TECHNET Archives

May 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 May 2002 18:11:17 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (34 lines)
Moonman

Are you sure it is I who missed the entire boat? Phil's enquiry stated
clearly:
"FR4 material, 0.090" thick, two layer, plated through hole, LPI solder
mask, submerged in Shell Diala AX dielectric oil, operating at 100kV." I
don't see anything about MLB. Has Doug been passing you a bottle of his
precious Mountain Dew?

Best regards,

Brian

Earl Moon wrote:
>
> Brian,
>
> You've missed the entire boat with this one. The single or two ply 106
> requirements is at the MLB board surface to effect foil lamination and ease
> micro-via drilling/ablation, whichever.
>
> MoonMan

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2