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October 2000

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Subject:
Re: Heavy BGA's, now it's fine-pitch !
From:
Mike Sewell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 31 Oct 2000 09:12:22 EST
Content-Type:
text/plain
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text/plain (16 lines) 
Re: "Heavy BGAs" and "solder paste vs. flux paste",  would only fluxing
appreciably reduce the solder volume (vs. applying solder paste) and hence
likelihood of bridging?  Would it be worth the tradeoff in wetting...?

Comments invited,
Mike Sewell

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