Address,

     This question is for those Assembly Manufacturers that are assembling
     PCBs with an Entek 106A OSP finish from Enthone.  I have a narrow
     process window of 6 hours before the component side must be assembled
     and reflowed.

     Do other PCA manufacturers have this same criteria?  Have you been
     able to extend the process window from when the PCA has hit its first
     thermal excursion to its next?  Where you able to quantify the results
     by increasing the process window?  If the criteria is not the same,
     what do you currently spec, less or greater and WHY?

     Please advise.  Thanks.

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