TECHNETTERS:
HOW ARE YOU PROCESSING CKT-SIDE CHIP COMPONENTS AT WAVE SOLDER:
- REFLOW SOLDER AND THEN USE SELECTIVE WAVE SOLDER FIXTURING? OR
- BOND AND WAVE SOLDER? AND IF SO:
- RELIABILITY ISSUES?
- WHAT DEGREES C(OR F) PER SECOND FOR A PROFILE IS SAFE (THU
THE PREHEATERS AND SOLDER POT)?
I THOUGHT I SAW AN ARTICLE (TECHNET?) THAT SAID CHIP COMPONENTS COULD
HANDLE A 100 DEGREES C THERMALSHOCK (FROM THE PREHEATER ZONE TO THE SOLDER
POT. DOES THIS SOUND RIGHT?
THANKS,
AL KREPLICK
TERADYNE INC.
BOSTON MA
617 422-3726
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