ÄTNÅ HASL (2 Messages)
(FAB)Pad lift & Cracking (2 Messages)
0.004" trace/space technology (4 Messages)
11,5 oz Double Sided FR4 (3 Messages)
1mm PBGA Assembly (3 Messages)
2220 ceramic cap failure (3 Messages)
3 legged transistors (4 Messages)
: Actel CQ132 (2 Messages)
: Cause and Corrective Action (1 Message)
: Printer printing accuracy and repeatability. (2 Messages)
: Testing of OCC board. (1 Message)
<No subject> (16 Messages)
Accurately Positioning Components on PWBs (2 Messages)
Alpha wire FIT-130 product line. (1 Message)
Annular Ring ! (4 Messages)
Annular Ring!- May we have an arbiter please...Paging Mr. ... (2 Messages)
Annular Ring!- May we have an arbiter please...Paging Mr. Coyle! (1 Message)
Assembly : temp. profile for glue cure (1 Message)
Assembly: temp. profile for glue cure (1 Message)
ASSY : Wavesoldering : Dross formation (4 Messages)
Assy: Contact CS-400E Efficiency (4 Messages)
Assy: Low quantity Press-fit connector tip... (4 Messages)
ASSY: Modified ETFE Insulation (1 Message)
Assy: QFP leadframe tin-lead finish (10 Messages)
Assy: Solder-ball FAQ (1 Message)
Assy: stencil cleaning liquid temps (2 Messages)
assy: tin at $2.48/lb (1 Message)
assy: wave solder fingers (2 Messages)
ASSY:mixing of high and low-temp PbSn alloys (1 Message)
Attaching Al heatsink to Si die (7 Messages)
auto dosing systems (2 Messages)
Auto Insertion of Triacs (1 Message)
AVX Multiguard and Current Leakage Issues (1 Message)
AW: [TN] Electroless Nickel for Aluminum (2 Messages)
Backfill Recommendation (2 Messages)
Bare Board imperfections (5 Messages)
Bare Board imperfections -Reply (1 Message)
Bare Die Supplier (1 Message)
Bareboard imperfections (1 Message)
Bend/flex (4 Messages)
BGA rework question (3 Messages)
BGA Shelf Life (1 Message)
BGA X-ray (1 Message)
BGA X-ray inspection (1 Message)
Blind vias (1 Message)
Board Assembly Quoting (1 Message)
card edge connectors (1 Message)
CEM 1 vs G10 (3 Messages)
Chemring (3 Messages)
Cleaning Solder Pallets (2 Messages)
Cleaning Un-cured SMA (1 Message)
COG mounting techniques (1 Message)
company address (3 Messages)
Conductive Carbon Ink / Silver Polymer Thick Film on Card Edge Contacts (2 Messages)
Conformal Coating Needed?? (2 Messages)
Conformal Coatings (2 Messages)
conformal coating[SHEEN CUP 401/4 specification] (3 Messages)
Copper Plating (7 Messages)
Copper plating & Copper thickness (9 Messages)
copper plating and anode area (1 Message)
Copper plating Anode ratio (2 Messages)
Corrrection Annular Ring ! (1 Message)
Counter Sunk Screws to mount PCBs (3 Messages)
Covering Vias (2 Messages)
Daisy chain (3 Messages)
DEK GSX265 PROFLOW HEAD UPDATE (1 Message)
DES: Pressfit Connectors & White Tin (2 Messages)
dewetting (1 Message)
DFM for SMT Spec. (2 Messages)
Direct Bond Copper (1 Message)
Electroless Nickel for Aluminum (1 Message)
electroless pth (2 Messages)
Electroplating and Surface Finishing Society National Convention (1 Message)
ENC: [TN] Re[2]: [TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS (1 Message)
Epoxy Stencil Design? (3 Messages)
Epoxy Stencil Design? -Reply (1 Message)
FAB: Cupric Chloride etching (7 Messages)
Failure of Rigid Flex (1 Message)
Finding the man who helped me !(+/-3mill) (1 Message)
FINE LINE COPPER PLATING (8 Messages)
Fine pitch (1 Message)
Fine Pitch info (2 Messages)
fixing exposed copper/traces (3 Messages)
Flex to FR4 with hot bar (1 Message)
Flexible Circuits (3 Messages)
Flexible Conformal Coating (1 Message)
Flying Grid Bare Board Testers (1 Message)
FOR YOUR HELP (3 Messages)
FR4 properties (3 Messages)
Fume Extraction for Manual Soldering (2 Messages)
GenCAM (1 Message)
Gold Finger Stains (4 Messages)
Gold Finger Stains & Contact Resistance. (1 Message)
Gold mask etchant (3 Messages)
HASL (12 Messages)
Heat Sinks on PWBs (3 Messages)
Heated ET (5 Messages)
Helium leak rate measurements. (1 Message)
Help locating PCB drill bits (1 Message)
Help needed on PBGA Wire Bonding (1 Message)
help! -- how to meet the +/-3mil(0.076mm)routing tolerance (1 Message)
hole plug source (4 Messages)
Hot Bar Production Methods (2 Messages)
IL Clearance Calculation (1 Message)
Immersion Gold SMT PWB (1 Message)
Immesion Tin (The other White meat) (2 Messages)
Info on Nelco-6 laminate material (2 Messages)
Inks used for Test Stamps on PCBs (2 Messages)
Intel uBGA Flash, Bottom Side SMT? (1 Message)
Intermittent Dewetting (2 Messages)
IPC 4101 (2 Messages)
IPC Designers Council Elections (1 Message)
IPC News Release: IPC Creates Equipment Exchange Website (1 Message)
IPC News Release: IPC/SMEMA Council to Intoduce new Trad... (1 Message)
IPC News Release: IPC/SMEMA Council to Intoduce new Trade ... (1 Message)
IPC News Release: IPC/SMEMA Council to Intoduce new Trade Show (2 Messages)
IPC News Release: IPC/SMEMA Council to Intoduce newTrade ... (1 Message)
Jay DeKing (1 Message)
KODAK 960 FILM PROCESSOR (1 Message)
Laminate (2 Messages)
Layers Count vs Thickness (1 Message)
Lead bending. (2 Messages)
Lead-Free legislation (2 Messages)
life time of Ni/Au contacts? (2 Messages)
Lines Between Pins (1 Message)
Logic Device, drop test failure (3 Messages)
Looking for dummy ceramic QFP parts (4 Messages)
Marking Pen (1 Message)
Marking systems (2 Messages)
mcm designers (1 Message)
measuring Shear Force (1 Message)
Melting point of 90/10 and 95/5 solder (5 Messages)
Microscopes & Cross Sectioning equipment for HDIS (2 Messages)
MIL-1235 - Replaced ?? (2 Messages)
MIL-C-28809 (3 Messages)
modulus & Poisson's ratio (2 Messages)
Moisture sensitive (2 Messages)
Moisture Sensitive Devices (4 Messages)
mounting SOIC using Chipshooter (3 Messages)
neckdown (4 Messages)
Need a Number - Solder Station One (3 Messages)
Need help (2 Messages)
Need Kleenox "P" MSDS and information (2 Messages)
Need PCB Designer in Houston (2 Messages)
need test lab for no clean process (3 Messages)
Ni/Pd/Au Lead Finish (2 Messages)
No SUBJECT e-mail (1 Message)
non wetting agent for epoxy resin (1 Message)
OSP Dwell between thermal processes (1 Message)
Overcoat Pen (1 Message)
P and B content in electroless nickel (1 Message)
PANEL AGITATION IN DEEP NICKEL/GOLD PLATING. (1 Message)
Parylene Conformal Coating (2 Messages)
Pattern Copper Plating (3 Messages)
Pb in ceramic components (4 Messages)
PCB ASSEMBLY COST ANALYSIS (1 Message)
PCB FAB SHOPS WITH BELLCORE TR-NWT-000078 CERTIFICATION (2 Messages)
PCBA Routing Survey (3 Messages)
Problem in Gold Plating (6 Messages)
Problem in Gold Plating -Reply (1 Message)
Process courses (2 Messages)
Protective laminate (1 Message)
Pulse Plating - Copper (1 Message)
Pulse Plating Versus DC Plating (1 Message)
Pulse Plating: Cu and PCB (1 Message)
Q on Ion Chromatography (1 Message)
QFP leadframe tin-lead finish (4 Messages)
Quoting Board Builds (1 Message)
Quoting Board Builds -Reply (1 Message)
Re Cause/Effect (1 Message)
Re Gold (1 Message)
Re Repair Limits (1 Message)
Re SolderBalls (7 Messages)
RE True Position and Registration on Fab (1 Message)
ReCard Edge Connectors (1 Message)
Recent Discussion on Ni/Pd Finished ICs (1 Message)
ReEnvironControl (1 Message)
Reflow ovens (1 Message)
Removing wet SMT epoxy from flex circuits.... (2 Messages)
Repair Limits (2 Messages)
Resource needed for Palladium/Nickel Service (2 Messages)
rogers (4 Messages)
Scoring PCAs (2 Messages)
Screenprint problems (3 Messages)
Seed for Cu plating in high freq. (1 Message)
Selective Soldering (3 Messages)
Selective Soldering Machine (2 Messages)
shear testers (2 Messages)
Shelf life of HASL fabs. (2 Messages)
SIGNOFF * (1 Message)
silver migration (5 Messages)
Simple Component Source. (2 Messages)
SMEMA Printer and SMPI Conveyors (2 Messages)
SMT Glue (2 Messages)
SMT solder balls (1 Message)
SMT ZENER (2 Messages)
SMTA Silicon Valley mtg DFM & ESMT Design for Manuf (1 Message)
Solder balls on chip components (3 Messages)
solder comparisons (1 Message)
Solder mask Dimple Plates (1 Message)
Solder Mixing (1 Message)
Solder on goldfinger (1 Message)
solder paste inquery (1 Message)
Solder paste inspection (1 Message)
Solder Paste???? (2 Messages)
solder resist between solder land to prevent solder brid ging (1 Message)
solder resist between solder land to prevent solder bridging (1 Message)
Solderability Head Scratcher (2 Messages)
Soldering Palladium plated leads (1 Message)
Soldering to Gold (4 Messages)
Soldermask adhesion over tin/lead (2 Messages)
Soldermask adhesion over tin/lead -Reply (1 Message)
Soldermask Breakdown in Humidity Chamber (2 Messages)
SOLDERMASK PLUGGED VIAS (1 Message)
Soldermask surface prep (1 Message)
SPC (5 Messages)
Spec ref for lifted pad after assy (3 Messages)
Specctra router Question (1 Message)
Specification (1 Message)
SRT (3 Messages)
Standards (1 Message)
Stripping Enamel covered wires (2 Messages)
Subj: Re: [TN] SMT ZENER (3 Messages)
Subscribe (1 Message)
Syracuse Area DC Chapter (1 Message)
Temp & Humidity in SMT plant. (1 Message)
Temp Profiling (3 Messages)
Test message - please disregard (1 Message)
TEST: Flying "Grid", not "Probe" (1 Message)
Thermal Resistance Testing labs (1 Message)
THERMOPLASTIC RELIABILITY (5 Messages)
Through hole vs SMT (1 Message)
Tin Oxide (8 Messages)
Tin/Lead Solder Coating Minimum Thickness Requirements (11 Messages)
Touch Up Pen's (2 Messages)
True Position and Registration on Fab (3 Messages)
Unclad FR4 Laminate? (1 Message)
UV Cure Touchup (1 Message)
Via holes on SMD pads? (4 Messages)
Vision Systems for inspection (3 Messages)
Visual Inspection of Misprinted boards after cleaning (2 Messages)
wage and rates for QA managers (2 Messages)
Wanted: Motorola BGA (1 Message)
wash mashine noise on assembly floor (4 Messages)
Wave Solder Fixtures (9 Messages)
Weird Wave Soldering Defect... (7 Messages)
Wet lamination (1 Message)
What happens when polarising occurs (1 Message)
Wierd Wavesoldering defect (1 Message)
Will insufficient solder cause high loss (1 Message)
Working Environment Controls (1 Message)
your mail (1 Message)
your warning (4 Messages)
[Fwd: Solder-ball] (3 Messages)
[TN] Annular Ring ! (1 Message)
[TN] Copper plating & Copper thickness (1 Message)
[TN] Intermittent Dewetting (1 Message)
[TN] Moisture Sensitive Devices (1 Message)
[TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS (1 Message)
[TN] Re[2]: [TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS (2 Messages)
[TN] Soldering to Gold (1 Message)
[TN] Temp Profiling (1 Message)
[TN] True Position and Registration on Fab (1 Message)
[TN] Weird Wave Soldering Defect... (1 Message)
[TN] [Fwd: Solder-ball] (1 Message)