Rick Thompson, I read your e-mail to the TechNet and would like to respond. For background, TI converted to Ni/Pd finish for its Logic and Linear Product groups in 1989. With nearly 10 years and 30 Billion Ni/Pd finished ICs in the field we have a pretty good base of experience to speak from. We have a web site which shows the technical papers we have written on the topic of Ni/Pd finished ICs. The web site is located at: "http://www.ti.com/sc/docs/asl/palladm/index.htm" There are papers on several different topics available for downloading from this web page. Also, the "Palladium Lead Finish User's Manual" is accessible here. It is a lengthy document so if you prefer to order a hardcopy just call the phone number listed and it will be shipped to you. This book is a compilation of our experience and answers most users' questions. In regard to your specific question/issue, I would point you to the paper entitled "Evaluation of Water Soluble and No-Clean Solder Pastes with Palladium Plated and Solder Plated SMT Devices". Our evaluation showed that with water soluble and no-clean pastes changes to the 2 factors of steam age and reflow profile had little impact on the contact angle seen. Contact angle is a measure many people use to gauge wettability. We did find that variations between the different solder pastes evaluated did have a strong impact on contact angle. I am willing to discuss details of our findings in a one-on-one discussion rather than in a forum atmosphere. We are actively working with solder paste vendors to verify compatibility of their pastes with Ni/Pd lead finish components. In general, for our Logic and Linear product groups we have been 100% converted to Ni/Pd lead finish since the early 1990s with the conversion process taking about 1-1.5 years. We believe that Ni/Pd finish for IC leads is an excellent Pb-free option for IC manufacturers and users and with over 30 Billion units in the field it is now safe to call this a proven technology. We would be glad to discuss your specific issue in more detail if you desire. Please contact me at the address below or contact Don Abbott ([log in to unmask]) at our plating operation in Attleboro, Mass. Also, any other users who might have questions can view our website or contact me directly. Best regards, Douglas W. Romm [log in to unmask] Texas Instruments Phone: 903 868-7388; Fax: 903 868-6002 US mail: M/S 812, PO Box 84; Sherman, TX 75091 Shipping: 6412 Hwy 75 South, Sherman, TX 75090