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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 31 Oct 2000 15:59:11 MST |
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This is my first time posting to this forum so I hope it works.
I am a process engineer for a circuit board manufacturer. The question is
what are typical reflow parameters for ENIG finishes with BGA components?
Bake ramps, dwell times, peak temps., cool down rates, time above liquidus
etc.
Any help would be greatly appreciated.
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