5 Messages)
conductive blind via plug (9 Messages)
Conformal Coating (22 Messages)
Conformal coating / gluing (7 Messages)
Conformal coating BGAs (11 Messages)
Crimp Tools (2 Messages)
Crimped connections (15 Messages)
Cycle Time for Solder Paste Printing (2 Messages)
D.O.E (12 Messages)
D2PAK devices (4 Messages)
Danny Harkins/CSI is out of the office. (1 Message)
Dielectric constant for cores and prepeg (1 Message)
Dielectric Constants For Core and Prepreg (5 Messages)
Dielectric material vs. Solder mask (1 Message)
DPMO benchmarking (1 Message)
dross disposal (5 Messages)
Econonic Boom (1 Message)
Electrical Isolation in dbm ? (2 Messages)
Electronics Manufacturers Association Meeting (Seattle) (1 Message)
ESD and equipment isolation (5 Messages)
Eutectic solder paste on silver plated boards (2 Messages)
ExposedCu (2 Messages)
Film Capacitors...geeze! (6 Messages)
Fire Up for IPC Annual Meeting 2002 (3 Messages)
First Article Inspection of bare boards (4 Messages)
Flip-flop panels (2 Messages)
Flux on top of PCBs from wave (4 Messages)
fLUX RESIDUE IN NO CLEAN SOLDER WIRE (3 Messages)
For Francois in case this didn't get posted to the technet (2 Messages)
FPBGA Area Ratio Question (8 Messages)
Gold Reclaim (1 Message)
good to be back (1 Message)
Guidelines or standards for number of missing unused BGA pads allowed (4 Messages)
HDI and Sanmina (12 Messages)
High lead composition solder paste and rinse water. (9 Messages)
high Tg FR4 (1 Message)
High Voltage tracking on pbc surface (12 Messages)
hole plating peel test (1 Message)
Hole routing in PCBs (7 Messages)
HTML 3.2 (1 Message)
Interesting addition to an ealier discussion (1 Message)
IPC-4552 spec for ENIG (2 Messages)
IPC-DC Boston area mtg, 21-May (1 Message)
Keeping RA and OA flux separate (4 Messages)
Locating Jay Brusse (2 Messages)
Looking for a capacitance meter (6 Messages)
Looking for A Solderability Spec (6 Messages)
Looking for A Solderability Spec - No technical content contained (5 Messages)
Looking for place who offer classes on ICT/DFT in Bay Area (1 Message)
Looking for recent PCB Reliability model (3 Messages)
Low Temp BGA Balls (4 Messages)
Mark Orlowski/PEMSTAR Inc is out of the office. (1 Message)
Mechanical Strength of Solder Joints (1 Message)
Metal core PCB's (6 Messages)
Mil spec approval (6 Messages)
no clean paste for High frequencies (3 Messages)
No Clean? (1 Message)
NTC - The Gregory's are a team now... (10 Messages)
OT Cell phone antenna enhances...NTC (2 Messages)
OT- wasn't an experiment.. (3 Messages)
Palladium Leads (11 Messages)
Palladium Leads - Flux Choices (1 Message)
Panelization sanity check needed (6 Messages)
Parts List Definition (4 Messages)
pcb design (5 Messages)
PCB MATERIAL with low OUTGASSING Characteristics.... (1 Message)
PCB materials (9 Messages)
Plant closures (3 Messages)
power traces (1 Message)
Productivity Way Up (17 Messages)
Productivity Way Up - Off topic (3 Messages)
Proposed lifting of component date code restrictions (2 Messages)
PTH Vertical Fill Requirement IPC610 Rev. C (8 Messages)
Re column grid arrays (2 Messages)
Re Hole Fill (2 Messages)
ReA610HoleFill (4 Messages)
really big boards (15 Messages)
really big boards - all humor, no tech value (4 Messages)
Recommended solder paste for a 6 layer double-sided board with CSP & BGA packages (1 Message)
Reflow Oven Recommendations (2 Messages)
Repair/Mod pads (5 Messages)
RePalladium Leads (2 Messages)
Restoring solderability (6 Messages)
resume post (1 Message)
Rod Smith/Endicott/IBM is out of the office. (1 Message)
safety committee (4 Messages)
Sanmina HDI (1 Message)
Sanminaized (1 Message)
Shear stress on laser vias (1 Message)
Side fillet requirements (9 Messages)
Solder after reflow on Gold Immersion finish (3 Messages)
Solder Defect Rates (1 Message)
Solder-UBM Separation (3 Messages)
soldermask ring v. full coat for BGA design (5 Messages)
Some Advice on PCB tols required (2 Messages)
Surrogate Post - Multiple Choice Question (1 Message)
SV: [TN] Recommended solder paste for a 6 layer double-sided board with CSP & BGA packages (1 Message)
SV: [TN] Vapor phase (6 Messages)
Tape & Reel Size for 0402 Components (2 Messages)
TechNet Cops are NOT on vacation (1 Message)
TechNet Digest - 12 May 2002 to 13 May 2002 (#2002-109) (2 Messages)
testing via holes (4 Messages)
Texas Designer's Learning Symposium - May 20 - 25, 2002 (1 Message)
The Best Opportunity in Texas!!! (1 Message)
Thickness of finish (1 Message)
Tinning SMD diodes (3 Messages)
TM650 (2 Messages)
Trough hole soldering (2 Messages)
TypeUR conformal coatings (3 Messages)
V-groove 031 thick PCB (1 Message)
Vacuum ??? (1 Message)
vacuum seal and MSD (4 Messages)
Vacuum Sealing (2 Messages)
Vacuum sealing equipment (3 Messages)
Vacuum sealing equipment... (11 Messages)
Vapor phase (14 Messages)
Via Capacitance (2 Messages)
Via Plug (1 Message)
Vias-in-pads (4 Messages)
VIRUS WARNNING !!!!!!!!!!!!!!!!!!!!!!!!!!!!!!! (2 Messages)
Voids in BGA/CSP Balls (1 Message)
Voids in fine-pitch BGAs after reflow (3 Messages)
Voids on 0.75 mm micro-BGA (2 Messages)
Wave solder re-runs/re-work (5 Messages)
Wave solder re-runs/re-work exposed copper (5 Messages)
[TN} Vacuum Sealing... (2 Messages)