TECHNET Archives

May 2002

TechNet@IPC.ORG
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<> (97 Messages)
Ahne Oosterhof (2 Messages)
Alain Savard (2 Messages)
Alex Krstic (2 Messages)
Antonio Souza (1 Message)
Atkinson, Neil (2 Messages)
Barbara Burcham (1 Message)
Barmuta, Mike (2 Messages)
Barry Gallegos (3 Messages)
bbarr (4 Messages)
Becerra Alejandro (4 Messages)
Beerman, Dennis (1 Message)
Bev Christian (4 Messages)
Bill Decray (1 Message)
Bill Dworak (1 Message)
Bissonnette, Jean-Francois (3 Messages)
Björn Kullman (2 Messages)
Bloomquist, Ken (7 Messages)
Bob Perkins (1 Message)
Brian Ellis (12 Messages)
Brian L. Guidi (1 Message)
Brian McCrory (1 Message)
Brock Hunter (1 Message)
Brooks,Bill (2 Messages)
Brummer Chuck (1 Message)
Charles Caswell (5 Messages)
Charlie Pitarys (3 Messages)
Chris Almeras (3 Messages)
Connie Korth (1 Message)
Crepeau, Phil (5 Messages)
Creswick, Steven (1 Message)
d. terstegge (3 Messages)
D.Terstegge (1 Message)
Dan R. Johnson (13 Messages)
Dave Hillman (11 Messages)
Dave Pahlas (1 Message)
Dave Snyder (1 Message)
David Bailey (1 Message)
David Douthit (9 Messages)
David Fish (3 Messages)
David Ricketts (1 Message)
David White (3 Messages)
Debbie Schepis (1 Message)
Dehoyos, Ramon (1 Message)
Denis Lefebvre (4 Messages)
Dieselberg, Ron (2 Messages)
Don Vischulis (3 Messages)
Dougal Stewart (3 Messages)
DUTTON Phil (1 Message)
Dwight Mattix (5 Messages)
Earl Moon (102 Messages)
Ed Popielarski (2 Messages)
Ed Valentine (1 Message)
Eddie Rocha (4 Messages)
Edward S. Wheeler (3 Messages)
Eric Christison (1 Message)
Eric Dawson (4 Messages)
Fineline Circuits, Inc. (2 Messages)
Francis Sun (3 Messages)
Franck, George (2 Messages)
Francois Monette (4 Messages)
Frank Conti (1 Message)
Frank Kimmey (2 Messages)
Frank Kriesch (1 Message)
Fred Biederman (1 Message)
fullname (1 Message)
Furrow, Robert Gordon (Bob) (2 Messages)
Gaby Bogdan (5 Messages)
Gary Camac (1 Message)
Genny Gibbard (1 Message)
Geoff Layhe (1 Message)
George Milad (1 Message)
Goh Guan Chye (2 Messages)
Gordon Falconer (1 Message)
Graham Collins (5 Messages)
Graham Naisbitt (6 Messages)
Greg Scott (1 Message)
Guy Ramsey (26 Messages)
Håkan Törnqvist (EMW) (1 Message)
Henry Rekers (4 Messages)
Hinners Hans M Civ WRALC/LUGE (7 Messages)
Hogg, Blair K. (4 Messages)
Houston, Terri (4 Messages)
Jack C. Olson (4 Messages)
Jack Crawford (3 Messages)
James TerVeen (3 Messages)
Jana Carraway (3 Messages)
Jason Gregory (1 Message)
Jeff Ferry (4 Messages)
Jeff Seeger (2 Messages)
Jim Jenkins (1 Message)
Jim Lamb (1 Message)
Jim Wertin (1 Message)
jim (1 Message)
Jindra, Larry (2 Messages)
Joe Fjelstad (2 Messages)
John Parsons (1 Message)
John Perry (1 Message)
Joseph Keary (1 Message)
Joseph Spicuzza (2 Messages)
Kane, Joseph (1 Message)
Karnwal, Pankaj (1 Message)
Kasprzak, Bill (sys) USX (5 Messages)
Kathy Kuhlow (8 Messages)
Ken Carlile (1 Message)
Ken Patel (1 Message)
KIPPING, Michael (York Rd) (1 Message)
Kris Keating (2 Messages)
Krug, Dick (2 Messages)
Lambert, Katherine A. (1 Message)
Lee Whiteman (2 Messages)
Leland Woodall (2 Messages)
Linda Langley (1 Message)
Linda Woody (2 Messages)
Liviu Jurjica-Prundeanu (2 Messages)
Lou Hart (1 Message)
Lum Wee Mei (1 Message)
MA Ranganath/SMPLB/SEC/SANMAR (2 Messages)
Maddox, Allen T (1 Message)
Mair, Christian (1 Message)
Mark Charlton (1 Message)
Mark Hargreaves (1 Message)
Mark Orlowski/PEMSTAR Inc (1 Message)
Mark Roslawski (1 Message)
Marki Sasportas (1 Message)
Marsico, James (9 Messages)
Martyn Gaudion (1 Message)
Mcmaster, Michael (1 Message)
McVean (1 Message)
Mel Parrish (10 Messages)
Michael Bell (1 Message)
Mike Fenner (8 Messages)
Misner, Bruce (4 Messages)
Nancy Trumbull (2 Messages)
Neda Thrash (1 Message)
Ochenas, Tom (2 Messages)
Olivia Mc Dermott (2 Messages)
Paul Truit (1 Message)
Pelkey, Glenn (2 Messages)
Peter Barton (1 Message)
Phil Kinner (3 Messages)
Phil Nutting (16 Messages)
Phillip Hinton (2 Messages)
Race, Albert (1 Message)
Randy Bock Sr. (7 Messages)
Reid, Lorraine (1 Message)
rgrant (6 Messages)
Richard Carruth (1 Message)
Richard Hamilton (1 Message)
Rick Thompson (1 Message)
Rick (1 Message)
Rob Legg (2 Messages)
Robert B. Denbo (3 Messages)
Robert Meston (1 Message)
Rod Smith (1 Message)
Roger Stoops (1 Message)
Roland Jaquet (1 Message)
Rudy Sedlak (2 Messages)
Russell Burdick (2 Messages)
ryan (1 Message)
Sauer, Steven T. (10 Messages)
Scott Kramer (1 Message)
Scott Westheimer (1 Message)
Seth Goodman (9 Messages)
Sherif Refaat (1 Message)
Stefano Riccardi (2 Messages)
Stephannie Caliendo (1 Message)
Steve Kelly (1 Message)
Steve Owen (2 Messages)
Strickland, Mark (1 Message)
Tegehall Per-Erik (1 Message)
Tempea, Ioan (5 Messages)
Tim McQuay (1 Message)
Tom Buschor (2 Messages)
Tom Parkinson - Quality System Manager (1 Message)
Tom Waznis (1 Message)
tony steinke (4 Messages)
Torres, Roberto (3 Messages)
Tostevin, Bruce (1 Message)
Vandendolder, Ron (2 Messages)
WEEKES, MICHAEL HS-SNS (7 Messages)
Wenger, George M. (4 Messages)
Werner Engelmaier (17 Messages)
William Sullivan (4 Messages)
Woody, Linda L (1 Message)
Yu, Rudolph (2 Messages)
Zweigart, Siegmund (2 Messages)

Subject

From Sorted by Sender, Alphabetically

Date
New Sender <>
Re:
<>
Thu, 30 May 2002 08:39:17 +0800
AM79C970AVIW Ethernet Controller IC
<>
Wed, 22 May 2002 13:22:43 +0800
Re: Anti-voiding solder paste
<>
Tue, 28 May 2002 08:56:26 EDT
assembly spacing
<>
Mon, 20 May 2002 17:36:02 EDT
Re: ASSY: Component Polarity
<>
Thu, 30 May 2002 11:18:49 EDT
Re: ASSY: Component Polarity
<>
Thu, 30 May 2002 23:27:16 EDT
Re: ASSY: Reflow for Through-Hole Devices
<>
Wed, 22 May 2002 18:32:49 EDT
Re: ASSY: Reflow for Through-Hole Devices
<>
Thu, 23 May 2002 08:50:20 EDT
Re: bare board serialization
<>
Thu, 30 May 2002 08:44:30 +0800
BGA replacement
<>
Tue, 14 May 2002 10:34:19 -0400
Re: BGA replacement
<>
Wed, 15 May 2002 08:24:20 +0800
Re: BGA SMD vs NSMD
<>
Wed, 29 May 2002 10:47:59 EDT
Re: BGA solder anomalies
<>
Wed, 1 May 2002 12:08:02 EDT
Re: BGA Solderability
<>
Tue, 28 May 2002 11:01:46 EDT
Re: BGA Solderability
<>
Tue, 28 May 2002 11:21:38 EDT
Re: BGA X-ray Cross Section services - Vendors?
<>
Thu, 16 May 2002 16:01:51 EDT
Re: BGA X-ray Cross Section services - Vendors?
<>
Fri, 17 May 2002 09:10:21 +0800
Re: BGA X-ray Cross Section services - Vendors?
<>
Fri, 17 May 2002 17:39:12 EDT
Re: BGA X-ray Cross Section services - Vendors?
<>
Sun, 19 May 2002 00:17:15 EDT
BGA's on ruggedized assemblies...
<>
Tue, 14 May 2002 17:08:59 EDT
Re: BGA's on ruggedized assemblies...
<>
Wed, 15 May 2002 09:01:22 +0800
Re: BGA's on ruggedized assemblies...
<>
Thu, 16 May 2002 10:35:39 +0800
Re: BOARD EDGE CLEARANCE
<>
Wed, 8 May 2002 09:11:22 -0700
Cell phone antenna enhancers...
<>
Wed, 29 May 2002 21:56:29 EDT
Re: Cell phone antenna enhancers...NTC
<>
Thu, 30 May 2002 15:23:25 -0500
Re: Cell phone antenna enhancers...NTC
<>
Thu, 30 May 2002 17:26:47 EDT
Re: Cell phone antenna enhancers...NTC
<>
Thu, 30 May 2002 18:07:14 EDT
Re: Cleaning of No-clean Assemblies
<>
Thu, 9 May 2002 11:59:16 EDT
Re: Cleaning of No-clean Assemblies
<>
Thu, 9 May 2002 15:29:07 -0500
Re: Cleaning of No-clean Assemblies
<>
Mon, 13 May 2002 07:12:24 -0500
Re: conductive blind via plug
<>
Thu, 30 May 2002 08:36:40 +0800
Re: Conformal Coating
<>
Fri, 3 May 2002 07:53:30 -0600
Re: Conformal Coating
<>
Wed, 15 May 2002 08:28:11 -0500
Re: Conformal Coating
<>
Wed, 15 May 2002 15:48:58 EDT
Re: Conformal Coating
<>
Fri, 17 May 2002 17:46:01 EDT
Re: Conformal coating / gluing
<>
Fri, 24 May 2002 07:58:55 +0800
Re: Conformal coating / gluing
<>
Tue, 28 May 2002 11:31:52 EDT
Re: Conformal coating BGAs
<>
Tue, 21 May 2002 13:33:32 +0800
Re: Conformal coating BGAs
<>
Tue, 21 May 2002 08:05:03 -0500
Re: Conformal coating BGAs
<>
Wed, 22 May 2002 09:22:27 +0800
Crimp Tools
<>
Wed, 1 May 2002 15:18:27 -0600
Crimped connections
<>
Thu, 16 May 2002 07:45:58 -0400
Re: Crimped connections
<>
Thu, 16 May 2002 11:10:59 -0400
Re: Cycle Time for Solder Paste Printing
<>
Tue, 7 May 2002 11:05:55 -0700
Re: D.O.E
<>
Wed, 15 May 2002 16:24:43 -0500
Danny Harkins/CSI is out of the office.
<>
Tue, 28 May 2002 01:00:45 -0400
Re: Dielectric Constants For Core and Prepreg
<>
Tue, 28 May 2002 09:46:21 EDT
ExposedCu
<>
Tue, 7 May 2002 11:53:15 EDT
Film Capacitors...geeze!
<>
Thu, 23 May 2002 21:51:58 EDT
Re: Film Capacitors...geeze!
<>
Fri, 24 May 2002 07:04:12 -0500
Re: Film Capacitors...geeze!
<>
Fri, 24 May 2002 08:58:50 EDT
Re: Film Capacitors...geeze!
<>
Fri, 24 May 2002 11:44:43 EDT
Re: Fire Up for IPC Annual Meeting 2002
<>
Thu, 23 May 2002 14:19:56 -0500
Gold Reclaim
<>
Tue, 21 May 2002 12:27:46 -0400
Re: High lead composition solder paste and rinse water.
<>
Wed, 1 May 2002 14:10:55 -0500
Re: High Voltage tracking on pbc surface
<>
Thu, 16 May 2002 08:02:54 -0500
Re: High Voltage tracking on pbc surface
<>
Thu, 16 May 2002 11:36:57 -0500
Re: HTML 3.2
<>
Mon, 6 May 2002 13:44:20 EDT
Re: Looking for a capacitance meter
<>
Wed, 22 May 2002 08:27:39 -0500
Re: Looking for A Solderability Spec
<>
Fri, 17 May 2002 16:17:44 -0500
Re: Looking for A Solderability Spec - No technical content contained
<>
Mon, 20 May 2002 15:23:52 EDT
Re: Low Temp BGA Balls
<>
Mon, 6 May 2002 20:28:37 EDT
Re: Low Temp BGA Balls
<>
Tue, 7 May 2002 12:15:02 +0800
Re: Metal core PCB's
<>
Fri, 24 May 2002 12:13:58 EDT
Re: Mil spec approval
<>
Fri, 3 May 2002 15:03:07 EDT
Re: no clean paste for High frequencies
<>
Fri, 24 May 2002 07:32:53 -0500
Re: no clean paste for High frequencies
<>
Tue, 28 May 2002 08:20:42 EDT
NTC - The Gregory's are a team now...
<>
Thu, 30 May 2002 19:14:48 EDT
OT- wasn't an experiment..
<>
Fri, 31 May 2002 22:26:03 EDT
Re: Palladium Leads
<>
Thu, 9 May 2002 08:36:16 EDT
Re: Palladium Leads
<>
Thu, 9 May 2002 11:26:45 EDT
Re: Palladium Leads - Flux Choices
<>
Mon, 13 May 2002 08:36:55 +0800
Re: Parts List Definition
<>
Tue, 7 May 2002 16:19:01 +0800
Re: PCB materials
<>
Tue, 28 May 2002 11:10:32 EDT
Re: PCB materials
<>
Tue, 28 May 2002 11:17:12 EDT
Re: PCB materials
<>
Tue, 28 May 2002 11:28:28 EDT
PTH Vertical Fill Requirement IPC610 Rev. C
<>
Thu, 9 May 2002 11:43:48 -0700
Re Hole Fill
<>
Mon, 20 May 2002 21:58:17 EDT
ReA610HoleFill
<>
Sat, 11 May 2002 16:36:24 EDT
Repair/Mod pads
<>
Tue, 21 May 2002 20:26:00 +0800
RePalladium Leads
<>
Thu, 9 May 2002 09:41:15 EDT
safety committee
<>
Thu, 2 May 2002 13:11:23 -0500
Re: Side fillet requirements
<>
Tue, 21 May 2002 13:41:17 +0800
Solder-UBM Separation
<>
Thu, 16 May 2002 10:39:09 +0800
Re: Solder-UBM Separation
<>
Thu, 16 May 2002 12:36:37 +0800
Re: soldermask ring v. full coat for BGA design
<>
Thu, 30 May 2002 20:57:48 EDT
V-groove 031 thick PCB
<>
Mon, 6 May 2002 10:08:19 -0700
Re: vacuum seal and MSD
<>
Wed, 1 May 2002 20:39:32 EDT
Re: Vacuum sealing equipment...
<>
Wed, 1 May 2002 08:39:44 EDT
Re: Vapor phase
<>
Tue, 28 May 2002 16:06:12 EDT
Re: Vapor phase
<>
Wed, 29 May 2002 10:29:29 -0400
Via Capacitance
<>
Mon, 20 May 2002 11:57:38 +0200
Voids on 0.75 mm micro-BGA
<>
Wed, 8 May 2002 10:14:39 -0700
Re: Wave solder re-runs/re-work
<>
Fri, 3 May 2002 08:05:25 +0800
Re: Wave solder re-runs/re-work
<>
Fri, 3 May 2002 23:58:21 EDT
Re: Wave solder re-runs/re-work exposed copper
<>
Mon, 6 May 2002 13:39:17 +0800
[TN} Vacuum Sealing...
<>
Wed, 1 May 2002 22:52:44 EDT
New Sender Ahne Oosterhof
Re: FPBGA Area Ratio Question
Ahne Oosterhof
Wed, 29 May 2002 15:16:38 -0700
Re: FPBGA Area Ratio Question
Ahne Oosterhof
Wed, 29 May 2002 15:39:48 -0700
New Sender Alain Savard
Re: conductive blind via plug
Alain Savard
Wed, 29 May 2002 15:18:23 -0400
Re: really big boards
Alain Savard
Fri, 17 May 2002 15:21:51 -0400
New Sender Alex Krstic
Re: 63/37 solder paste with silver plated boards
Alex Krstic
Thu, 9 May 2002 13:15:49 -0600
Re: RePalladium Leads
Alex Krstic
Thu, 9 May 2002 13:06:00 -0600
New Sender Antonio Souza
BGA solder anomalies
Antonio Souza
Wed, 1 May 2002 10:17:49 -0500
New Sender Atkinson, Neil
Re: ASSY: Reflow for Through-Hole Devices
Atkinson, Neil
Fri, 24 May 2002 08:15:25 +0100
Re: really big boards
Atkinson, Neil
Fri, 24 May 2002 07:43:44 +0100
New Sender Barbara Burcham
Texas Designer's Learning Symposium - May 20 - 25, 2002
Barbara Burcham
Wed, 8 May 2002 13:26:08 -0500
New Sender Barmuta, Mike
Re: Looking for a capacitance meter
Barmuta, Mike
Wed, 22 May 2002 07:49:13 -0700
Re: really big boards
Barmuta, Mike
Fri, 17 May 2002 09:40:11 -0700
New Sender Barry Gallegos
Re: assembly spacing
Barry Gallegos
Tue, 21 May 2002 06:58:48 -0600
D.O.E
Barry Gallegos
Wed, 15 May 2002 13:50:47 -0600
Re: D.O.E
Barry Gallegos
Wed, 15 May 2002 15:43:39 -0600
New Sender bbarr
FPBGA Area Ratio Question
bbarr
Wed, 29 May 2002 11:40:15 -0400
Re: FPBGA Area Ratio Question
bbarr
Wed, 29 May 2002 14:40:08 -0400
Re: FPBGA Area Ratio Question
bbarr
Wed, 29 May 2002 17:44:07 -0400
Vacuum Sealing
bbarr
Wed, 1 May 2002 11:05:46 -0400
New Sender Becerra Alejandro
Cycle Time for Solder Paste Printing
Becerra Alejandro
Tue, 7 May 2002 08:02:47 -0500
Re: FPBGA Area Ratio Question
Becerra Alejandro
Wed, 29 May 2002 12:41:06 -0500
Re: FPBGA Area Ratio Question
Becerra Alejandro
Wed, 29 May 2002 16:01:13 -0500
Tape & Reel Size for 0402 Components
Becerra Alejandro
Thu, 16 May 2002 13:00:35 -0500
New Sender Beerman, Dennis
Re: BGA Solderability
Beerman, Dennis
Thu, 23 May 2002 10:08:57 -0500
New Sender Bev Christian
Dielectric material vs. Solder mask
Bev Christian
Fri, 17 May 2002 15:39:26 -0400
Re: High lead composition solder paste and rinse water.
Bev Christian
Wed, 1 May 2002 17:13:02 -0400
Re: Palladium Leads
Bev Christian
Thu, 9 May 2002 07:59:23 -0400
Thickness of finish
Bev Christian
Wed, 1 May 2002 17:15:04 -0400
New Sender Bill Decray
Re: Board defect? Purple spot
Bill Decray
Thu, 16 May 2002 15:55:34 -0400
New Sender Bill Dworak
VIRUS WARNNING !!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!
Bill Dworak
Mon, 6 May 2002 00:06:36 -0700
New Sender Bissonnette, Jean-Francois
Board analysis
Bissonnette, Jean-Francois
Tue, 28 May 2002 10:20:48 -0400
Re: Cell phone antenna enhancers...NTC
Bissonnette, Jean-Francois
Thu, 30 May 2002 15:03:43 -0400
dross disposal
Bissonnette, Jean-Francois
Wed, 15 May 2002 10:33:30 -0400
New Sender Björn Kullman
SV: [TN] Recommended solder paste for a 6 layer double-sided board with CSP & BGA packages
Björn Kullman
Tue, 14 May 2002 08:31:25 +0200
SV: [TN] Vapor phase
Björn Kullman
Mon, 27 May 2002 08:57:25 +0200
New Sender Bloomquist, Ken
Re: Cell phone antenna enhancers...NTC
Bloomquist, Ken
Thu, 30 May 2002 10:29:45 -0700
Re: Cell phone antenna enhancers...NTC
Bloomquist, Ken
Thu, 30 May 2002 13:15:27 -0700
Re: Conformal Coating
Bloomquist, Ken
Fri, 3 May 2002 07:21:35 -0700
Re: dross disposal
Bloomquist, Ken
Wed, 15 May 2002 09:45:55 -0700
Electronics Manufacturers Association Meeting (Seattle)
Bloomquist, Ken
Thu, 9 May 2002 06:54:56 -0700
Re: ExposedCu
Bloomquist, Ken
Tue, 7 May 2002 11:35:18 -0700
Re: Restoring solderability
Bloomquist, Ken
Wed, 15 May 2002 13:58:22 -0700
New Sender Bob Perkins
Re: Vias-in-pads
Bob Perkins
Fri, 10 May 2002 08:27:12 -0700
New Sender Brian Ellis
Re: Cleaning of No-clean Assemblies
Brian Ellis
Thu, 9 May 2002 09:47:59 +0300
Re: D.O.E
Brian Ellis
Thu, 16 May 2002 10:09:41 +0300
Re: fLUX RESIDUE IN NO CLEAN SOLDER WIRE
Brian Ellis
Fri, 31 May 2002 11:56:58 +0300
Re: High Voltage tracking on pbc surface
Brian Ellis
Thu, 16 May 2002 10:05:27 +0300
Re: High Voltage tracking on pbc surface
Brian Ellis
Thu, 16 May 2002 17:37:52 +0300
Re: High Voltage tracking on pbc surface
Brian Ellis
Thu, 16 May 2002 18:11:17 +0300
Re: Keeping RA and OA flux separate
Brian Ellis
Tue, 21 May 2002 18:18:41 +0300
Re: SV: [TN] Vapor phase
Brian Ellis
Mon, 27 May 2002 12:10:38 +0300
Re: Vacuum sealing equipment...
Brian Ellis
Wed, 1 May 2002 10:18:32 +0300
Re: Vapor phase
Brian Ellis
Fri, 24 May 2002 14:56:50 +0300
Re: Vapor phase
Brian Ellis
Sat, 25 May 2002 09:06:27 +0300
Re: Vapor phase
Brian Ellis
Mon, 27 May 2002 12:12:07 +0300
New Sender Brian L. Guidi
Re: Panelization sanity check needed
Brian L. Guidi
Wed, 8 May 2002 08:05:15 -0400
New Sender Brian McCrory
Re: TM650
Brian McCrory
Thu, 23 May 2002 16:32:38 -0700
New Sender Brock Hunter
Re: TechNet Digest - 12 May 2002 to 13 May 2002 (#2002-109)
Brock Hunter
Tue, 14 May 2002 02:25:06 -0400
New Sender Brooks,Bill
Re: pcb design
Brooks,Bill
Mon, 20 May 2002 09:28:18 -0700
Solder after reflow on Gold Immersion finish
Brooks,Bill
Thu, 9 May 2002 12:09:54 -0700
New Sender Brummer Chuck
Re: really big boards
Brummer Chuck
Fri, 17 May 2002 09:40:04 -0700
New Sender Charles Caswell
Re: Crimped connections
Charles Caswell
Thu, 16 May 2002 08:58:24 -0500
Re: dross disposal
Charles Caswell
Wed, 15 May 2002 10:46:55 -0500
Re: Flux on top of PCBs from wave
Charles Caswell
Thu, 9 May 2002 10:43:56 -0500
Re: Vacuum sealing equipment...
Charles Caswell
Wed, 1 May 2002 07:09:14 -0500
Re: Vacuum sealing equipment...
Charles Caswell
Wed, 1 May 2002 07:10:43 -0500
New Sender Charlie Pitarys
Re: Cleaning of No-clean Assemblies
Charlie Pitarys
Thu, 9 May 2002 10:09:17 -0400
High lead composition solder paste and rinse water.
Charlie Pitarys
Wed, 1 May 2002 11:51:48 -0400
Re: High lead composition solder paste and rinse water.
Charlie Pitarys
Thu, 2 May 2002 08:47:13 -0400
New Sender Chris Almeras
Re: Conformal Coating
Chris Almeras
Thu, 2 May 2002 12:28:38 -0500
Re: Conformal Coating
Chris Almeras
Fri, 3 May 2002 08:42:35 -0500
Re: TypeUR conformal coatings
Chris Almeras
Wed, 22 May 2002 15:18:07 -0500
New Sender Connie Korth
Re: Conformal coating / gluing
Connie Korth
Thu, 23 May 2002 15:09:53 -0500
New Sender Crepeau, Phil
Re: (Fwd) Inquiry on maximum temperature
Crepeau, Phil
Wed, 22 May 2002 08:02:50 -0700
Re: D.O.E
Crepeau, Phil
Wed, 15 May 2002 14:41:04 -0700
Re: D.O.E
Crepeau, Phil
Wed, 15 May 2002 14:42:02 -0700
Re: D.O.E
Crepeau, Phil
Thu, 16 May 2002 07:07:13 -0700
Re: Productivity Way Up
Crepeau, Phil
Wed, 8 May 2002 11:47:12 -0700
New Sender Creswick, Steven
Re: Vacuum Sealing
Creswick, Steven
Wed, 1 May 2002 14:26:01 -0400
New Sender d. terstegge
Anti-voiding solder paste
d. terstegge
Tue, 28 May 2002 12:37:24 +0200
Re: Cleaning of No-clean Assemblies
d. terstegge
Mon, 13 May 2002 15:34:39 +0200
First Article Inspection of bare boards
d. terstegge
Tue, 14 May 2002 10:34:39 +0200
New Sender D.Terstegge
Re: Vacuum sealing equipment...
D.Terstegge
Thu, 2 May 2002 18:37:00 +0200
New Sender Dan R. Johnson
Re: BGA replacement
Dan R. Johnson
Wed, 15 May 2002 08:21:23 -0700
Re: Cell phone antenna enhancers...NTC
Dan R. Johnson
Fri, 31 May 2002 10:13:52 -0700
Re: Cell phone antenna enhancers...NTC
Dan R. Johnson
Fri, 31 May 2002 11:50:20 -0700
Re: Crimped connections
Dan R. Johnson
Thu, 16 May 2002 08:00:35 -0700
Re: Crimped connections
Dan R. Johnson
Thu, 16 May 2002 10:08:21 -0700
hole plating peel test
Dan R. Johnson
Wed, 1 May 2002 16:36:32 -0700
Re: Looking for a capacitance meter
Dan R. Johnson
Tue, 21 May 2002 16:21:01 -0700
Re: Parts List Definition
Dan R. Johnson
Tue, 7 May 2002 08:03:27 -0700
Re: pcb design
Dan R. Johnson
Mon, 20 May 2002 12:06:51 -0700
Re: Productivity Way Up
Dan R. Johnson
Tue, 7 May 2002 10:01:40 -0700
Re: Productivity Way Up
Dan R. Johnson
Tue, 7 May 2002 12:55:09 -0700
Re: safety committee
Dan R. Johnson
Thu, 2 May 2002 13:14:47 -0700
Re: Vacuum sealing equipment...
Dan R. Johnson
Wed, 1 May 2002 08:03:23 -0700
New Sender Dave Hillman
Re: BGA's on ruggedized assemblies...
Dave Hillman
Wed, 15 May 2002 09:00:59 -0500
Re: Ceramic filled Teflon board
Dave Hillman
Fri, 10 May 2002 11:25:18 -0500
Re: Conformal coating BGAs
Dave Hillman
Tue, 21 May 2002 17:22:50 -0500
Looking for A Solderability Spec
Dave Hillman
Fri, 17 May 2002 13:18:08 -0500
Re: Looking for A Solderability Spec - No technical content contained
Dave Hillman
Fri, 17 May 2002 16:31:28 -0500
Re: Looking for A Solderability Spec - No technical content contained
Dave Hillman
Mon, 20 May 2002 16:43:23 -0500
Re: Palladium Leads
Dave Hillman
Fri, 10 May 2002 14:22:47 -0500
Re column grid arrays
Dave Hillman
Fri, 31 May 2002 15:05:42 -0500
Re: really big boards - all humor, no tech value
Dave Hillman
Fri, 17 May 2002 13:07:04 -0500
Re: Restoring solderability
Dave Hillman
Thu, 16 May 2002 10:13:55 -0500
Re: Solder after reflow on Gold Immersion finish
Dave Hillman
Fri, 10 May 2002 14:33:21 -0500
New Sender Dave Pahlas
Re: FPBGA Area Ratio Question
Dave Pahlas
Wed, 29 May 2002 17:00:33 -0400
New Sender Dave Snyder
Re: Cell phone antenna enhances...NTC
Dave Snyder
Fri, 31 May 2002 10:45:56 -0700
New Sender David Bailey
Metal core PCB's
David Bailey
Fri, 24 May 2002 15:01:35 +1000
New Sender David Douthit
Re: BGA replacement
David Douthit
Wed, 15 May 2002 10:12:50 -0700
Re: Cleaning of No-clean Assemblies
David Douthit
Wed, 8 May 2002 16:57:59 -0700
Re: Coating thickness
David Douthit
Thu, 30 May 2002 21:41:40 -0700
Re: Conformal Coating
David Douthit
Fri, 17 May 2002 11:44:37 -0700
Re: Flux on top of PCBs from wave
David Douthit
Thu, 9 May 2002 10:27:11 -0700
Re: HDI and Sanmina
David Douthit
Mon, 6 May 2002 10:01:26 -0700
Re: Locating Jay Brusse
David Douthit
Mon, 6 May 2002 22:12:01 -0700
Re: PTH Vertical Fill Requirement IPC610 Rev. C
David Douthit
Fri, 10 May 2002 05:41:05 -0700
Re: Wave solder re-runs/re-work
David Douthit
Thu, 2 May 2002 22:08:04 -0700
New Sender David Fish
Re: Looking for A Solderability Spec
David Fish
Fri, 17 May 2002 16:29:01 -0700
Re: Restoring solderability
David Fish
Wed, 15 May 2002 15:32:40 -0700
Re: Solder after reflow on Gold Immersion finish
David Fish
Sun, 12 May 2002 09:17:30 -0700
New Sender David Ricketts
Re: Side fillet requirements
David Ricketts
Tue, 21 May 2002 11:22:20 -0700
New Sender David White
Re: Class 3 Solder Fillets - SMT 25 mil square pin Headers?
David White
Fri, 3 May 2002 16:17:33 -0400
Flux on top of PCBs from wave
David White
Thu, 9 May 2002 10:33:02 -0400
Wave solder re-runs/re-work
David White
Thu, 2 May 2002 11:14:20 -0400
New Sender Debbie Schepis
IPC-4552 spec for ENIG
Debbie Schepis
Mon, 13 May 2002 08:52:38 -0400
New Sender Dehoyos, Ramon
Conformal Coating
Dehoyos, Ramon
Tue, 14 May 2002 11:47:54 -0700
New Sender Denis Lefebvre
BGA Solderability
Denis Lefebvre
Thu, 23 May 2002 07:09:38 -0700
OT Cell phone antenna enhances...NTC
Denis Lefebvre
Fri, 31 May 2002 15:38:31 -0700
Re: pcb design
Denis Lefebvre
Mon, 20 May 2002 10:01:49 -0700
Vias-in-pads
Denis Lefebvre
Tue, 7 May 2002 12:15:40 -0700
New Sender Dieselberg, Ron
<No subject>
Dieselberg, Ron
Wed, 29 May 2002 13:56:47 -0400
Re: Conformal Coating
Dieselberg, Ron
Fri, 17 May 2002 10:16:06 -0400
New Sender Don Vischulis
Re: conductive blind via plug
Don Vischulis
Wed, 29 May 2002 13:19:38 -0500
Re: First Article Inspection of bare boards
Don Vischulis
Tue, 14 May 2002 07:19:51 -0500
Re: Hole routing in PCBs
Don Vischulis
Wed, 1 May 2002 15:10:42 -0500
New Sender Dougal Stewart
Re: bare board serialization
Dougal Stewart
Thu, 30 May 2002 09:27:18 +0100
Re: High Voltage tracking on pbc surface
Dougal Stewart
Thu, 16 May 2002 20:58:54 +0100
Re: really big boards
Dougal Stewart
Wed, 22 May 2002 16:36:33 +0100
New Sender DUTTON Phil
Re: Cleaning of No-clean Assemblies
DUTTON Phil
Thu, 9 May 2002 11:28:28 +1000
New Sender Dwight Mattix
Re: HDI and Sanmina
Dwight Mattix
Mon, 6 May 2002 15:55:52 -0700
Re: HDI and Sanmina
Dwight Mattix
Mon, 6 May 2002 16:07:08 -0700
Re: really big boards
Dwight Mattix
Fri, 17 May 2002 12:11:25 -0700
Re: testing via holes
Dwight Mattix
Fri, 17 May 2002 12:06:13 -0700
Re: Via Plug
Dwight Mattix
Thu, 2 May 2002 10:55:02 -0700
New Sender Earl Moon
Re: 63/37 solder paste with silver plated boards
Earl Moon
Thu, 9 May 2002 12:42:22 -0500
Re: 63/37 solder paste with silver plated boards
Earl Moon
Thu, 9 May 2002 12:43:38 -0500
Re: Anti-voiding solder paste
Earl Moon
Tue, 28 May 2002 07:35:14 -0500
Re: ASSY: Component Polarity
Earl Moon
Thu, 30 May 2002 08:42:19 -0500
Re: ASSY: Component Polarity
Earl Moon
Thu, 30 May 2002 23:52:33 -0500
Re: ASSY: Component Polarity
Earl Moon
Fri, 31 May 2002 07:57:24 -0500
Re: BGA replacement
Earl Moon
Tue, 14 May 2002 10:20:48 -0500
Re: BGA replacement
Earl Moon
Tue, 14 May 2002 11:32:05 -0500
Re: BGA replacement
Earl Moon
Wed, 15 May 2002 11:06:00 -0500
Re: BGA replacement
Earl Moon
Wed, 15 May 2002 12:10:11 -0500
Re: BGA Solderability
Earl Moon
Thu, 23 May 2002 12:05:26 -0500
Re: BGA Solderability
Earl Moon
Thu, 23 May 2002 14:18:38 -0500
Re: BGA Solderability
Earl Moon
Thu, 23 May 2002 14:21:44 -0500
Re: BGA Solderability
Earl Moon
Tue, 28 May 2002 11:42:09 -0500
Re: BGA warpage - defects in the corners.
Earl Moon
Sat, 18 May 2002 12:01:29 -0500
Re: BGA's on ruggedized assemblies...
Earl Moon
Thu, 16 May 2002 05:34:18 -0500
Re: Cell phone antenna enhancers...
Earl Moon
Thu, 30 May 2002 08:36:39 -0500
Re: Cell phone antenna enhancers...
Earl Moon
Thu, 30 May 2002 10:16:46 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Thu, 30 May 2002 13:50:46 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Thu, 30 May 2002 14:23:19 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Thu, 30 May 2002 15:38:44 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Thu, 30 May 2002 15:12:22 -0600
Re: Cell phone antenna enhancers...NTC
Earl Moon
Thu, 30 May 2002 16:11:04 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Thu, 30 May 2002 16:45:47 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Thu, 30 May 2002 17:08:26 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Thu, 30 May 2002 17:18:39 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Fri, 31 May 2002 07:51:40 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Fri, 31 May 2002 08:04:43 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Fri, 31 May 2002 08:24:14 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Fri, 31 May 2002 08:28:17 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Fri, 31 May 2002 09:05:47 -0600
Re: Cell phone antenna enhancers...NTC
Earl Moon
Fri, 31 May 2002 10:12:09 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Fri, 31 May 2002 11:43:24 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Fri, 31 May 2002 12:32:29 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Fri, 31 May 2002 14:14:46 -0500
Re: Cell phone antenna enhancers...NTC
Earl Moon
Fri, 31 May 2002 19:07:54 -0500
Re: Cell phone antenna enhances...NTC
Earl Moon
Fri, 31 May 2002 11:37:59 -0500
Re: Cell phone antenna enhances...NTC
Earl Moon
Fri, 31 May 2002 12:27:51 -0500
Re: Cell phone antenna enhances...NTC
Earl Moon
Fri, 31 May 2002 12:58:40 -0500
Re: Cell phone antenna enhances...NTC
Earl Moon
Fri, 31 May 2002 15:30:39 -0500
Re: Ceramic filled Teflon board
Earl Moon
Thu, 9 May 2002 12:03:40 -0500
Re: conductive blind via plug
Earl Moon
Wed, 29 May 2002 15:14:44 -0500
Re: Dielectric Constants For Core and Prepreg
Earl Moon
Thu, 2 May 2002 12:12:14 -0500
Econonic Boom
Earl Moon
Fri, 31 May 2002 10:06:44 -0500
Re: ESD and equipment isolation
Earl Moon
Thu, 30 May 2002 14:27:06 -0500
For Francois in case this didn't get posted to the technet
Earl Moon
Thu, 2 May 2002 10:50:56 -0500
Re: For Francois in case this didn't get posted to the technet
Earl Moon
Thu, 2 May 2002 11:20:19 -0500
Re: Guidelines or standards for number of missing unused BGA pads allowed
Earl Moon
Wed, 8 May 2002 12:41:39 -0500
HDI and Sanmina
Earl Moon
Mon, 6 May 2002 09:58:55 -0500
Re: HDI and Sanmina
Earl Moon
Mon, 6 May 2002 12:30:56 -0500
Re: HDI and Sanmina
Earl Moon
Mon, 6 May 2002 13:09:21 -0500
Re: HDI and Sanmina
Earl Moon
Mon, 6 May 2002 19:07:43 -0500
Re: HDI and Sanmina
Earl Moon
Tue, 7 May 2002 06:13:18 -0500
Re: High Voltage tracking on pbc surface
Earl Moon
Thu, 16 May 2002 08:18:56 -0500
Re: High Voltage tracking on pbc surface
Earl Moon
Thu, 16 May 2002 09:54:28 -0500
Re: High Voltage tracking on pbc surface
Earl Moon
Thu, 16 May 2002 11:16:47 -0400
Re: Looking for A Solderability Spec
Earl Moon
Sat, 18 May 2002 12:06:24 -0500
Re: Looking for A Solderability Spec - No technical content contained
Earl Moon
Sat, 18 May 2002 11:52:34 -0500
Re: Looking for A Solderability Spec - No technical content contained
Earl Moon
Sat, 18 May 2002 11:54:42 -0500
Re: Metal core PCB's
Earl Moon
Fri, 24 May 2002 14:06:04 -0500
Re: Mil spec approval
Earl Moon
Thu, 2 May 2002 14:24:09 -0500
Re: NTC - The Gregory's are a team now...
Earl Moon
Fri, 31 May 2002 01:06:17 -0500
Re: NTC - The Gregory's are a team now...
Earl Moon
Fri, 31 May 2002 08:43:10 -0500
Re: NTC - The Gregory's are a team now...
Earl Moon
Fri, 31 May 2002 09:01:36 -0600
Re: NTC - The Gregory's are a team now...
Earl Moon
Fri, 31 May 2002 11:47:21 -0500
Re: NTC - The Gregory's are a team now...
Earl Moon
Fri, 31 May 2002 12:34:20 -0500
Re: OT Cell phone antenna enhances...NTC
Earl Moon
Fri, 31 May 2002 19:03:49 -0500
Re: OT- wasn't an experiment..
Earl Moon
Fri, 31 May 2002 22:37:02 -0600
Re: OT- wasn't an experiment..
Earl Moon
Fri, 31 May 2002 23:36:42 -0500
Re: Palladium Leads
Earl Moon
Thu, 9 May 2002 09:07:11 -0400
Re: Panelization sanity check needed
Earl Moon
Tue, 7 May 2002 14:55:28 -0500
Re: Panelization sanity check needed
Earl Moon
Wed, 8 May 2002 07:58:13 -0500
Re: PCB materials
Earl Moon
Thu, 23 May 2002 12:11:11 -0500
Re: PCB materials
Earl Moon
Tue, 28 May 2002 11:38:29 -0500
Productivity Way Up
Earl Moon
Tue, 7 May 2002 10:36:38 -0500
Re: Productivity Way Up
Earl Moon
Tue, 7 May 2002 11:40:41 -0500
Re: Productivity Way Up
Earl Moon
Tue, 7 May 2002 12:20:01 -0500
Re: Productivity Way Up
Earl Moon
Tue, 7 May 2002 13:59:15 -0500
Re: Productivity Way Up
Earl Moon
Tue, 7 May 2002 15:05:43 -0500
Re: Productivity Way Up
Earl Moon
Tue, 7 May 2002 16:43:29 -0500
Re: Productivity Way Up
Earl Moon
Tue, 7 May 2002 17:43:29 -0500
Re: Productivity Way Up
Earl Moon
Wed, 8 May 2002 09:24:20 -0500
Re: Productivity Way Up
Earl Moon
Wed, 8 May 2002 14:43:25 -0500
Re: Productivity Way Up - Off topic
Earl Moon
Wed, 8 May 2002 12:21:20 -0500
Re: Productivity Way Up - Off topic
Earl Moon
Wed, 8 May 2002 13:22:41 -0500
Re: Re column grid arrays
Earl Moon
Fri, 31 May 2002 15:33:18 -0500
Re: safety committee
Earl Moon
Thu, 2 May 2002 14:55:13 -0400
Sanminaized
Earl Moon
Mon, 6 May 2002 14:00:42 -0500
Re: soldermask ring v. full coat for BGA design
Earl Moon
Fri, 31 May 2002 15:37:10 -0500
vacuum seal and MSD
Earl Moon
Wed, 1 May 2002 18:29:23 -0500
Re: Vacuum Seal and MSD
Earl Moon
Thu, 2 May 2002 10:46:45 -0400
Re: Vacuum sealing equipment
Earl Moon
Thu, 2 May 2002 11:36:06 -0400
Re: Vacuum sealing equipment
Earl Moon
Thu, 2 May 2002 11:44:23 -0400
Re: Vacuum sealing equipment...
Earl Moon
Wed, 1 May 2002 09:02:53 -0500
Re: Vacuum sealing equipment...
Earl Moon
Thu, 2 May 2002 11:47:18 -0500
Re: Vapor phase
Earl Moon
Tue, 28 May 2002 14:22:10 -0500
Re: Vapor phase
Earl Moon
Tue, 28 May 2002 15:05:35 -0500
Re: Vapor phase
Earl Moon
Tue, 28 May 2002 18:07:02 -0500
Re: Vias-in-pads
Earl Moon
Tue, 7 May 2002 14:25:34 -0500
Re: Voids on 0.75 mm micro-BGA
Earl Moon
Wed, 8 May 2002 12:47:23 -0500
Re: Wave solder re-runs/re-work
Earl Moon
Thu, 2 May 2002 12:16:13 -0500
Re: [TN} Vacuum Sealing...
Earl Moon
Thu, 2 May 2002 06:36:12 -0400
New Sender Ed Popielarski
Re: BGA X-ray Cross Section services - Vendors?
Ed Popielarski
Fri, 17 May 2002 06:43:32 -0700
Re: really big boards - all humor, no tech value
Ed Popielarski
Sat, 18 May 2002 08:01:17 -0700
New Sender Ed Valentine
Re: ASSY: Reflow for Through-Hole Devices
Ed Valentine
Wed, 22 May 2002 18:11:25 -0400
New Sender Eddie Rocha
Re: Flip-flop panels
Eddie Rocha
Wed, 1 May 2002 17:11:39 -0700
Re: Panelization sanity check needed
Eddie Rocha
Wed, 8 May 2002 09:43:58 -0700
power traces
Eddie Rocha
Thu, 23 May 2002 11:47:16 -0700
Re: soldermask ring v. full coat for BGA design
Eddie Rocha
Fri, 31 May 2002 13:27:54 -0700
New Sender Edward S. Wheeler
0402 pad design
Edward S. Wheeler
Thu, 16 May 2002 08:32:00 -0400
Re: Cell phone antenna enhancers...NTC
Edward S. Wheeler
Thu, 30 May 2002 15:17:44 -0400
Re: Cell phone antenna enhancers...NTC
Edward S. Wheeler
Thu, 30 May 2002 17:21:31 -0400
New Sender Eric Christison
Some Advice on PCB tols required
Eric Christison
Thu, 2 May 2002 13:18:41 +0100
New Sender Eric Dawson
Re: Anti-voiding solder paste
Eric Dawson
Tue, 28 May 2002 13:33:55 +0100
Re: BGA replacement
Eric Dawson
Tue, 14 May 2002 17:09:07 +0100
Re: really big boards
Eric Dawson
Fri, 17 May 2002 15:39:53 +0100
Re: testing via holes
Eric Dawson
Mon, 20 May 2002 08:19:37 +0100
New Sender Fineline Circuits, Inc.
Dielectric constant for cores and prepeg
Fineline Circuits, Inc.
Fri, 3 May 2002 14:57:37 -0400
Dielectric Constants For Core and Prepreg
Fineline Circuits, Inc.
Fri, 3 May 2002 13:04:16 -0400
New Sender Francis Sun
Guidelines or standards for number of missing unused BGA pads allowed
Francis Sun
Wed, 8 May 2002 12:02:57 -0400
Re: Guidelines or standards for number of missing unused BGA pads allowed
Francis Sun
Wed, 8 May 2002 16:37:30 -0400
Recommended solder paste for a 6 layer double-sided board with CSP & BGA packages
Francis Sun
Mon, 13 May 2002 10:12:36 -0400
New Sender Franck, George
Re: conductive blind via plug
Franck, George
Wed, 29 May 2002 13:02:09 -0400
Shear stress on laser vias
Franck, George
Thu, 2 May 2002 10:47:33 -0400
New Sender Francois Monette
Proposed lifting of component date code restrictions
Francois Monette
Wed, 1 May 2002 09:35:06 -0400
Vacuum Seal and MSD
Francois Monette
Thu, 2 May 2002 09:50:22 -0400
Vacuum sealing equipment
Francois Monette
Thu, 2 May 2002 10:27:39 -0400
Vacuum sealing equipment...
Francois Monette
Wed, 1 May 2002 09:53:21 -0400
New Sender Frank Conti
pcb design
Frank Conti
Mon, 20 May 2002 10:59:30 EDT
New Sender Frank Kimmey
Side fillet requirements
Frank Kimmey
Mon, 20 May 2002 15:16:53 -0700
Re: Side fillet requirements
Frank Kimmey
Tue, 21 May 2002 08:25:32 -0700
New Sender Frank Kriesch
Antwort: [TN] BGA X-ray Cross Section services - Vendors?
Frank Kriesch
Fri, 17 May 2002 09:19:57 +0200
New Sender Fred Biederman
Re: Cell phone antenna enhances...NTC
Fred Biederman
Fri, 31 May 2002 15:46:13 -0400
New Sender fullname
Coating thickness
fullname
Fri, 31 May 2002 10:26:43 +0800
New Sender Furrow, Robert Gordon (Bob)
Re: 63/37 solder paste with silver plated boards
Furrow, Robert Gordon (Bob)
Thu, 9 May 2002 13:59:29 -0400
Re: Flux on top of PCBs from wave
Furrow, Robert Gordon (Bob)
Thu, 9 May 2002 11:40:43 -0400
New Sender Gaby Bogdan
Re: BGA replacement
Gaby Bogdan
Tue, 14 May 2002 20:51:17 +0200
Re: NTC - The Gregory's are a team now...
Gaby Bogdan
Fri, 31 May 2002 08:10:26 +0200
Re: NTC - The Gregory's are a team now...
Gaby Bogdan
Fri, 31 May 2002 16:27:52 +0200
Re: NTC - The Gregory's are a team now...
Gaby Bogdan
Fri, 31 May 2002 18:28:59 +0200
Re: NTC - The Gregory's are a team now...
Gaby Bogdan
Fri, 31 May 2002 20:18:52 +0200
New Sender Gary Camac
Re: ESD and equipment isolation
Gary Camac
Fri, 31 May 2002 07:44:49 -0500
New Sender Genny Gibbard
Re: Productivity Way Up
Genny Gibbard
Tue, 7 May 2002 16:20:49 -0600
New Sender Geoff Layhe
Re: really big boards
Geoff Layhe
Mon, 20 May 2002 09:12:38 +0100
New Sender George Milad
Re: IPC-4552 spec for ENIG
George Milad
Mon, 13 May 2002 09:18:31 EDT
New Sender Goh Guan Chye
Re: Ceramic filled Teflon board
Goh Guan Chye
Fri, 10 May 2002 09:41:27 +0800
Electrical Isolation in dbm ?
Goh Guan Chye
Thu, 16 May 2002 11:29:03 +0800
New Sender Gordon Falconer
Mil spec approval
Gordon Falconer
Thu, 2 May 2002 20:07:15 -0700
New Sender Graham Collins
Re: Cell phone antenna enhancers...NTC
Graham Collins
Fri, 31 May 2002 08:36:59 -0400
Re: Conformal Coating
Graham Collins
Fri, 3 May 2002 08:34:44 -0400
Re: Conformal Coating
Graham Collins
Fri, 3 May 2002 10:09:57 -0400
Re: Conformal Coating
Graham Collins
Wed, 15 May 2002 06:57:35 -0400
Re: dross disposal
Graham Collins
Wed, 15 May 2002 12:10:16 -0400
New Sender Graham Naisbitt
Re: Cleaning of No-clean Assemblies
Graham Naisbitt
Thu, 9 May 2002 10:08:59 +0100
Re: Conformal coating / gluing
Graham Naisbitt
Fri, 24 May 2002 11:54:29 +0100
Re: Conformal coating BGAs
Graham Naisbitt
Tue, 21 May 2002 21:40:08 +0100
Re: SV: [TN] Vapor phase
Graham Naisbitt
Mon, 27 May 2002 10:36:46 +0100
Re: SV: [TN] Vapor phase
Graham Naisbitt
Mon, 27 May 2002 17:05:14 +0100
Re: Vapor phase
Graham Naisbitt
Tue, 28 May 2002 22:50:41 +0100
New Sender Greg Scott
Re: Side fillet requirements
Greg Scott
Tue, 21 May 2002 09:55:57 -0700
New Sender Guy Ramsey
Re: A "NEDA" Oriented label...
Guy Ramsey
Wed, 1 May 2002 07:05:35 -0400
Re: assembly spacing
Guy Ramsey
Tue, 21 May 2002 09:49:18 -0400
Re: Cell phone antenna enhancers...NTC
Guy Ramsey
Fri, 31 May 2002 09:14:37 -0400
Re: Crimp Tools
Guy Ramsey
Thu, 2 May 2002 07:32:00 -0400
Re: D2PAK devices
Guy Ramsey
Thu, 23 May 2002 10:33:00 -0400
Re: ESD and equipment isolation
Guy Ramsey
Thu, 30 May 2002 17:22:21 -0400
Re: Film Capacitors...geeze!
Guy Ramsey
Fri, 24 May 2002 07:01:53 -0400
Re: Guidelines or standards for number of missing unused BGA pads allowed
Guy Ramsey
Thu, 9 May 2002 08:37:19 -0400
Re: High lead composition solder paste and rinse water.
Guy Ramsey
Wed, 1 May 2002 14:40:49 -0400
Re: High lead composition solder paste and rinse water.
Guy Ramsey
Thu, 2 May 2002 10:07:46 -0400
Re: Looking for A Solderability Spec
Guy Ramsey
Fri, 17 May 2002 17:12:12 -0400
Re: Looking for recent PCB Reliability model
Guy Ramsey
Wed, 29 May 2002 07:50:24 -0400
Re: Palladium Leads
Guy Ramsey
Thu, 9 May 2002 11:20:25 -0400
Re: PTH Vertical Fill Requirement IPC610 Rev. C
Guy Ramsey
Fri, 10 May 2002 15:51:39 -0400
really big boards
Guy Ramsey
Fri, 17 May 2002 07:14:29 -0400
Re: really big boards
Guy Ramsey
Fri, 17 May 2002 10:30:52 -0400
Re: really big boards
Guy Ramsey
Fri, 17 May 2002 15:13:11 -0400
Re: really big boards - all humor, no tech value
Guy Ramsey
Fri, 17 May 2002 17:04:11 -0400
Re: Repair/Mod pads
Guy Ramsey
Tue, 21 May 2002 10:43:43 -0400
Re: Restoring solderability
Guy Ramsey
Wed, 15 May 2002 15:33:30 -0400
Re: Restoring solderability
Guy Ramsey
Thu, 16 May 2002 07:29:06 -0400
Re: Side fillet requirements
Guy Ramsey
Tue, 21 May 2002 08:57:56 -0400
Re: Some Advice on PCB tols required
Guy Ramsey
Thu, 2 May 2002 14:02:21 -0400
Re: Voids in fine-pitch BGAs after reflow
Guy Ramsey
Fri, 17 May 2002 07:42:39 -0400
Re: Wave solder re-runs/re-work exposed copper
Guy Ramsey
Fri, 3 May 2002 07:10:54 -0400
Re: Wave solder re-runs/re-work exposed copper
Guy Ramsey
Mon, 6 May 2002 08:51:07 -0400
New Sender Håkan Törnqvist (EMW)
Voids in fine-pitch BGAs after reflow
Håkan Törnqvist (EMW)
Thu, 16 May 2002 11:10:18 +0200
New Sender Henry Rekers
BGA warpage - defects in the corners.
Henry Rekers
Thu, 16 May 2002 13:34:19 -0700
Re: BGA warpage - defects in the corners.
Henry Rekers
Thu, 16 May 2002 15:14:52 -0700
No Clean?
Henry Rekers
Tue, 14 May 2002 08:00:28 -0700
Palladium Leads
Henry Rekers
Wed, 8 May 2002 17:33:22 -0700
New Sender Hinners Hans M Civ WRALC/LUGE
Re: board baking
Hinners Hans M Civ WRALC/LUGE
Tue, 21 May 2002 11:29:37 -0400
Re: Coating thickness
Hinners Hans M Civ WRALC/LUGE
Fri, 31 May 2002 13:36:35 +0100
Re: Conformal Coating
Hinners Hans M Civ WRALC/LUGE
Tue, 14 May 2002 21:18:33 +0100
Re: Conformal coating / gluing
Hinners Hans M Civ WRALC/LUGE
Thu, 23 May 2002 20:06:31 +0100
Re: High lead composition solder paste and rinse water.
Hinners Hans M Civ WRALC/LUGE
Thu, 2 May 2002 16:33:07 +0100
Re: really big boards
Hinners Hans M Civ WRALC/LUGE
Fri, 17 May 2002 16:08:14 +0100
Re: safety committee
Hinners Hans M Civ WRALC/LUGE
Fri, 3 May 2002 21:48:32 +0100
New Sender Hogg, Blair K.
Re: Cell phone antenna enhancers...NTC
Hogg, Blair K.
Fri, 31 May 2002 11:56:29 -0400
Re: First Article Inspection of bare boards
Hogg, Blair K.
Tue, 14 May 2002 09:44:46 -0400
Re: Looking for a capacitance meter
Hogg, Blair K.
Wed, 22 May 2002 08:53:56 -0400
Re: Solder Defect Rates
Hogg, Blair K.
Wed, 29 May 2002 15:43:09 -0400
New Sender Houston, Terri
Re: BGA Solderability
Houston, Terri
Thu, 23 May 2002 09:24:33 -0600
Re: BGA Solderability
Houston, Terri
Thu, 23 May 2002 11:48:29 -0600
Looking for a capacitance meter
Houston, Terri
Tue, 21 May 2002 15:00:27 -0500
Surrogate Post - Multiple Choice Question
Houston, Terri
Fri, 3 May 2002 12:27:26 -0600
New Sender Jack C. Olson
ASSY: Component Polarity
Jack C. Olson
Thu, 30 May 2002 08:35:45 -0500
Re: ASSY: Component Polarity
Jack C. Olson
Thu, 30 May 2002 21:30:18 -0500
ASSY: Reflow for Through-Hole Devices
Jack C. Olson
Wed, 22 May 2002 10:59:26 -0500
Re: Productivity Way Up
Jack C. Olson
Wed, 8 May 2002 08:18:08 -0500
New Sender Jack Crawford
Re: DPMO benchmarking
Jack Crawford
Wed, 29 May 2002 16:28:44 -0500
Re: ReA610HoleFill
Jack Crawford
Mon, 13 May 2002 09:43:20 -0500
TechNet Cops are NOT on vacation
Jack Crawford
Fri, 31 May 2002 16:44:13 -0500
New Sender James TerVeen
Re: Cell phone antenna enhancers...NTC
James TerVeen
Thu, 30 May 2002 13:56:50 -0400
Re: Cell phone antenna enhancers...NTC
James TerVeen
Fri, 31 May 2002 10:43:57 -0400
Re: Vacuum sealing equipment...
James TerVeen
Wed, 1 May 2002 09:42:46 -0400
New Sender Jana Carraway
Re: HDI and Sanmina
Jana Carraway
Mon, 6 May 2002 11:06:25 -0700
Re: HDI and Sanmina
Jana Carraway
Mon, 6 May 2002 11:43:38 -0700
Re: Sanmina HDI
Jana Carraway
Mon, 6 May 2002 15:50:27 -0700
New Sender Jason Gregory
Re: BGA warpage - defects in the corners.
Jason Gregory
Thu, 16 May 2002 16:36:37 -0500
New Sender Jeff Ferry
Re: BGA replacement
Jeff Ferry
Tue, 14 May 2002 13:49:07 -0400
Re: BGA replacement
Jeff Ferry
Tue, 14 May 2002 16:20:13 -0400
Re: Productivity Way Up
Jeff Ferry
Tue, 7 May 2002 14:46:00 -0400
Re: Repair/Mod pads
Jeff Ferry
Tue, 21 May 2002 10:49:24 -0400
New Sender Jeff Seeger
Re: BGA Solderability
Jeff Seeger
Thu, 23 May 2002 13:00:09 -0400
IPC-DC Boston area mtg, 21-May
Jeff Seeger
Tue, 14 May 2002 16:04:26 -0400
New Sender Jim Jenkins
ESD and equipment isolation
Jim Jenkins
Thu, 30 May 2002 13:25:40 -0500
New Sender Jim Lamb
Looking for recent PCB Reliability model
Jim Lamb
Wed, 15 May 2002 00:13:34 -0700
New Sender Jim Wertin
Re: TechNet Digest - 12 May 2002 to 13 May 2002 (#2002-109)
Jim Wertin
Tue, 14 May 2002 11:14:47 -0700
New Sender jim
Re: Productivity Way Up
jim
Tue, 7 May 2002 16:43:56 -0500
New Sender Jindra, Larry
Re: D.O.E
Jindra, Larry
Wed, 15 May 2002 19:08:22 -0700
Low Temp BGA Balls
Jindra, Larry
Mon, 6 May 2002 16:24:00 -0700
New Sender Joe Fjelstad
Re: Metal core PCB's
Joe Fjelstad
Fri, 24 May 2002 09:34:55 EDT
Re: Plant closures
Joe Fjelstad
Mon, 13 May 2002 12:48:56 EDT
New Sender John Parsons
Re: Hole routing in PCBs
John Parsons
Wed, 1 May 2002 10:51:43 -0700
New Sender John Perry
Fire Up for IPC Annual Meeting 2002
John Perry
Thu, 23 May 2002 10:12:13 -0500
New Sender Joseph Keary
Re: High Voltage tracking on pbc surface
Joseph Keary
Wed, 15 May 2002 15:51:05 -0700
New Sender Joseph Spicuzza
Re: Mil spec approval
Joseph Spicuzza
Fri, 3 May 2002 13:59:09 -0400
Re: Mil spec approval
Joseph Spicuzza
Fri, 3 May 2002 15:57:26 -0400
New Sender Kane, Joseph
Re: ESD and equipment isolation
Kane, Joseph
Thu, 30 May 2002 16:17:53 -0400
New Sender Karnwal, Pankaj
fLUX RESIDUE IN NO CLEAN SOLDER WIRE
Karnwal, Pankaj
Fri, 31 May 2002 08:03:54 +0200
New Sender Kasprzak, Bill (sys) USX
Re: Cell phone antenna enhancers...
Kasprzak, Bill (sys) USX
Thu, 30 May 2002 10:57:42 -0400
Re: Cell phone antenna enhances...NTC
Kasprzak, Bill (sys) USX
Fri, 31 May 2002 11:57:33 -0400
Re: Cell phone antenna enhances...NTC
Kasprzak, Bill (sys) USX
Fri, 31 May 2002 13:57:15 -0400
Re: Crimped connections
Kasprzak, Bill (sys) USX
Fri, 17 May 2002 07:32:02 -0400
Re: Crimped connections
Kasprzak, Bill (sys) USX
Mon, 20 May 2002 07:01:49 -0400
New Sender Kathy Kuhlow
Re: Crimped connections
Kathy Kuhlow
Thu, 16 May 2002 09:59:12 -0500
Re: First Article Inspection of bare boards
Kathy Kuhlow
Tue, 14 May 2002 08:57:57 -0500
Re: HDI and Sanmina
Kathy Kuhlow
Mon, 6 May 2002 14:21:59 -0500
Interesting addition to an ealier discussion
Kathy Kuhlow
Fri, 3 May 2002 09:26:17 -0500
Re: Keeping RA and OA flux separate
Kathy Kuhlow
Tue, 21 May 2002 16:12:10 -0500
Re: Parts List Definition
Kathy Kuhlow
Tue, 7 May 2002 11:24:06 -0500
Re: Productivity Way Up
Kathy Kuhlow
Tue, 7 May 2002 11:16:31 -0500
Re: Wave solder re-runs/re-work exposed copper
Kathy Kuhlow
Fri, 3 May 2002 09:09:48 -0500
New Sender Ken Carlile
Re: Cell phone antenna enhancers...NTC
Ken Carlile
Thu, 30 May 2002 18:02:27 -0400
New Sender Ken Patel
Looking for place who offer classes on ICT/DFT in Bay Area
Ken Patel
Thu, 30 May 2002 15:40:18 -0700
New Sender KIPPING, Michael (York Rd)
Re: Cleaning of No-clean Assemblies
KIPPING, Michael (York Rd)
Thu, 9 May 2002 14:26:04 +0100
New Sender Kris Keating
abrasive for cleaning PCB surfaces
Kris Keating
Thu, 23 May 2002 13:23:00 -0400
testing via holes
Kris Keating
Fri, 17 May 2002 10:07:34 -0400
New Sender Krug, Dick
Class 3 Solder Fillets - SMT 25 mil square pin Headers?
Krug, Dick
Fri, 3 May 2002 10:04:51 -0400
Re: Tape & Reel Size for 0402 Components
Krug, Dick
Thu, 16 May 2002 17:00:18 -0400
New Sender Lambert, Katherine A.
Panelization sanity check needed
Lambert, Katherine A.
Tue, 7 May 2002 12:43:04 -0700
New Sender Lee Whiteman
Re: ASSY: Reflow for Through-Hole Devices
Lee Whiteman
Wed, 22 May 2002 16:20:51 -0400
Re: Conformal Coating
Lee Whiteman
Fri, 3 May 2002 11:26:05 -0400
New Sender Leland Woodall
Cleaning of No-clean Assemblies
Leland Woodall
Wed, 8 May 2002 15:41:50 -0400
Re: Cleaning of No-clean Assemblies
Leland Woodall
Wed, 8 May 2002 20:51:42 -0400
New Sender Linda Langley
Re: Repair/Mod pads
Linda Langley
Tue, 21 May 2002 09:02:37 -0400
New Sender Linda Woody
Conformal coating BGAs
Linda Woody
Mon, 20 May 2002 10:53:22 -0500
TypeUR conformal coatings
Linda Woody
Wed, 22 May 2002 14:24:06 -0500
New Sender Liviu Jurjica-Prundeanu
Re: BGA replacement
Liviu Jurjica-Prundeanu
Tue, 14 May 2002 11:58:58 -0400
Re: D.O.E
Liviu Jurjica-Prundeanu
Thu, 16 May 2002 08:09:40 -0400
New Sender Lou Hart
Re: D.O.E
Lou Hart
Wed, 15 May 2002 16:38:18 -0400
New Sender Lum Wee Mei
Re: Coating thickness
Lum Wee Mei
Sat, 1 Jun 2002 12:06:06 +0800
New Sender MA Ranganath/SMPLB/SEC/SANMAR
Re: Metal core PCB's
MA Ranganath/SMPLB/SEC/SANMAR
Sat, 25 May 2002 10:36:11 +0530
Re: Mil spec approval
MA Ranganath/SMPLB/SEC/SANMAR
Thu, 2 May 2002 20:25:10 -0700
New Sender Maddox, Allen T
Re: BGA Solderability
Maddox, Allen T
Fri, 24 May 2002 08:39:37 -0400
New Sender Mair, Christian
Re: really big boards
Mair, Christian
Wed, 22 May 2002 11:37:11 +0200
New Sender Mark Charlton
Re: ASSY: Component Polarity
Mark Charlton
Thu, 30 May 2002 10:03:10 -0400
New Sender Mark Hargreaves
bare board serialization
Mark Hargreaves
Wed, 29 May 2002 16:26:09 -0400
New Sender Mark Orlowski/PEMSTAR Inc
Mark Orlowski/PEMSTAR Inc is out of the office.
Mark Orlowski/PEMSTAR Inc
Wed, 15 May 2002 01:01:40 -0500
New Sender Mark Roslawski
Re: (Fwd) Inquiry on maximum temperature
Mark Roslawski
Wed, 22 May 2002 17:21:52 -0700
New Sender Marki Sasportas
Trough hole soldering
Marki Sasportas
Sun, 19 May 2002 16:59:52 +0200
New Sender Marsico, James
Board Cost
Marsico, James
Thu, 2 May 2002 10:34:19 -0400
BOARD EDGE CLEARANCE
Marsico, James
Wed, 8 May 2002 07:02:33 -0400
Re: Cell phone antenna enhancers...
Marsico, James
Thu, 30 May 2002 11:03:35 -0400
Re: Cleaning of No-clean Assemblies
Marsico, James
Thu, 9 May 2002 08:26:57 -0400
CLEARANCE FRON PWB EDGES
Marsico, James
Tue, 7 May 2002 09:14:52 -0400
Re: Conformal Coating
Marsico, James
Wed, 15 May 2002 07:26:51 -0400
Re: Low Temp BGA Balls
Marsico, James
Tue, 7 May 2002 07:05:56 -0400
Re: really big boards
Marsico, James
Fri, 17 May 2002 08:46:59 -0400
Re: Tinning SMD diodes
Marsico, James
Tue, 7 May 2002 10:41:12 -0400
New Sender Martyn Gaudion
Re: Dielectric Constants For Core and Prepreg
Martyn Gaudion
Thu, 2 May 2002 19:52:02 +0100
New Sender Mcmaster, Michael
Reflow Oven Recommendations
Mcmaster, Michael
Thu, 30 May 2002 16:37:11 -0700
New Sender McVean
Re: Productivity Way Up - Off topic
McVean
Wed, 8 May 2002 18:24:14 +0100
New Sender Mel Parrish
Re:
Mel Parrish
Wed, 29 May 2002 15:15:20 -0500
Re: Cell phone antenna enhancers...NTC
Mel Parrish
Fri, 31 May 2002 08:20:43 -0500
Re: Class 3 Solder Fillets - SMT 25 mil square pin Headers?
Mel Parrish
Fri, 3 May 2002 11:01:56 -0500
Re: Conformal Coating
Mel Parrish
Fri, 17 May 2002 16:54:37 -0500
Re: Crimped connections
Mel Parrish
Thu, 16 May 2002 09:45:18 -0500
Re: Palladium Leads
Mel Parrish
Thu, 9 May 2002 15:46:07 -0500
Re: ReA610HoleFill
Mel Parrish
Mon, 13 May 2002 09:47:17 -0500
Re: Side fillet requirements
Mel Parrish
Tue, 21 May 2002 07:36:56 -0500
Re: Side fillet requirements
Mel Parrish
Wed, 22 May 2002 11:00:55 -0500
Re: Wave solder re-runs/re-work exposed copper
Mel Parrish
Fri, 3 May 2002 11:29:33 -0500
New Sender Michael Bell
Re: D.O.E
Michael Bell
Thu, 16 May 2002 08:43:45 +1200
New Sender Mike Fenner
Re: 63/37 solder paste with silver plated boards
Mike Fenner
Mon, 13 May 2002 10:49:53 +0100
Re: ASSY: Reflow for Through-Hole Devices
Mike Fenner
Tue, 28 May 2002 09:05:38 +0100
Re: Cell phone antenna enhancers...NTC
Mike Fenner
Fri, 31 May 2002 16:54:35 +0100
Re: High lead composition solder paste and rinse water.
Mike Fenner
Thu, 2 May 2002 17:12:03 +0100
Re: Solder-UBM Separation
Mike Fenner
Fri, 17 May 2002 09:08:57 +0100
Re: SV: [TN] Vapor phase
Mike Fenner
Mon, 27 May 2002 14:20:14 +0100
Re: SV: [TN] Vapor phase
Mike Fenner
Tue, 28 May 2002 16:59:39 +0100
Re: Vapor phase
Mike Fenner
Fri, 24 May 2002 17:50:25 +0100
New Sender Misner, Bruce
Re: BGA replacement
Misner, Bruce
Tue, 14 May 2002 09:28:40 -0600
Re: BGA's on ruggedized assemblies...
Misner, Bruce
Wed, 15 May 2002 09:09:20 -0600
Re: BGA's on ruggedized assemblies...
Misner, Bruce
Wed, 15 May 2002 09:25:28 -0600
Conformal Coating
Misner, Bruce
Fri, 17 May 2002 12:09:48 -0500
New Sender Nancy Trumbull
Re: PTH Vertical Fill Requirement IPC610 Rev. C
Nancy Trumbull
Fri, 10 May 2002 07:24:05 -0400
Re: PTH Vertical Fill Requirement IPC610 Rev. C
Nancy Trumbull
Fri, 10 May 2002 14:56:07 -0400
New Sender Neda Thrash
Re: Repair/Mod pads
Neda Thrash
Tue, 21 May 2002 10:15:20 -0500
New Sender Ochenas, Tom
soldermask ring v. full coat for BGA design
Ochenas, Tom
Thu, 30 May 2002 16:57:49 -0700
Re: soldermask ring v. full coat for BGA design
Ochenas, Tom
Fri, 31 May 2002 11:00:05 -0700
New Sender Olivia Mc Dermott
Conformal Coating
Olivia Mc Dermott
Thu, 2 May 2002 15:40:09 +0000
Re: Conformal Coating
Olivia Mc Dermott
Fri, 3 May 2002 07:48:08 +0000
New Sender Paul Truit
Restoring solderability
Paul Truit
Wed, 15 May 2002 13:41:25 -0400
New Sender Pelkey, Glenn
Board defect? Purple spot
Pelkey, Glenn
Thu, 16 May 2002 10:14:23 -0700
Re: Board defect? Purple spot
Pelkey, Glenn
Thu, 16 May 2002 11:53:34 -0700
New Sender Peter Barton
Re: Palladium Leads
Peter Barton
Thu, 9 May 2002 14:59:00 +0100
New Sender Phil Kinner
Re: Coating thickness
Phil Kinner
Fri, 31 May 2002 09:05:32 +0100
Re: Reflow Oven Recommendations
Phil Kinner
Fri, 31 May 2002 09:08:15 +0100
Re: TypeUR conformal coatings
Phil Kinner
Thu, 23 May 2002 15:20:41 +0100
New Sender Phil Nutting
Re: abrasive for cleaning PCB surfaces
Phil Nutting
Thu, 23 May 2002 13:57:10 -0400
Re: ASSY: Component Polarity
Phil Nutting
Thu, 30 May 2002 10:31:23 -0400
Re: ASSY: Component Polarity
Phil Nutting
Fri, 31 May 2002 08:30:30 -0400
Re: ASSY: Component Polarity - part 2
Phil Nutting
Thu, 30 May 2002 10:46:47 -0400
Re: bare board serialization
Phil Nutting
Thu, 30 May 2002 08:21:56 -0400
Re: Cell phone antenna enhancers...
Phil Nutting
Thu, 30 May 2002 08:14:34 -0400
Re: Cell phone antenna enhancers...NTC
Phil Nutting
Fri, 31 May 2002 10:07:13 -0400
Re: Cell phone antenna enhances...NTC
Phil Nutting
Fri, 31 May 2002 12:37:36 -0400
Re: Conformal Coating
Phil Nutting
Tue, 14 May 2002 16:04:35 -0400
Re: Crimped connections
Phil Nutting
Thu, 16 May 2002 11:48:41 -0400
Re: Crimped connections
Phil Nutting
Fri, 17 May 2002 08:54:49 -0400
Re: dross disposal
Phil Nutting
Wed, 15 May 2002 11:17:20 -0400
High Voltage tracking on pbc surface
Phil Nutting
Wed, 15 May 2002 17:03:23 -0400
Hole routing in PCBs
Phil Nutting
Wed, 1 May 2002 12:55:50 -0400
Keeping RA and OA flux separate
Phil Nutting
Tue, 21 May 2002 09:32:55 -0400
Keeping RA and OA flux separate
Phil Nutting
Tue, 21 May 2002 09:32:55 -0400
New Sender Phillip Hinton
Ceramic filled Teflon board
Phillip Hinton
Thu, 9 May 2002 12:39:51 EDT
Locating Jay Brusse
Phillip Hinton
Tue, 7 May 2002 00:22:11 EDT
New Sender Race, Albert
PCB MATERIAL with low OUTGASSING Characteristics....
Race, Albert
Thu, 16 May 2002 13:53:18 -0400
New Sender Randy Bock Sr.
Re:
Randy Bock Sr.
Wed, 29 May 2002 15:47:36 -0400
Re: BGA X-ray Cross Section services - Vendors?
Randy Bock Sr.
Sat, 18 May 2002 07:51:53 -0400
Re: Cell phone antenna enhancers...NTC
Randy Bock Sr.
Fri, 31 May 2002 07:30:19 -0400
Re: Cell phone antenna enhancers...NTC
Randy Bock Sr.
Fri, 31 May 2002 12:12:17 -0400
Re: Hole routing in PCBs
Randy Bock Sr.
Wed, 1 May 2002 14:18:53 -0400
Re: really big boards - all humor, no tech value
Randy Bock Sr.
Sat, 18 May 2002 11:58:06 -0400
Re: VIRUS WARNNING !!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!
Randy Bock Sr.
Mon, 6 May 2002 07:36:03 -0400
New Sender Reid, Lorraine
D2PAK devices
Reid, Lorraine
Thu, 23 May 2002 12:40:44 +0100
New Sender rgrant
Re: Anti-voiding solder paste
rgrant
Tue, 28 May 2002 09:10:22 -0600
Re: ASSY: Component Polarity
rgrant
Fri, 31 May 2002 08:18:59 -0600
Re: BGA Solderability
rgrant
Thu, 23 May 2002 12:47:41 -0600
Re: PCB materials
rgrant
Thu, 23 May 2002 10:37:44 -0600
Re: Vapor phase
rgrant
Fri, 24 May 2002 11:55:26 -0600
Re: Vapor phase
rgrant
Tue, 28 May 2002 12:52:56 -0600
New Sender Richard Carruth
Re: PTH Vertical Fill Requirement IPC610 Rev. C
Richard Carruth
Thu, 9 May 2002 16:48:02 -0500
New Sender Richard Hamilton
Parts List Definition
Richard Hamilton
Mon, 6 May 2002 22:14:23 -0700
New Sender Rick Thompson
BGA X-ray Cross Section services - Vendors?
Rick Thompson
Thu, 16 May 2002 11:38:32 -0700
New Sender Rick
(Fwd) Inquiry on maximum temperature
Rick
Tue, 21 May 2002 07:24:55 -0400
New Sender Rob Legg
Re: High Voltage tracking on pbc surface
Rob Legg
Thu, 16 May 2002 21:49:37 -0400
Re: Trough hole soldering
Rob Legg
Mon, 20 May 2002 00:38:14 -0400
New Sender Robert B. Denbo
Re: Board defect? Purple spot
Robert B. Denbo
Thu, 16 May 2002 12:54:19 -0500
Re: Board defect? Purple spot
Robert B. Denbo
Thu, 16 May 2002 14:20:16 -0500
Re: Hole routing in PCBs
Robert B. Denbo
Wed, 1 May 2002 13:17:05 -0500
New Sender Robert Meston
Tinning SMD diodes
Robert Meston
Tue, 7 May 2002 07:37:11 -0500
New Sender Rod Smith
Rod Smith/Endicott/IBM is out of the office.
Rod Smith
Fri, 31 May 2002 11:11:40 -0400
New Sender Roger Stoops
Re: Hole routing in PCBs
Roger Stoops
Wed, 1 May 2002 15:50:28 -0400
New Sender Roland Jaquet
Re: really big boards
Roland Jaquet
Fri, 24 May 2002 21:55:44 +0200
New Sender Rudy Sedlak
Re: Cleaning of No-clean Assemblies
Rudy Sedlak
Wed, 8 May 2002 16:57:03 EDT
Vacuum ???
Rudy Sedlak
Wed, 1 May 2002 08:52:35 EDT
New Sender Russell Burdick
Re: conductive blind via plug
Russell Burdick
Wed, 29 May 2002 07:52:27 -0700
Re: conductive blind via plug
Russell Burdick
Wed, 29 May 2002 13:08:36 -0700
New Sender ryan
Re: Vias-in-pads
ryan
Wed, 24 Apr 2002 19:52:21 -0400
New Sender Sauer, Steven T.
Re: Cell phone antenna enhancers...NTC
Sauer, Steven T.
Fri, 31 May 2002 07:09:23 -0400
Re: Class 3 Solder Fillets - SMT 25 mil square pin Headers?
Sauer, Steven T.
Fri, 3 May 2002 12:32:05 -0400
Re: Crimped connections
Sauer, Steven T.
Thu, 16 May 2002 10:22:06 -0400
Re: D2PAK devices
Sauer, Steven T.
Thu, 23 May 2002 10:18:29 -0400
Re: D2PAK devices
Sauer, Steven T.
Fri, 24 May 2002 08:34:08 -0400
Re: Looking for a capacitance meter
Sauer, Steven T.
Wed, 22 May 2002 07:38:17 -0400
Re: Palladium Leads
Sauer, Steven T.
Thu, 9 May 2002 07:32:09 -0400
Re: PTH Vertical Fill Requirement IPC610 Rev. C
Sauer, Steven T.
Fri, 10 May 2002 07:53:53 -0400
Re: ReA610HoleFill
Sauer, Steven T.
Mon, 13 May 2002 08:32:58 -0400
Re: Side fillet requirements
Sauer, Steven T.
Wed, 22 May 2002 08:19:57 -0400
New Sender Scott Kramer
Re: Dielectric Constants For Core and Prepreg
Scott Kramer
Thu, 2 May 2002 10:49:58 -0700
New Sender Scott Westheimer
Plant closures
Scott Westheimer
Sat, 27 Apr 2002 12:27:20 -0400
New Sender Seth Goodman
Re: BGA replacement
Seth Goodman
Sat, 18 May 2002 17:39:14 -0500
Re: Crimped connections
Seth Goodman
Sun, 19 May 2002 13:57:41 -0500
Re: Crimped connections
Seth Goodman
Mon, 20 May 2002 15:34:57 -0500
Re: Electrical Isolation in dbm ?
Seth Goodman
Sat, 18 May 2002 18:11:19 -0500
Re: HDI and Sanmina
Seth Goodman
Tue, 7 May 2002 01:14:48 -0500
Re: Hole routing in PCBs
Seth Goodman
Wed, 1 May 2002 17:13:25 -0500
Re: Panelization sanity check needed
Seth Goodman
Wed, 8 May 2002 00:08:20 -0500
Re: Proposed lifting of component date code restrictions
Seth Goodman
Wed, 1 May 2002 16:30:13 -0500
Re: Via Capacitance
Seth Goodman
Mon, 20 May 2002 17:43:02 -0500
New Sender Sherif Refaat
Re: Anti-voiding solder paste
Sherif Refaat
Wed, 29 May 2002 12:57:00 -0400
New Sender Stefano Riccardi
Vapor phase
Stefano Riccardi
Fri, 24 May 2002 09:31:50 +0200
Re: Vapor phase
Stefano Riccardi
Mon, 27 May 2002 08:31:58 +0200
New Sender Stephannie Caliendo
The Best Opportunity in Texas!!!
Stephannie Caliendo
Thu, 16 May 2002 20:08:07 -0500
New Sender Steve Kelly
Re: Cell phone antenna enhances...NTC
Steve Kelly
Fri, 31 May 2002 17:34:36 -0700
New Sender Steve Owen
Re: BGA replacement
Steve Owen
Tue, 14 May 2002 16:35:48 +0100
Re: fLUX RESIDUE IN NO CLEAN SOLDER WIRE
Steve Owen
Fri, 31 May 2002 07:45:19 +0100
New Sender Strickland, Mark
Re: Crimped connections
Strickland, Mark
Fri, 17 May 2002 07:09:38 -0500
New Sender Tegehall Per-Erik
Re: Conformal coating BGAs
Tegehall Per-Erik
Thu, 23 May 2002 17:29:36 +0200
New Sender Tempea, Ioan
Re: BGA replacement
Tempea, Ioan
Tue, 14 May 2002 14:34:21 -0400
Re: Board analysis
Tempea, Ioan
Tue, 28 May 2002 11:22:12 -0400
Re: D.O.E
Tempea, Ioan
Thu, 16 May 2002 08:25:12 -0400
Re: Flip-flop panels
Tempea, Ioan
Thu, 2 May 2002 08:20:34 -0400
Re: Vacuum sealing equipment...
Tempea, Ioan
Wed, 1 May 2002 10:50:34 -0400
New Sender Tim McQuay
Conformal coating / gluing
Tim McQuay
Thu, 23 May 2002 12:44:36 -0500
New Sender Tom Buschor
Re: BGA's on ruggedized assemblies...
Tom Buschor
Wed, 22 May 2002 12:13:23 -0500
Re: Conformal coating BGAs
Tom Buschor
Wed, 22 May 2002 12:00:36 -0500
New Sender Tom Parkinson - Quality System Manager
Re: Conformal coating / gluing
Tom Parkinson - Quality System Manager
Thu, 23 May 2002 16:25:30 -0400
New Sender Tom Waznis
Re: Metal core PCB's
Tom Waznis
Sat, 25 May 2002 04:47:48 -0700
New Sender tony steinke
conductive blind via plug
tony steinke
Wed, 29 May 2002 09:33:28 -0700
Re: conductive blind via plug
tony steinke
Wed, 29 May 2002 13:09:50 -0700
high Tg FR4
tony steinke
Tue, 21 May 2002 16:25:34 -0700
TM650
tony steinke
Thu, 23 May 2002 16:43:36 -0700
New Sender Torres, Roberto
PCB materials
Torres, Roberto
Wed, 22 May 2002 14:53:12 -0400
Re: PCB materials
Torres, Roberto
Thu, 23 May 2002 13:01:13 -0400
Re: PCB materials
Torres, Roberto
Wed, 29 May 2002 13:11:18 -0400
New Sender Tostevin, Bruce
Re: Film Capacitors...geeze!
Tostevin, Bruce
Fri, 24 May 2002 10:15:00 -0500
New Sender Vandendolder, Ron
63/37 solder paste with silver plated boards
Vandendolder, Ron
Thu, 9 May 2002 13:26:38 -0400
Eutectic solder paste on silver plated boards
Vandendolder, Ron
Fri, 10 May 2002 08:08:06 -0400
New Sender WEEKES, MICHAEL HS-SNS
Re: BGA's on ruggedized assemblies...
WEEKES, MICHAEL HS-SNS
Wed, 15 May 2002 10:35:19 -0400
board baking
WEEKES, MICHAEL HS-SNS
Tue, 21 May 2002 10:15:31 -0400
Re: Board Cost
WEEKES, MICHAEL HS-SNS
Wed, 15 May 2002 10:58:27 -0400
Re: CLEARANCE FRON PWB EDGES
WEEKES, MICHAEL HS-SNS
Wed, 15 May 2002 10:56:27 -0400
Re: Conformal Coating
WEEKES, MICHAEL HS-SNS
Thu, 2 May 2002 12:58:54 -0400
Re: Looking for A Solderability Spec
WEEKES, MICHAEL HS-SNS
Fri, 17 May 2002 16:29:31 -0400
Re: Plant closures
WEEKES, MICHAEL HS-SNS
Mon, 13 May 2002 14:32:00 -0400
New Sender Wenger, George M.
Re: BGA solder anomalies
Wenger, George M.
Wed, 1 May 2002 13:08:27 -0400
Re: High lead composition solder paste and rinse water.
Wenger, George M.
Wed, 1 May 2002 13:28:05 -0400
Re: Palladium Leads
Wenger, George M.
Thu, 9 May 2002 13:11:48 -0400
Re: Tinning SMD diodes
Wenger, George M.
Tue, 7 May 2002 12:35:34 -0400
New Sender Werner Engelmaier
Re: BGA SMD vs NSMD
Werner Engelmaier
Wed, 29 May 2002 07:44:57 EDT
Re: BGA warpage - defects in the corners.
Werner Engelmaier
Fri, 17 May 2002 19:33:10 EDT
Re: BGA warpage - defects in the corners.
Werner Engelmaier
Sun, 19 May 2002 20:42:23 EDT
Re: BGA's on ruggedized assemblies...
Werner Engelmaier
Wed, 15 May 2002 18:27:05 EDT
Re: Cell phone antenna enhancers...NTC
Werner Engelmaier
Fri, 31 May 2002 19:33:01 EDT
Re: Class 3 Solder Fillets - SMT 25 mil square pin Headers?
Werner Engelmaier
Sun, 5 May 2002 18:06:10 EDT
Re: Conformal coating BGAs
Werner Engelmaier
Tue, 21 May 2002 10:51:19 EDT
Re: Conformal coating BGAs
Werner Engelmaier
Wed, 22 May 2002 04:16:00 EDT
Re: Conformal coating BGAs
Werner Engelmaier
Sat, 25 May 2002 22:55:51 EDT
Re: Eutectic solder paste on silver plated boards
Werner Engelmaier
Fri, 10 May 2002 20:00:43 EDT
Re: Fire Up for IPC Annual Meeting 2002
Werner Engelmaier
Sat, 25 May 2002 22:55:52 EDT
Re: Looking for recent PCB Reliability model
Werner Engelmaier
Thu, 16 May 2002 18:45:31 EDT
Re: Mechanical Strength of Solder Joints
Werner Engelmaier
Wed, 1 May 2002 19:28:48 EDT
Re: PTH Vertical Fill Requirement IPC610 Rev. C
Werner Engelmaier
Fri, 10 May 2002 20:00:45 EDT
Re: Re Hole Fill
Werner Engelmaier
Tue, 21 May 2002 10:51:22 EDT
Re: testing via holes
Werner Engelmaier
Sun, 19 May 2002 20:42:25 EDT
Re: Voids in fine-pitch BGAs after reflow
Werner Engelmaier
Fri, 17 May 2002 19:33:14 EDT
New Sender William Sullivan
Re: Ceramic filled Teflon board
William Sullivan
Thu, 9 May 2002 12:56:56 -0700
good to be back
William Sullivan
Thu, 9 May 2002 07:11:23 -0700
Re: pcb design
William Sullivan
Mon, 20 May 2002 10:29:32 -0700
resume post
William Sullivan
Thu, 23 May 2002 07:22:38 -0700
New Sender Woody, Linda L
Re: ASSY: Reflow for Through-Hole Devices
Woody, Linda L
Wed, 22 May 2002 15:51:48 -0400
New Sender Yu, Rudolph
0201 inspection and rework tools
Yu, Rudolph
Fri, 31 May 2002 15:12:14 -0700
Re: BGA warpage - defects in the corners.
Yu, Rudolph
Thu, 16 May 2002 14:30:18 -0700
New Sender Zweigart, Siegmund
no clean paste for High frequencies
Zweigart, Siegmund
Fri, 24 May 2002 10:51:20 +0200
Voids in BGA/CSP Balls
Zweigart, Siegmund
Wed, 29 May 2002 17:43:13 +0200

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