0.045 post hole size (2 Messages)
2nd Annual Flex & Chips Conference (1 Message)
: PCB Vendor (3 Messages)
A-28-G Test Board Availability (2 Messages)
Accelerated aging/ flex material (1 Message)
Adhesive printing (11 Messages)
Administrative comment about "Keeping in Touch" (2 Messages)
Anti-tarnish on copper (16 Messages)
Baking Printed Wiring Boards and Assemblies (5 Messages)
BAKING PWBS AND PWAS (2 Messages)
Ball Bond Shear (3 Messages)
BGA lighting adjustment (4 Messages)
BGA Query (3 Messages)
BGA retention (4 Messages)
BGA rework (2 Messages)
BGA Scaling (10 Messages)
BGA780 tied directly to gnd plane (2 Messages)
Bliss carts with non-ESD flooring (6 Messages)
Board Shop Outgoing QC Measurement Suggestions (4 Messages)
Capability for current carrying (2 Messages)
Carts (2 Messages)
cavities? (2 Messages)
Cleaning of via holes under components (18 Messages)
Co-Located Expo, APEX and Designers Council Highlight Latest Technologies (1 Message)
Component Inventory/Storage (5 Messages)
Conformal coating over Rosin flux (4 Messages)
Congratulations Werner! (9 Messages)
Copper/Molybdenum/Copper used for PWB heatsink ? (3 Messages)
Cumulative damage from ESD (13 Messages)
Data Collection Methods (1 Message)
DEK Formflex (6 Messages)
Design for IPC solderability coupon "S" (4 Messages)
DPU and PPM (5 Messages)
electrical testing.. ECT 9090 (2 Messages)
electroplating newbie (9 Messages)
ENIG solder joint embrittlement (29 Messages)
Equipment Validation (1 Message)
Flexible circuit assembly (5 Messages)
Flexible Circuit Queries (1 Message)
Flip Chip Diode 0205 (6 Messages)
FR4 and rework (3 Messages)
Fun with electroplating (5 Messages)
Gap Analysis (1 Message)
Gold Platinum Wire (2 Messages)
Grease in connectors. (2 Messages)
Gross surface roughness and solderability (5 Messages)
Handling flex rigid (3 Messages)
heavy copper (4 Messages)
Heavy copper foil (4 Messages)
High temp soldermask? (11 Messages)
high tg laminates (1 Message)
How many SMT capacitors / Resistors IPC Spec's allows to be replaced? (5 Messages)
How to estimate the amount of lead in a PCB-Assembly ? (2 Messages)
IC storage as an alternative to bake-out and re-sealing the IC tr ays (2 Messages)
IC storage as an alternative to bake-out and re-sealing the IC trays (1 Message)
ICOM 5000 Contamination Tester (1 Message)
in search of a microscope (8 Messages)
Inductance test set (1 Message)
inmmersion silver (6 Messages)
IPC Cleaning Evaluation using B-36 coupons (4 Messages)
IPC Defect vs. Root Cause Matrix (10 Messages)
IPC document for answering lead free surveys (2 Messages)
IPC-7095 BGA land szie approximation & 0.8mm BGA (1 Message)
Keeping in Touch (6 Messages)
Lead Free (1 Message)
Lead-free HASL (6 Messages)
LGA Rework (2 Messages)
Material C11000 /Any ideas? (2 Messages)
Max Current Brain Teaser (8 Messages)
measuring tool (11 Messages)
Mechanical Reliability Test Methods (8 Messages)
Membrane Keypad Problems (1 Message)
Microminiature Coaxial connectors (1 Message)
more cam questions.. (1 Message)
Non Round BGA Pads (5 Messages)
Obsolete parts (1 Message)
Opportunities at the DLS in Montreal (1 Message)
Outsourcing PCA baking (1 Message)
P-PAP Documentation (2 Messages)
Parts flipping in Pocket Carrier Tape on Pick and Place Machine (6 Messages)
Pb Free PB Asy (5 Messages)
Peter Duncan where are you (3 Messages)
Phosphorous in epoxy molds (12 Messages)
Pink Ring not for space application? (1 Message)
Plasma (3 Messages)
populated board bake out at temperatures below 100 C (3 Messages)
Positive data for ENIG (2 Messages)
PPAP documentation (1 Message)
ppm rate for BGA (1 Message)
process question (3 Messages)
PTH Cu Plating Thickness-To Be or Not to Be (Class II) (13 Messages)
Punching PCBs (1 Message)
Question about wetting (18 Messages)
Question on a Wrist Strap (5 Messages)
Question on Which IEC Standard (1 Message)
Questions & Opportunity (DLS) (1 Message)
RE : [TN] BGA lighting adjustment (7 Messages)
RE : [TN] DPU and PPM (3 Messages)
Recommendations for a book on plating (3 Messages)
Refurb Vendor Feedback (1 Message)
Reliability solder (7 Messages)
Rework of gold plated PCB's (1 Message)
Robert Coburn/TDI_NOTES is out of the office. (1 Message)
SAC Solder Joint Embittlement (1 Message)
Samsung P&P (1 Message)
Scanning a document and saving it as a pdf file (1 Message)
screen stencil making (2 Messages)
Scum ring or Ring Mask on pad (4 Messages)
Selective Edge Plating (1 Message)
Silk screen changing color (4 Messages)
Silver finishings (3 Messages)
Skip Lot inspection (6 Messages)
SMT adhesive Handling (2 Messages)
SMT Glue and Paste with Wave solder (6 Messages)
SMT Glue and Paste with Wavesolder (11 Messages)
SNEC Meeting (1 Message)
Solder Joint Strength (5 Messages)
Solder side CSP Glob top (1 Message)
Solder Voids (1 Message)
Sources of Detailed information on gold in a solder join t (6 Messages)
Sources of Detailed information on gold in a solder joint (4 Messages)
Spot welding on Trimmer cap (1 Message)
spray nozzle configuration for etching (7 Messages)
spray nozzle pressure (4 Messages)
Stainless Steel Wash Tray / Basket (4 Messages)
Standard Data Exchange Formats for SMT Placement (5 Messages)
TAP Controller Program (1 Message)
thermal conductivity (2 Messages)
thermal cycle testing (3 Messages)
This weekend's motto (5 Messages)
time and attendance tracking.. (2 Messages)
Tin Whiskers Webcast - Sign-up TODAY! (4 Messages)
Tin Whiskers Webcast - Sign-up TODAY!--> How? (3 Messages)
uploading Fuji Propers to Fujicam (6 Messages)
vacuum baking populated circuit cards (2 Messages)
via carring current (1 Message)
Via current carrying (2 Messages)
Warpage after PLSM (5 Messages)
Water Soluble Lead-Free Solderpaste (2 Messages)
[DC] Cleaning of via holes under components (1 Message)
[TN] How to estimate the amount of lead in a PCB-Ass embly ? (2 Messages)
[TN] How to estimate the amount of lead in a PCB-Assembly ? (2 Messages)