Werner thanks for the response but our problem is not shelf life but rather the ability to place surface mount components on a dot of glue consistently. What we are seeing is a variation of up to several thousandths of an inch in pad height. Our vendor has done the required tests to J-STD-003 and he complies to the solder float test for solderability. Is there a specific test that the vendor can do to ensure that this phenomenon go away. Our vendor has stated that his pressure on his hot air knives on the HASL equipment is low and that this may contribute to the problem. But I don't think anyone can state for sure that this is the problem. My curiosity is does any one else suffer from this problem and what steps have they instituted either in house with their processes or at the fabrication shop to reduce this abnormality. Is this something that is a fact of life with fine pitch components. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################