Rick Thompson,

I read your e-mail to the TechNet and would like to respond.

For background, TI converted to Ni/Pd finish for its Logic and Linear Product
groups in 1989.  With nearly 10 years and 30 Billion Ni/Pd finished ICs in the
field we have a pretty good base of experience to speak from.  We have a web
site which shows the technical papers we have written on the topic of Ni/Pd
finished ICs.  The web site is located at:

"http://www.ti.com/sc/docs/asl/palladm/index.htm"

There are papers on several different topics available for downloading from
this web page.  Also, the "Palladium Lead Finish User's Manual" is accessible
here.  It is a lengthy document so if you prefer to order a hardcopy just call
the phone number listed and it will be shipped to you.  This book is a
compilation of our experience and answers most users' questions.

In regard to your specific question/issue, I would point you to the paper
entitled "Evaluation of Water Soluble and No-Clean Solder Pastes with Palladium
Plated and Solder Plated SMT Devices".  Our evaluation showed that with water
soluble and no-clean pastes changes to the  2 factors of steam age and reflow
profile had little impact on the contact angle seen.  Contact angle is a
measure many people use to gauge wettability.  We did find that variations
between the different solder pastes evaluated did have a strong impact on
contact angle.  I am willing to discuss details of our findings in a one-on-one
discussion rather than in a forum atmosphere.  We are actively working with
solder paste vendors to verify compatibility of their pastes with Ni/Pd lead
finish components.

In general, for our Logic and Linear product groups we have been 100% converted
to Ni/Pd lead finish since the early 1990s with the conversion process taking
about 1-1.5 years.  We believe that Ni/Pd finish for IC leads is an excellent
Pb-free option for IC manufacturers and users and with over 30 Billion units in
the field it is now safe to call this a proven technology.

We would be glad to discuss your specific issue in more detail if you desire.
Please contact me at the address below or contact Don Abbott ([log in to unmask])
at our plating operation in Attleboro, Mass.   Also, any other users who might
have questions can view our website or contact me directly.

Best regards,

Douglas W. Romm
[log in to unmask]
Texas Instruments
Phone: 903 868-7388; Fax: 903 868-6002
US mail: M/S 812, PO Box 84; Sherman, TX 75091
Shipping: 6412 Hwy 75 South, Sherman, TX 75090