Sorry. AWS Soldering Handbook (http://www.amweld.org/handbook.html)
"Ingemar Hernefjord (EMW)" wrote:
> How, where, when can you buy that book?
>
> Regards
> Ingemar Hernefjord
> Ericsson Microwave Systems
>
> -----Original Message-----
> From: David Fish [mailto:[log in to unmask]]
> Sent: den 25 oktober 2000 11:15
> To: [log in to unmask]
> Subject: [TN] ASW Soldering Handbook
>
> Two things:
>
> 1 Dr. Paul T. Vianco, of Sandia National Laboratories, wrote this third
> edition of the "Soldering Handbook", as a project of the American
> Welding Society C3 Committee on Brazing and Soldering. This is the long
> over-due update of the 1977 legendary "AWS Soldering Handbook." In Dr.
> Vianco's words, the purpose of the text is to provide information to,
> "...allow soldering technology to be more fully utilized in advance
> structural joining applications, as well as to enhance its continued use
> as a critical assembly technology for the electronics industry."
>
> Initially, I was uneasy that this focus on "advanced structural joining
> applications" would distract from my focus on soldering in electronic
> assembly. It did not. Actually, many of the structural topics, such as
> soldering with tin / zinc alloys in heat exchanger applications, were
> interesting. Other structural topics, such as soldering a 'tube into a
> manifold', could be visualized in an electronic assembly context.
> Finally, one could easily skip those topics without loosing the intent
> of the material or the flow of the text. The book is well written, well
> edited, and intelligent.
>
> The chapters of the book are: Fundamentals Of Soldering Technology,
> Solder Materials, Substrate Materials (solderable surface materials),
> Fluxes, Solder Pastes, Assembly Processes, Inspection Techniques For
> Product Acceptance And Process Optimization, and Environment, Safety And
> Health.
>
> Comprising nearly one third of the book, the Fundamentals Of Soldering
> Technology chapter is excellent in its breadth and straightforward
> explanations of metallurgy, solder joint design, alloy properties, and
> materials measurements. For instance, I can now read phase diagrams to
> determine the material compositions (phases) that can form as an alloy
> cools from liquid to solid. This eluded me at college enduring a
> materials course and later staring at van Vlack.
>
> Realistically, the Assembly Processes chapter warrants a book in its own
> right, given the range of assembly processes involved in structural and
> electronic soldering. Dr. Vianco limits the description of material
> receipt, pre-assembly, soldering, post-assembly cleaning, and storage
> processes to the top level.
>
> "Inspection Techniques For Product Acceptance And Process Optimization"
> gives a good overview of the use of laboratory analytical instruments
> and mechanical stress testing. It misses the boat by not addressing
> mathematics based improvement techniques, such as process
> characterization and design of experiments. Finally, the section of this
> chapter discussing acceptable quality level (AQL) is an anachronism for
> companies aiming for six sigma process control.
>
> 2 Paul T. Vianco will answer questions OnBoard ForumTM
> (http://www.SMTnet.com) Begins: Oct. 24, 2000 12:00 AM ET Ends: Oct. 26,
> 2000 5:00 PM ET
>
> Dave Fish
>
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