回复: [TN] BGA REWORK (1 Message)
0402 Inductor Pad Geometry (2 Messages)
2512 Chip Resistors (2 Messages)
2d or 3d paste inspection & Samsung Aerospace benchmark (2 Messages)
<No subject> (2 Messages)
About Cleanliness (Solvent Extract Conductivity) (7 Messages)
Analysis of part lead solderability (3 Messages)
ANSI/IPC-S-815 (1 Message)
Antw: Re: [TN] Solder Joints (1 Message)
Antw: [TN] BGA Thermal Cycling (2 Messages)
Antw: [TN] voids in BGA (2 Messages)
Anybody looking for a new challenge/job? (1 Message)
AOI for low vol-high mix line!! (3 Messages)
Assembly of G-200/Polyimide (2 Messages)
ASW Soldering Handbook (3 Messages)
Automated Imaging (1 Message)
back plane assembly process (2 Messages)
Backplane Press Fit Connector specification (3 Messages)
Baking PWA before BGA rework (6 Messages)
Ball soldering for high voltage PCB assembly (8 Messages)
Basic press fit tooling system (2 Messages)
Best Practices in High Volume Lay up & Lamination (1 Message)
BGA for Space Applications (3 Messages)
BGA REWORK (6 Messages)
BGA Thermal Cycling (2 Messages)
BGA/caps placement (6 Messages)
BGAs voids in solder (1 Message)
buried capacitor (1 Message)
CBGAs Information (1 Message)
Ceramic BGA reballing source? (4 Messages)
ceramic ferrule connector shortage (1 Message)
Ceramic pvd coatings for optics/electronics industry? (1 Message)
Circuit Board Trace Repair (3 Messages)
Cleaning Help Needed (9 Messages)
Clipart of electronic components (1 Message)
Component placement & orientation - during reflow ? (3 Messages)
Component shortages...a poll, sort of... (5 Messages)
Composition measurement of high lead solder alloy (1 Message)
Concrete floor & ESD (1 Message)
Conformal Coating & Press Fit Connectors (1 Message)
conformal coating of Duroid RF boards (1 Message)
Continuous Flow (2 Messages)
Contract Manufacturing (1 Message)
Copper Clad Laminate vs Storage Condition Requirment and Shelf-Life (1 Message)
Copper measurement (3 Messages)
cost difference class 3 vs. class 1 (6 Messages)
cost difference class 3 vs. class 1 revised (2 Messages)
COVER TAPE (3 Messages)
CPVC vs. PVC (4 Messages)
Critical question via plugging- Does need to apply from both side s? (1 Message)
Critical question via plugging- Does need to apply from bothsides? (1 Message)
Crosshatch vs Solid Fill (4 Messages)
Crosshatch vs. Solid Fill (1 Message)
CTE (3 Messages)
CTE of FR-2 (1 Message)
Current carrying capacity (2 Messages)
Data Storage and Retention (1 Message)
Databases (1 Message)
Delta "T" on Profile (1 Message)
die in leadframe (2 Messages)
Diode Polarity silkscreen markings (7 Messages)
Double Treat Scratches (2 Messages)
E-mail forum etiquette (1 Message)
EEPROM Issue / Questions (1 Message)
Electro-Prep (4 Messages)
Electronic Assembly training (2 Messages)
ENIG (4 Messages)
ENIG + BGA's (1 Message)
epsilam-10 (3 Messages)
Equipment Search (2 Messages)
ESD and Cement floors (1 Message)
ESD and Concrete Floors (5 Messages)
Etched Pits in Traces... (12 Messages)
Etched Pits in Traces...cross sections (sort of) (3 Messages)
Exposed power-ground plane (6 Messages)
Fiducials and HDI (12 Messages)
flex vendor needed (2 Messages)
Flex Wrinkling during Hot Roll Photo Resist Lamination (1 Message)
Flip chip high-lead bump failures (1 Message)
Flux free soldering of Sn/Pb (4 Messages)
Flux Station (Flux Dipping) (1 Message)
GaAs Cracks (1 Message)
GNT4601 punch (1 Message)
Gold Finger fab note (1 Message)
HDI definition (4 Messages)
Heavy BGA's, now it's fine-pitch ! (17 Messages)
Heller Forming Equipment (2 Messages)
How to handle Ceramic BGAs with non collapsing balls in CAD? (1 Message)
How to Measure A Radius (1 Message)
Hydrometer Calibration (4 Messages)
ICT probe on surface mount component terminations? (2 Messages)
IEC standards (4 Messages)
Information on Design Standard (4 Messages)
Ink Jet Printers for barcoding PCBs (1 Message)
INK MARKING (6 Messages)
Inline Laser Marking or Ink Jet? (3 Messages)
IPC NEWS RELEASE- IPC-7095 FOCUSES ON BGA RELIABILITY ISSUES (1 Message)
IPC Standards on Stacked Chip Components (4 Messages)
IPC-610C & J-STD-001C (2 Messages)
IPC-782-3-31 BREAKAWAYS? (2 Messages)
IPC-A-610 and ANSI-J-STD (6 Messages)
IPC-MIL-910A Class3 (3 Messages)
IPC-TM-650 Number 2.4.21---Help (2 Messages)
IPCWorks 2000 Proceedings (1 Message)
JSTD or A610 (4 Messages)
Koki reflow ovens (1 Message)
Laser (3 Messages)
LCD TAB connection to PCB (1 Message)
Lead Forming Equipment (2 Messages)
loaded board rework (1 Message)
Looking for an Arbitrator (1 Message)
Looking for Arbitrator (7 Messages)
Looking for assembled board flex/bow/twist specifications (1 Message)
Looking for fab note spec for Gold Finger (3 Messages)
low-loss flex-to-rigid connectors? (2 Messages)
material AR350 (3 Messages)
Measuring Moisture in BGA Packages. (4 Messages)
Meeting, Boston (MA/USA) IPC/DC Sept 19 6pm (5 Messages)
Mounting turret terminals on circuit boards (6 Messages)
multilayer chip capacitors (3 Messages)
Mydata Hydra's (1 Message)
Need spare parts / used equipment (1 Message)
Nickel plating spec: QQ-N-290 (3 Messages)
No-Clean & Clean (1 Message)
Non-Supported Holes (2 Messages)
Nonwetting (2 Messages)
Nu/Era Wave Solder? (1 Message)
Obsolete O/S Tester: Trace 924 (2 Messages)
ODB++ file????? (9 Messages)
Off Shore PCB Fab (1 Message)
Off topic: why viewing driveway files didn't work for me (2 Messages)
Old Cleanliness Testers (1 Message)
Open Slots Available for Free Forums at Expo 2001 (1 Message)
OSP boards and White residue (13 Messages)
OSP Products and Suppliers (1 Message)
Pad/Land Design Questions (4 Messages)
Panasert Chip Mounter (2 Messages)
passivation!! (1 Message)
paste area for case on a to 263 5 lead part (4 Messages)
Paste Inspection (1 Message)
PCB Layout quotation (4 Messages)
PCB Materials Handbook (4 Messages)
PCB Schematic Capture Programs (1 Message)
PCBs warping after SMT reflow (3 Messages)
PCI spec (3 Messages)
PDF to GBR Conversion? (1 Message)
PEM ScrewStick? (1 Message)
Perfect Test for registration (3 Messages)
Photo (2 Messages)
Pin in Hole (3 Messages)
Plated vias under BGA-mask prior to wave? (2 Messages)
Plugging (not tenting) of via fab notes (7 Messages)
Press Fit Connectors (2 Messages)
Process Analysis in Manufacturing (2 Messages)
processing of micro BGA (2 Messages)
prototyping with CCGA (1 Message)
Q for Werner E? (2 Messages)
Q-charts (3 Messages)
QFP 20 mils pitch printing (3 Messages)
Question about BGA self center feature (1 Message)
Question about max. g/ball for BGA self center (2 Messages)
Réf. : [TN] QFP 20 mils pitch printing (1 Message)
Re Paste Reflow (1 Message)
Re Toe Down (1 Message)
Re-inventing the Wheel (7 Messages)
Re2010 (1 Message)
Reflowing BGAs (2 Messages)
ReMounting Terminals (1 Message)
Resistance welding a nickel strap to pads (1 Message)
Re] Contamination of leads (4 Messages)
RE] TN] Contract Manufacturing (1 Message)
ROGERS 3006 MATERIAL (1 Message)
SAP QM Module Question (1 Message)
Seeking Halogen-Free Laminate Manufacturers (2 Messages)
Seeking users of 'MLV' equipment (1 Message)
seminar comparison (1 Message)
Silicone (5 Messages)
Silver Through hole etc? (1 Message)
Small device marking (2 Messages)
SMT Vibration Testing-- HELP! (3 Messages)
SNEC Meeting Notice (1 Message)
Solder Beads (the dreaded little beasts) (2 Messages)
Solder Joint Reliability (1 Message)
Solder Joints (2 Messages)
Solder Mask Peel (4 Messages)
Solder Paste Height monitoring (3 Messages)
Solder Paste Inspection Equipment (1 Message)
solder thickness on SMT IC (1 Message)
Solderability Issue (1 Message)
Solderability test (1 Message)
Soldering Iron Testing (2 Messages)
Soldering Question?? (5 Messages)
Soldermask : dry film vs LPI (5 Messages)
Spare Parts for Royonic 412 and 512 (1 Message)
SPC (4 Messages)
Specific BGA Information (2 Messages)
stacking components (5 Messages)
STRESS STRAIN CURVE (1 Message)
Stripping of Photoresist (4 Messages)
Subj] IPC PRINTED CIRCUITS EXPO 2001 (1 Message)
Subj] No-Clean & Clean (1 Message)
Subj] Pogo Pins (2 Messages)
Subj] To Clean or Not To Clean Results (1 Message)
Subj]Contaminated Leads Reply (1 Message)
Tech question. (4 Messages)
thermal conductivity values (3 Messages)
Thermohidrograph (5 Messages)
Thermohygrograph (1 Message)
thin core laminate (3 Messages)
Thin FR#4 substrate (1 Message)
Through-hole Solder Joint inspection and quality criteria (3 Messages)
TN: why do die pads have assigned nets? (1 Message)
TN] Flux free soldering of Sn/Pb (1 Message)
To X-ray or Not to X-ray TYPO Corrected (1 Message)
To X-ray or Not to X-ray. (1 Message)
TO-220 Lead forming (1 Message)
TO-220 standoffs (3 Messages)
Tooling Issue (1 Message)
TPCA 2000 Final Announcement (1 Message)
traces under chip components (3 Messages)
Trudrill 97 (1 Message)
tweezers for fiber handling (3 Messages)
underfill filler (2 Messages)
Universal Winding (2 Messages)
Unsubscribe (2 Messages)
Urgent: Fab related question (3 Messages)
Urgent: Looking for minimum spacing ... (3 Messages)
Use of 2010 Resistors (2 Messages)
Using Sn96.5Ag3.5 Solder Alloy (2 Messages)
Velcro straps (3 Messages)
Vertical Material Handling Carousels... (4 Messages)
Via in Pad (VIP) Technology (4 Messages)
voids in BGA (6 Messages)
Wave soldering bottom SMT, here be the "Jewel"... (1 Message)
Wave soldering bottom SMT, there's hope!!! (10 Messages)
waving IC's (3 Messages)
whisker-standard (1 Message)
why do die pads have assigned nets if the die is not conductive? (1 Message)
wire wrap problem (1 Message)
[TN] IEC standards (1 Message)