Jack,

In a prior life, I used solder preforms shaped like donuts to accomplish the
same thing that you're trying to do. There are several solder preform
manufacturers out there. They come in all shapes and sizes.

The process is feasible. The biggest problem that I had was assuring that
the donuts stayed where I placed them prior to soldering. Also, depending
upon their size, they can be very fragile. if you have good process control
in the soldering process, you can make it work.

Hope this helps. Good Luck.

Lee Whiteman
Senior Manufacturing Engineer
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x208
Fax: (610) 362-1290



> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Jack C. Olson
> Sent: Wednesday, May 22, 2002 11:59 AM
> To: [log in to unmask]
> Subject: [TN] ASSY: Reflow for Through-Hole Devices
>
>
> One of my colleagues here is thinking their must be some kind of solder
> ring, or collar, or donut shaped thing that you can drop over the leads of
> a (bottom mounted) through-hole device, and then when you reflow the board
> the donuts melt and form a fillet for the PTH device at the same time.
>
> Does anyone do this?
> If this is feasible, where can I find out more (and get a source for the
> solder rings)?
>
> Jack
>
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