A question for any PCB design guru's out there. I've been asked a question
about the current carrying capacity of vias, in this case we have a board
carrying 100A. We have an array of vias for interconnection and if I do a
calc based on a 0.035" dia hole with 0.002" of plating in the hole and a
temp rise of 30degC, it tells me that each hole should be OK with 10A.
Therefore with an array of 12 holes I should be OK with 100A. However, if I
work it out for a cumulative sum of the holes (ie assume a track 1.2" wide),
then the max current is 55A for the same temp rise. So which is the right
approach, individual holes or the sum of the circumferences?

Regards
Ian Fox
Goodrich Engine Controls

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