TECHNET Archives

May 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jeff Ferry <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 May 2002 16:20:13 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (182 lines)
Ioan,

You can follow this link for more info on the BGA rework stencils, and to
request free samples. Go to:
http://www.circuittechctr.com/products/201-3120.htm

Jeff

-----Original Message-----
From: Tempea, Ioan [mailto:[log in to unmask]]
Sent: Tuesday, May 14, 2002 2:34 PM
To: [log in to unmask]
Subject: Re: [TN] BGA replacement


Hi Jeff,

where can we buy the stencils you are talking about?

Thanks,
Ioan

> -----Original Message-----
> From: Jeff Ferry [SMTP:[log in to unmask]]
> Sent: Tuesday, May 14, 2002 1:49 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] BGA replacement
>
> Stu,
>
> We have 5 Air-Vac systems and do our share of BGA rework. Although we use
> the flux only method, we apply solder paste more often. We've found fewer
> problems when we apply solder paste. Seems to provide a little extra
> solder
> volume ensuring a more consistent joint.
>
> When we do apply solder paste, we use a new type of adhesive backed BGA
> solder paste stencil. These stencils is made from a flexible material, and
> the adhesive backing seals around each BGA pad preventing the solder paste
> from bleeding under the stencil due to the squeegee action. You get a
> consistent deposit with these stencils, and you can simply throw it away
> after it's used.
>
> Jeff Ferry
> CEO
> Circuit Technology Center, Inc.
> http://www.circuittechctr.com
> [log in to unmask]
> 978-374-5000
>
> Chairman
> IPC Repairability Committee
>
> Sign up for our Free E-mail Newsletter at:
> http://www.circuittechctr.com/general/free_email.htm
>
>
>
>
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Tuesday, May 14, 2002 10:34 AM
> To: [log in to unmask]
> Subject: [TN] BGA replacement
>
>
> The M.E.s at my company are struggling with replacing a defective plastic
> BGA.
> We have an Air Vac BGA machine. The lead M.E. feels that he needs a solder
> pad
> deposit in place before putting the replacement BGA on the board for
> reflow.
> He
> feels that he will compensate for irregular solder balls on the part and
> also
> possible surface differences on the existing pads which have been wicked
> clean
> of solder.
>
> The problem is in putting down the paste. He is teaching a technician to
> use
> a
> small medium stiff plastic stencil. The paste is applied with a wide
> chisel
> blade x-acto knife looking tool. They are getting uneven solder cakes and
> icicles between the solder deposits.
>
> I ask, is that the best way to put down paste? Is it necessary on a
> plastic
> BGA
> to put down a paste deposit? Will the stringers pull in when heated or
> will
> they
> results in shorts after reflow?
>
> Any info appreciated.
>
> Thanks,
>
> Stu Korringa
> Quality Engineer
> Smiths Industries Electronic Systems
> Grand Rapids, Mi.
>
>
> **********************************************************************
> This e-mail and any files transmitted with it are confidential and may
> be legally privileged or otherwise exempt from disclosure under
> applicable law. This e-mail and its files are intended solely for
> the individual or entity to whom they are addressed and their content
> is the property of Smiths Aerospace.  If you are not the intended
> recipient, please do not read, copy, use or disclose this communication.
> If you have received this e-mail in error please notify the e-mail
> administrator at [log in to unmask] and then delete this e-mail, its
> files and any copies.
>
> This footnote also confirms that this e-mail message has been scanned
> for the presence of known computer viruses.
> ***********************************************************************
>
> --------------------------------------------------------------------------
> --
> -----
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send e-mail to [log in to unmask]:
> SET
> Technet NOMAIL
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
> --
> -----
>
> --------------------------------------------------------------------------
> -------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send e-mail to [log in to unmask]:
> SET Technet NOMAIL
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
> -------

----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2