Basically the rules are this:

If a solder ball is loose (001 term) it is not encapsulated, entrapped  or
attached to a metal surface (610 terms). In both documents, this is a defect
for all classes.

If there are more that 5 solder balls that are <.13mm in diameter, within a
600 mm2 area, this is a process indicator for classes 2 and 3 (per 610, not
covered in 001).

If a solder ball is entrapped or encapsulated and is withing 0.13mm from a
land or conductor, and does not violate minimum electrical clearance, this
is a process indicator for classes 2 and 3 (per 610, not covered in 001).

If a solder ball is >.13mm in diameter and is entrapped or encapsulated it
is a process indicator for classes 2 and 3 (per 610, not covered in 001).

Any solder ball violating minimum electrical clearance is a defect for all
three classes in both documents.

Anything else (e.g. a solderball <.13mm that is encapsulated and >.13mm from
any conductor) is acceptable.

Hope this helps.

Mary Muller

> ----------
> From:         Steve Kelly[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Steve Kelly
> Sent:         Wednesday, October 04, 2000 12:47 PM
> To:   [log in to unmask]
> Subject:      [TN] FW: IPC-610C & J-STD-001C
>
>  -----Original Message-----
> From:   Steve Kelly [mailto:[log in to unmask]]
> Sent:   Wednesday, October 04, 2000 3:32 PM
> To:     [log in to unmask]
> Subject:        IPC-610C & J-STD-001C
>
> When both documents are called up on a drawing how does one interpret the
> solder ball issue. Section 6.5.3.1 in IPC-610C says 5 solder balls per
> .093
> sq.in. as a process indicator. but the next paragraph says a defect is
> present if the solder ball is not attached to a metal surface. I have
> trouble interpreting J-STD-001C but I think I read zero solder balls.
> Thanks
> for the help.
>
> Steve Kelly
> PFC Flexible Circuits Ltd.
> (416) 750-8433
> [log in to unmask]
>
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