Werner thanks for the response but our problem is not shelf life but rather
the ability to place surface mount components on a dot of glue
consistently. What we are seeing is a variation of up to several
thousandths of an inch in pad height. Our vendor has done the required
tests to J-STD-003 and he complies to the solder float test for
solderability.

Is there a specific test that the vendor can do to ensure that this
phenomenon go away. Our vendor has stated that his pressure on his hot air
knives on the HASL equipment is low and that this may contribute to the
problem. But I don't think anyone can state for sure that this is the
problem.

My curiosity is does any one else suffer from this problem and what steps
have they instituted either in house with their processes or at the
fabrication shop to reduce this abnormality. Is this something that is a
fact of life with fine pitch components.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################