>Can anyone provide a reasonable design guideline for buried and blind vias?
>We need advice applicable for the designing OEM to use. These are of the
>sequentially laminated and/or controlled depth carbide drilled variety (not
>plasma, laser, or photo-formed microvias). We would want it to cover as much
>of the following as possible but will take any or all degrees of input if
>anyone can help:

Hi Roy

We have some infomation on our webpage. Have a look to the following
pages:

Highend multilayerboard:
http://www.dyconex.com/html/technologies_products/products/high_end_multilayer_boards.htm

Paper about Highend multilayerboards:
http://www.dyconex.com/download/PAPER01.html

Blind and buried via boards
http://www.dyconex.com/html/technologies_products/products/blind_buried_vias_mlb.htm

Design guidelines:
http://www.dyconex.com/html/technologies_products/design_guidelines.htm

Don't hesitate to contact us, if you need further information.

Regards

Fritz Steiner, Dyconex

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