We have been etching Ni/soft Au (2.5 micron) with std. ammoniacal etcher
without any problems
Roberto


At 08:27 AM 29/8/97 -0500, you wrote:
>What is the preferred chemistry for copper etching when using pattern
>plated wire bondable gold over nickel as the resist? Our Cupric etched
>about 50% faster than normal and seems to attack the nickel faster than the
>copper, leaving the gold undercut. I suppose this makes sense from their
>relative emf values (Au +1.498, Cu +0.337, Ni -0.250).
>
>
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Roberto Tulman
e-mail: [log in to unmask]
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