(GEN) Pls help with co location (1 Message)
(TECHNET) Populated PWB's (4 Messages)
(TechNet): Assy: Dewetting (5 Messages)
0603 chips -- alignment problem (2 Messages)
<No subject> (7 Messages)
<no subject> RANT on <no subject> and attachments and referals(with message) (1 Message)
Ad: [TECHNET] GEN: Trace Lab adress. (1 Message)
Additive process (1 Message)
Adhesive Stencil Printing (2 Messages)
Adhesive Test Equipment (3 Messages)
Adhesive Testing (3 Messages)
ADMIN: UNSIBSCRIBE messages (3 Messages)
Alternate Test Procedure for Dimensional Stability. (1 Message)
Aluminium substrates-thanks for help (1 Message)
Annular Ring Arguement (4 Messages)
Annular Ring Arguement -Reply (1 Message)
AOI (1 Message)
AQUEOUS CLEANING (1 Message)
ask for help (2 Messages)
ASSEM (1 Message)
Assem: Highly Accelerated Stress Test (5 Messages)
Assy : galvanic corrosion (2 Messages)
Assy, solder balls (1 Message)
ASSY,FAB,DES Electronics Manufacturing Seminar (1 Message)
Assy: Acceptance of terminals after soldering (3 Messages)
ASSY: COAXIAL CABLES (3 Messages)
ASSY: COAXIAL CABLES -Reply (1 Message)
ASSY: Conformal Coating Coverage (4 Messages)
Assy: Dispensing Machine (1 Message)
Assy: Finishes (1 Message)
Assy: Non-silicone elastormeric thermal pad (1 Message)
Assy: Non-silicone elastormeric thermal pad (fwd) (1 Message)
Assy: Panasonic 8 & 12 mm feeders jamming (1 Message)
ASSY: PARTS SOLDERABILITY (2 Messages)
Assy: PGA at the wave (1 Message)
Assy: Placement Machine Measurement (3 Messages)
ASSY: Solder Balls (1 Message)
Assy: Solder usage statistics f/Wave Solder (1 Message)
ASSY: Solderability (1 Message)
ASSY: Source for "Dummy" Bare Die (2 Messages)
ASSY: Staking components (6 Messages)
ASY: Measuring coplanarity of pins (2 Messages)
Attn: PCB Equipment Manufacturers (1 Message)
Autovue (1 Message)
Baking Out Plastic Parts in Reels! (2 Messages)
BGA and ENAu (1 Message)
BGA DFM and thermal management (1 Message)
BGA Singulation Technologies Question (1 Message)
BGA/Flip chip/microBGA (2 Messages)
BGA_for beginers (1 Message)
Blind and burried vias with OrCad (4 Messages)
Board & Artwork Inspection (2 Messages)
Bow and Twist (2 Messages)
Bow and Twist measurement clarification (1 Message)
Buying used placement system. (1 Message)
CALL FOR PANELISTS FOR DFE DIRECT METALLIZATION SEMINARS: OCT 6 IN ARLINGTON, VA; NOV 13 IN PHOENIX (1 Message)
Case Studies on Implementing ESS (2 Messages)
causes of electromigration in SOIC16 resistor net (2 Messages)
circuit boards (2 Messages)
City water or DI (5 Messages)
Classroom Demo's (1 Message)
COB RELIABILITY TEST (2 Messages)
Coefficient of thermal expansion (2 Messages)
components: re:Derating of PED:s (1 Message)
Confirmation of Receipt (1 Message)
Connections for SIR (1 Message)
Continuous Print and Etch Equipment (1 Message)
Contract assembly process capability (3 Messages)
Copper Corrosion (H2S) (1 Message)
cost of surface mounting (2 Messages)
Cracked Traces in Fab (3 Messages)
Cracking of 1206 components (3 Messages)
CTI Index IEC112 (1 Message)
Currie temperature measurements. (1 Message)
data needed (2 Messages)
Density Controller for Solder stripping (3 Messages)
Derating of PED:s (2 Messages)
DES Matching impedance DUT and Tester (2 Messages)
DES: Chip Caps & Chip Resistors (2 Messages)
DES: Chip Caps & Chip Resistors -Reply (2 Messages)
DES: Materials Properties (2 Messages)
DES: SMT pad shape test BD (3 Messages)
DES: SMT pad shape test BD -Reply (3 Messages)
Design Of Experiments (1 Message)
Design of Experiments soft (3 Messages)
Design of Experiments software (3 Messages)
Dewetting (1 Message)
DI Water Supply (1 Message)
DI water system (4 Messages)
Dinner mtg 26sept97 (1 Message)
Email address (1 Message)
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Ensolv solvent (2 Messages)
ESD (4 Messages)
ESD - shielding bags (4 Messages)
EVERGREEN PCB (2 Messages)
EVERGREEN PCB -Reply (1 Message)
EVERGREEN TUCKER (1 Message)
FAB Date Codes (2 Messages)
FAB&ASSY:Reflow on Ni/Au (1 Message)
FAB: Acceptabilty of dents (3 Messages)
FAB: Alpha Omega 600C (2 Messages)
FAB: Anode Length - Reply (1 Message)
FAB: Artwotk maintenance (2 Messages)
FAB: Copper plating (3 Messages)
FAB: Copper plating (current distribution) (1 Message)
FAB: Copper plating - Reply (1 Message)
Fab: Degree of Cure (1 Message)
FAB: IPC-ML-950 (3 Messages)
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FAB: MIL Spec on copper thickness (2 Messages)
FAB: PHOTO-IMAGEABLE CONDUCTIVE INK? (2 Messages)
FAB: Reliability tests through ageing (4 Messages)
FAB: small hole drilling (3 Messages)
FAB: software to view gerber (7 Messages)
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FAB: Where in the world is a spiral contractometer (4 Messages)
FAB: Wire Bondable Au/Ni Etch Resist (1 Message)
FAB:Plating jig Stripping (2 Messages)
FAB:Repair using Laser Welding (1 Message)
FINAL REMINDER: DFE DIRECT METALLIZATION SEMINAR ON SEPT 10 IN CHELMSFORD, MA (1 Message)
Fine Pitch Technology Acceptance Requirements (1 Message)
Flexible Circuit Technology Book (3 Messages)
FREEZE-IT 2000 spray VS static charge (4 Messages)
Fusible Links (1 Message)
FWD>RE>[TECHNET] FAB: Re (1 Message)
Gen: Advertisement (1 Message)
GEN: Book Reference (4 Messages)
GEN: S-N curve for eutectic Sn/Pb solder (3 Messages)
GEN: Trace Lab address. (1 Message)
GEN: Trace Lab adress. (3 Messages)
GEN: Vision Engineering Scope (2 Messages)
General Question (4 Messages)
GET ME OFF THIS LIST!!!! (3 Messages)
Godd Footprint Library (1 Message)
Gold Fingers (Capton Tape) (1 Message)
Good footprint library (6 Messages)
HAND CLEANING SURVEY RESULTS (1 Message)
Heat sink (1 Message)
help with IS developer (6 Messages)
HELP!!! (3 Messages)
HELP!!! (Viasystems) (1 Message)
help...... (3 Messages)
High Performance Laminates Workshop (1 Message)
Hole counting equipment (2 Messages)
Hole Wall Pullaway (5 Messages)
Hole Wall Pullaway- resend (1 Message)
How to verify something has reached temperature (4 Messages)
I need your help! (7 Messages)
If you describe the subject in the SUBJECT, we don't have to read the junk (no message) (1 Message)
improper email messages. (1 Message)
index server (1 Message)
Info. Request (1 Message)
Information on Feed & Bleed systems (3 Messages)
Inner layer Break-Out (4 Messages)
Intermetallic Formation in Solder Joint (2 Messages)
Internet Feedback Form (3 Messages)
Ionograph 500M SMD (3 Messages)
Ionograph 500M SMD Query (1 Message)
IPC Expo 1998 (5 Messages)
IPCWorks ' 97 (2 Messages)
LAST CALL FOR PANELISTS FOR DFE DIRECT METALLIZATION SEMINARS: OCT 6, ARLINGTON, VA; NOV 13, PHOENIX (1 Message)
lead trimming (1 Message)
Lifted Fiducials (2 Messages)
Linking to Dyconex' website. (1 Message)
Looking for a paper (2 Messages)
Looking for stock flex (1 Message)
Membrane switch keyboards (1 Message)
microBGA's and CSP's (1 Message)
microBGA/CSP, MICROVIAs (1 Message)
missing hole defects (5 Messages)
missing hole defects -Reply (1 Message)
MLB Layer Construction and Plane layer selection (4 Messages)
MLB Layer Construction and Plane layer selection -Reply (1 Message)
New specification of Cu plating (1 Message)
nitrogen desicator box (2 Messages)
No subject given (4 Messages)
No subject given -Reply (1 Message)
North Texas Chapter ~ IPC Designers Council Meeting October 2nd (1 Message)
Opens created during rework. (4 Messages)
OSP coating (6 Messages)
Pad Lifting (1 Message)
PADS Power PCB for sale (1 Message)
Palladium Plating (2 Messages)
Part Mounting (2 Messages)
PBGA Reliability (1 Message)
PCB Design Mag. (1 Message)
PCB Failures (2 Messages)
PCB Warpage (3 Messages)
PCB Warpage - Clarification (3 Messages)
pcb's manufacturing problems (5 Messages)
PCD magazine (1 Message)
peel strength (1 Message)
PHT repairing equipment (1 Message)
Pin In Hole and Intrusive Reflow (2 Messages)
Plasma coating on display lenses (1 Message)
Post Lamination Bake of GETEK (1 Message)
PQFP_100 pad Geometry (1 Message)
Prepreg test for No-flow Prepreg (2 Messages)
Press Fit (5 Messages)
Press Fit -Reply (1 Message)
PRESS FIT CONECTORS (2 Messages)
Press Fit Inductance (1 Message)
Pressure Cooker Test of Multilayers (3 Messages)
Pretinning - Flux (8 Messages)
Pretinning - Flux -Reply (2 Messages)
Probs processing Rogers 4003 matl (2 Messages)
Pulse Plating System (3 Messages)
Re Design of Experiments software (3 Messages)
Re SMT Standard sizes (1 Message)
Recommended pre-mount and pre-wave bake cycle time (1 Message)
Reflowable RF Shields (1 Message)
Reflowable RF Shields -Reply (2 Messages)
Rejected by Custodian (15 Messages)
Reliability (1 Message)
Sample box (1 Message)
SAS Address (1 Message)
Semi Automatic Screenprinte (6 Messages)
SIGNOFF TECHNET (2 Messages)
SIMM's and DIMM's (3 Messages)
SIR Testing (6 Messages)
smd standard sizes (1 Message)
SMT Coplanarity issues (5 Messages)
software (1 Message)
Solder Ball criteria (4 Messages)
Solder behaviour (1 Message)
Solder Joint Thickness (1 Message)
Solder mask between gold fingers (2 Messages)
Solder mask between gold fingers -Reply (1 Message)
Solder resist blisters (1 Message)
solder-ball free LPISM? (4 Messages)
Solderability of Immersion Gold PCB's (1 Message)
Solderabilty problem in BGA (2 Messages)
Soldereing to Chromite (1 Message)
Soldering a cap to a cylinder (1 Message)
Soldering of cap to a cylinder (2 Messages)
SPAM (Not the meat either, if that is what it REALLY is) (1 Message)
SPAM(Not...) (1 Message)
SPC Software (4 Messages)
Speakers for Designers Council (1 Message)
STANDARDS, COMMERCIAL VERSION OF MIL55110 (4 Messages)
stuff (1 Message)
sub: zero profile sockets (1 Message)
Subject: Dinner mtg 26sept97, Los Angeles area (1 Message)
SUBJECT: Handsoldering w/no-clean/low-residue (1 Message)
SUBJECT: OSPs and Adhesives (2 Messages)
Subscribe (7 Messages)
Suggestion for the advertisement 'thing' (2 Messages)
survey results (1 Message)
TechNet Digest - 29 Sep 1997 (1 Message)
Test - please disregard. (1 Message)
Test. (1 Message)
TEST: volume resisitivity probe (1 Message)
Testing of Solder (1 Message)
Theremal Resistance test on coverlay (1 Message)
thermal profile mole (4 Messages)
Thermount (2 Messages)
TOPLINE (1 Message)
UNSUBSCRIBE (12 Messages)
unsuscribe (1 Message)
V-Groove depth verification (3 Messages)
V-Groove depth verification -Reply (3 Messages)
V-Groove depth verification -Reply -Reply (1 Message)
Wave rider vs Wave Optimizer (2 Messages)
wave solder equipment (1 Message)
WAVE SOLDERING SMT CHIP COMPONENTS (2 Messages)
Where is Ushio (2 Messages)
Where to get low-residue reports (2 Messages)
Win95 programs for panelization, stack-up, etc. (1 Message)
X-ray and registration (4 Messages)
X-ray flourescent (2 Messages)
XRF (1 Message)
Youngs Modulus and Poisson's Ratio (4 Messages)
YTECHNET? X-RAY AND REGISTRATION (1 Message)
[DESIGNERCOUNCIL] Company logos (1 Message)
[DESIGNERCOUNCIL] Fwd: Internet Feedback Form (1 Message)
[TECHNET] ASSY: Conformal Coating Coverage (2 Messages)
[Technet] Assy: Placement Machine Measurement (2 Messages)
[TECHNET] ASSY: Source for "Dummy" Bare Die (1 Message)
[Technet] Assy: Sulpher (1 Message)
[TECHNET] Cracked Traces in Fab (1 Message)
[TECHNET] Design of Experiments soft (1 Message)
[TECHNET] Email adress request (1 Message)
[TECHNET] General Question (2 Messages)
[TECHNET] Hole Wall Pullaway (1 Message)
[TECHNET] How to verify something has reached temperature (1 Message)
[TECHNET] microBGA's and CSP's (2 Messages)
[TECHNET] missing hole defects (1 Message)
[TECHNET] OSP coating (1 Message)
[TECHNET] Press Fit (2 Messages)
[TECHNET] Press Fit -Reply (1 Message)
[TECHNET] Re Design of Experiments software (1 Message)
[TECHNET] SMT Coplanarity issues (1 Message)
[TECHNET] solder-ball free LPISM? (3 Messages)
[TECHNET] Soldering a cap to a cylinder (1 Message)
[TECHNET] SPC Software (1 Message)
[TECHNET] [DESIGNERCOUNCIL] Fwd: Internet Feedback Fo (1 Message)
[TECHNET] [Technet] Assy: Placement Machine Measureme (1 Message)
[T] Cracked Traces in Fab (1 Message)
[T] Hole Wall Pullaway (1 Message)
[T] Opens created during rework. (1 Message)
[T] SIR Testing (1 Message)
[T] SMT Coplanarity issues (1 Message)
[T]: S-N curve for eutectic Sn/Pb solder (1 Message)
[T]:Dewetting (1 Message)