Bill Kasprzak:
- A cold solder connection is identified by Defect 20 of Table 11-1 (Defect 6
applies only to poor/non/dewetting).
- Note that par. 9.1.1 says "shall" which (according to par. 1.4) means the
requirement is mandatory for Class 3 Products, and mandatory for Class 2
Products only if there is no evidence of following a documented process
control program.  So if you have a documented process control program for
producing Class 2 products then it is arguable if any of the requirements of
par. 9.1.1 apply.
- It would seem that your process control plan would cause 100% inspection of
the "lot" for cold solder connections (see par. 12.2.e).  It would also be
reasonable to think that your process control plan would identify the process
corrective action (see par. 12.2.d and 12.2.f) to be taken when such a small
number of connections (3750) are sampled.  Hopefully you don't start tweaking
processes in response to single defects.  Normally I would expect to have the
results of identical (serially run) "lots" pooled to achieve a better overall
picture of the processes.
- "Normal" touch (aka Rework) is discussed by par. 11.1 which says that
defects shall be documented prior to rework.  The "shall" says that this
requirement applies only to Class 3 Products (and Class 2 Products if you
don't have a process control system in place).  If you are building Class 3
Products, or Class 2 Products under a documented process control plan then you
have to identify the discrepant condition as a defect prior to rework (hint,
this sort of attribute data can be used to measure the health of the process
only if it is actually documented prior to rework).
- I think that most folks would fix the cold solder defect and ignore the
process control considerations.  Realistically, a cold solder connection is
pretty unusual in a wave solder system and, if present, would probably not be
a single occurrence.
Hope the above sheds some light.  Jim Moffitt

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