Doug,
Paragraph 3.1.2 of J-STD-001C under General Requirements covers specialized
designs "procedures documented".
The requirement under J-STD-001C states that you need to have a properly
wetted fillet and not much more. See table 9-8.  You may have difficulty
however with the Heel filet which needs to be equal to dimension "T" (Lead
Thickness).
Happy soldering :-)


Mel Parrish
Soldering Technology International
102 Tribble Drive
Madison, AL 35758
256 705 5530
256 705 5538 Fax
[log in to unmask]
www.solderingtech.com

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Krug, Dick
Sent: Friday, May 03, 2002 9:05 AM
To: [log in to unmask]
Subject: [TN] Class 3 Solder Fillets - SMT 25 mil square pin Headers?


We assemble primarily IPC class 3 products.  We have now got some SMT
headers, using 25 mil square pins bent to form a "gull wing" style lead.
There is no way we can get a solder fillet to reach a 25 mil thick lead
thickness.  Can these be assembled to meet Class 3 requirements?  I think
I've seen something indicating a deviation from these requirements, but I
don't know where nor can I find it again.  Any suggestions?

Dick Krug
Sypris Electronics
Tampa, FL
[log in to unmask]

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