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November 1998

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Subject:
From:
Jac Kroeker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 2 Nov 1998 13:43:50 -0800
Content-Type:
text/plain
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text/plain (23 lines)
I am having trouble posting this message to Technet. If you have seen this
before--- please excuse.

Hi platers and assemblers:
We would like to eliminate electroless copper from our pth line. Has
anybody had any experience with Fidelity's Ultraplate 300? Good, bad or
indifferent?
Are there other better alternatives? I am aware of paladium, but I don't
find it too exciting.
Jac from the great white north eh.

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