Sorry. AWS Soldering Handbook (http://www.amweld.org/handbook.html) "Ingemar Hernefjord (EMW)" wrote: > How, where, when can you buy that book? > > Regards > Ingemar Hernefjord > Ericsson Microwave Systems > > -----Original Message----- > From: David Fish [mailto:[log in to unmask]] > Sent: den 25 oktober 2000 11:15 > To: [log in to unmask] > Subject: [TN] ASW Soldering Handbook > > Two things: > > 1 Dr. Paul T. Vianco, of Sandia National Laboratories, wrote this third > edition of the "Soldering Handbook", as a project of the American > Welding Society C3 Committee on Brazing and Soldering. This is the long > over-due update of the 1977 legendary "AWS Soldering Handbook." In Dr. > Vianco's words, the purpose of the text is to provide information to, > "...allow soldering technology to be more fully utilized in advance > structural joining applications, as well as to enhance its continued use > as a critical assembly technology for the electronics industry." > > Initially, I was uneasy that this focus on "advanced structural joining > applications" would distract from my focus on soldering in electronic > assembly. It did not. Actually, many of the structural topics, such as > soldering with tin / zinc alloys in heat exchanger applications, were > interesting. Other structural topics, such as soldering a 'tube into a > manifold', could be visualized in an electronic assembly context. > Finally, one could easily skip those topics without loosing the intent > of the material or the flow of the text. The book is well written, well > edited, and intelligent. > > The chapters of the book are: Fundamentals Of Soldering Technology, > Solder Materials, Substrate Materials (solderable surface materials), > Fluxes, Solder Pastes, Assembly Processes, Inspection Techniques For > Product Acceptance And Process Optimization, and Environment, Safety And > Health. > > Comprising nearly one third of the book, the Fundamentals Of Soldering > Technology chapter is excellent in its breadth and straightforward > explanations of metallurgy, solder joint design, alloy properties, and > materials measurements. For instance, I can now read phase diagrams to > determine the material compositions (phases) that can form as an alloy > cools from liquid to solid. This eluded me at college enduring a > materials course and later staring at van Vlack. > > Realistically, the Assembly Processes chapter warrants a book in its own > right, given the range of assembly processes involved in structural and > electronic soldering. Dr. Vianco limits the description of material > receipt, pre-assembly, soldering, post-assembly cleaning, and storage > processes to the top level. > > "Inspection Techniques For Product Acceptance And Process Optimization" > gives a good overview of the use of laboratory analytical instruments > and mechanical stress testing. It misses the boat by not addressing > mathematics based improvement techniques, such as process > characterization and design of experiments. Finally, the section of this > chapter discussing acceptable quality level (AQL) is an anachronism for > companies aiming for six sigma process control. > > 2 Paul T. Vianco will answer questions OnBoard ForumTM > (http://www.SMTnet.com) Begins: Oct. 24, 2000 12:00 AM ET Ends: Oct. 26, > 2000 5:00 PM ET > > Dave Fish > > --------------------------------------------------------------------------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > --------------------------------------------------------------------------------- > > --------------------------------------------------------------------------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------