(TN): Cracked Chip Capacitor (4 Messages)
***Stress Test Barrel********** (3 Messages)
: ASSY: Visual Inspection. (1 Message)
: FAB: FR4 material (1 Message)
<No subject> (6 Messages)
About BT(bismaleimide triazine) Resin ~! (1 Message)
Acceptance of Panelized Boards (2 Messages)
Adhesive Screen Printer Settings (1 Message)
Adhesive Screen Printer Settings -Reply (3 Messages)
ADMIN: New mail lists identifiers (1 Message)
ADMIN: Posting messages (3 Messages)
ADMIN: Posting messages. (2 Messages)
ADMIN: Unwelcome posting. (1 Message)
Alloy42 (7 Messages)
Alpha OM700 Omegameter (2 Messages)
ALTERNATIVE FINISH (7 Messages)
Aluminium Entry (1 Message)
Anisotropic (z-axis) conductive adhesives (2 Messages)
AOI (4 Messages)
Asking for subscription (1 Message)
Aspect Ratio (3 Messages)
assem: shape code library (1 Message)
assembly (5 Messages)
Assembly (Sn-Pb Solder Joint Contamination) (2 Messages)
Assembly - Solder Joint Failures (1 Message)
Assembly - Solderability (1 Message)
Assembly Aptitude Tests (2 Messages)
Assembly Inspection Equipment (1 Message)
ASSY - Questionnaire - High frequency and solder paste and flux residues (2 Messages)
ASSY -OSP-Preserving Solderability (4 Messages)
ASSY, solder on goldfingers (1 Message)
ASSY: (1 Message)
Assy: Baking prior to Wave & Reflow (2 Messages)
Assy: BGA stuff (3 Messages)
Assy: BGA, dummies, pad finishes, stencils, profile (1 Message)
Assy: BGA, dummies, pad finishes, stencils, profiles, SM opening size, Bd ma (1 Message)
Assy: BGA, dummies, pad finishes, stencils, profiles, SM opening size, Bd material (1 Message)
assy: Biral Lubricants found (1 Message)
Assy: Cold Solder Joint (2 Messages)
ASSY: Cracking of Caps Tech-note (1 Message)
Assy: flux residues (1 Message)
Assy: Gold plated pads (3 Messages)
ASSY: Guidelines/No-Clean soldering (1 Message)
ASSY: IPC Board Finish Conference Supplement to Proceedings (1 Message)
ASSY: Isotropically Conductive Adhesives (2 Messages)
ASSY: J-STD-030 Qualification and Performance of Flip Chip Underfill Materials (3 Messages)
Assy: Placement Machine Measurement (1 Message)
ASSY: SMD processing of Teflon PCB's (1 Message)
Assy: SN10 Solder source (2 Messages)
ASSY: Solder compatibility (2 Messages)
Assy: Solder Failures (2 Messages)
Assy: Soldering on gold plated pads (3 Messages)
ASSY: SOLDERING TO GOLD (2 Messages)
ASSY: Temperature Cycling Test Failures (5 Messages)
ASSY: Using PWBs for structural applications (1 Message)
Assy: Water Soluble Flux (6 Messages)
ASSY:PCB Assy that is Potted (1 Message)
ASSY:PCB Assy that is Potted -Reply (1 Message)
assy:stencil cleaner (3 Messages)
Assy:Use of xray equipment needed! (5 Messages)
Automated Inspection Equipment (4 Messages)
Axial Part Age (2 Messages)
Bed-o-nails testing (4 Messages)
Benchmarking (6 Messages)
Benchmarking - BURIED CAPACITANCE - LASER TECH (1 Message)
Benchmarking - BURIED CAPACITANCE - LASER TECHNOLOGY (2 Messages)
BGA Joint Reliability Under "Static" Stress (2 Messages)
Brittle Solder Joints (1 Message)
Brittle Solder Joints N (6 Messages)
building virtual PCBs (2 Messages)
Buried Resistor Testing (3 Messages)
Burn-in / Stress screening (1 Message)
CAD system: UltiBoard (1 Message)
Call for Data on Airborne Lead Concentrations from Soldering Operations (2 Messages)
Call for Data on Airborne Lead Concentrations fromSolderingOperations (1 Message)
CAM operator salaries (2 Messages)
CANADIAN PROPOSAL TO REDUCE LEAD CONTENT IN CHILDREN'S/CONSUMER PRODUCTS (1 Message)
career opportunity (1 Message)
CIC smutting (1 Message)
COB footprint (1 Message)
Company Named AAT (4 Messages)
Component Failure Analysis (5 Messages)
Component Pricing Trends (2 Messages)
Component Shelf Life (1 Message)
Conduction cooled PCB (1 Message)
CONFORMAL COATING REPAIR (3 Messages)
Conformal coating study (1 Message)
Confused! (1 Message)
Corner cracks in electrolytic copper plating. (2 Messages)
Cost of Gold Plating (2 Messages)
cover blind vias (1 Message)
Cracked Chip Capacitor (1 Message)
Cracked Conductors (3 Messages)
Cracked solder on NiAu (1 Message)
Cracking of 1206 compo (2 Messages)
Crazing, Information Request (1 Message)
Cupric Chloride (3 Messages)
Cupric Chloride Etchant (8 Messages)
Dear Dhswan: (1 Message)
Definition of controlled impedance ? (4 Messages)
DES Autoload Equipment (1 Message)
DES, FAB, ASSY: Standards (3 Messages)
DES: COB Design Guide (1 Message)
DES: PCB Mounting (2 Messages)
Design: Shield Layer Relief and Shielding Effectiveness (1 Message)
DESIGN: tin-antimony solders (1 Message)
Developing question (8 Messages)
dielectric data E-glass fiber (2 Messages)
Drill mach. (1 Message)
Drill Tips. (1 Message)
Englemaier?? (1 Message)
Enquiry on FR4 material (1 Message)
ENVIRONMENTAL CONTROL (1 Message)
Environmental Stress Screening (1 Message)
ESD Handling of RNR & RNC Resistors (2 Messages)
ESD Standards (3 Messages)
Exposed copper pads/Immersion NiAu (5 Messages)
fab, cleanrooms rating (3 Messages)
FAB: Artwotk maintenance (1 Message)
FAB: Bellcore spec (2 Messages)
FAB: BOARD SOLDERABILITY (4 Messages)
FAB: Datecode Marking (2 Messages)
FAB: Electrical Testers (1 Message)
FAB: Gold Finger Extensions (2 Messages)
FAB: HASL Temp. (3 Messages)
FAB: HASL Temp.(Reply) (1 Message)
FAB: Ionic Contamination Measurements (1 Message)
FAB: Kodak vs Agfa (2 Messages)
Fab: Packaging (3 Messages)
FAB: Silver-filled epoxy with tin or solder (3 Messages)
FAB: Stage Micrometer Calibration Service (3 Messages)
FAB: surface prep for bonding (2 Messages)
FAB: Tin / Lead finish (1 Message)
Fab: Voids in resin filled via (1 Message)
FABMASTER (1 Message)
Fiberoptic device handling (4 Messages)
Fischer Precision Spindles (1 Message)
Fixing Warped Assemblies (2 Messages)
Flex Circuit Assy/Fab (1 Message)
flexible polyester circuits (1 Message)
Fluoride and Halide in flux tests. (1 Message)
fracture resistance (1 Message)
Free!!! 125 sex channels when u join (2 Messages)
Gas Mystery (1 Message)
GEN Know errors in IPC-sm-840C (1 Message)
GEN: MIL-PRF-31032 Certification/Qualification (2 Messages)
General Question (2 Messages)
Gold and BGA devices (1 Message)
Gold for BGA (1 Message)
Gold Immersion Plating (4 Messages)
Gold Potassium Cyanide (GPC) supply (1 Message)
Gold Slivers (6 Messages)
Gov't Sales (1 Message)
Grey Scale Machine Vision (1 Message)
Halide free cable for SIR testing (1 Message)
hard gold/immersion gold finish (2 Messages)
Hardest photoimageable solder mask (1 Message)
Heatsink lamination (9 Messages)
Help (1 Message)
Hole wall pullaway (2 Messages)
Hot Air soldering pencil. (1 Message)
Immersion / Electroless (3 Messages)
Immersion / Electroless,Reply (1 Message)
Immersion AU, NPTH Deposits (2 Messages)
Inboard Ni/Au contacts (1 Message)
insulation resistance testing (2 Messages)
Invitation & Call for Panelists for free DfE Making Holes Conductive Seminar on Nov 13 in Phoenix (1 Message)
Ionic Contam. Testers (1 Message)
IPC 1710 (2 Messages)
IPC spec for Electrical Test on BGA substrate (1 Message)
IPCchat session announcement (1 Message)
Kaizen FCR (2 Messages)
Laminate designations (3 Messages)
Land to Lead Ratio (4 Messages)
Laser benchmarking (2 Messages)
Layman's guide for J-STD-001B (8 Messages)
LED Sorting (1 Message)
Legend ink (3 Messages)
Lengthening stencil opennings under fine pitch parts. (1 Message)
Lifted Lands in Assemblies (2 Messages)
Lifted Lands per IPC-6012 (3 Messages)
Line staffing (1 Message)
Looking for ANSI symbol documention (1 Message)
Low Temp Bake for Plastic Parts (1 Message)
Making hole quality sections (2 Messages)
Material handling (2 Messages)
Measurement Specification (1 Message)
Mechanically attached Heat Sinks (1 Message)
MIL Specification (2 Messages)
MIL-STD Cleanliness spec. (3 Messages)
MillipaQ 80s (1 Message)
minimum distance a hole can be drilled from the edge (4 Messages)
minimum distance a hole can be drilled from the edge -Reply (1 Message)
Need help on solder paste stencils (1 Message)
Nitrogen use w/ BGA reflow (1 Message)
Nitrogen use w/ BGA reflow (jocularity) (1 Message)
obsolete transistor (3 Messages)
OSP y OSP (1 Message)
Palladium (10 Messages)
Palladium -Reply (1 Message)
Part Numbering Systems (7 Messages)
PC card (populated) burn-in (1 Message)
PCB Designers (1 Message)
PCB goldfingers (1 Message)
PCMCIA INFO (5 Messages)
Phosporised Copper anodes (2 Messages)
pill package (1 Message)
Pill Style Metal Can Package, Honeywell (1 Message)
Planar Magnetics (1 Message)
Plastic Parts Questions... (2 Messages)
Plastic Parts: Low Temperature Bake! (2 Messages)
PNP Info (1 Message)
Pollution Prevention/Green Manufacturing Conference in Atlanta (1 Message)
positive dry film resist (3 Messages)
Post separation & Resin smear (1 Message)
Post separation & Resin smear -Reply (1 Message)
Press Fit and Ni/Au Surface Finish (5 Messages)
Preventive maintenance software (2 Messages)
Proceeding IPC Works 97 (2 Messages)
PTFE laminates. (4 Messages)
Pull and cross-section test (1 Message)
Punch (2 Messages)
Re : Part Numbering Systems (1 Message)
RE : [TECHNET] [Technet]: FAB: FR4 material (2 Messages)
Receipt of 10/8/97 2:39PM message (1 Message)
Reliability Testing New SIR developments (1 Message)
REPLY- BOARD SOLDERABILITY (1 Message)
Request For Info (1 Message)
Resin Blocking on Sequential Lamination (2 Messages)
Resin Blocking on Sequential Lamination -Reply (1 Message)
RESIST DEFINED LANDS (3 Messages)
Resist removal from tooling holes (3 Messages)
Results of BGA issues questions to TechNet. (1 Message)
RMA flux on PEMs (1 Message)
Roku-Roku (1 Message)
Roku-Roku Model GR435N high speed milling machine (1 Message)
Rotary Dip Solderability Fixture (3 Messages)
Screening & Inspection Services needed (1 Message)
SCreenprinting (1 Message)
signoff technet (2 Messages)
SIR developments (3 Messages)
SIR Testing (3 Messages)
SIR Testing New developments (6 Messages)
small via on thick fab (5 Messages)
SMT Connectors plating (1 Message)
SMT soldering (4 Messages)
SMT Tolerance (1 Message)
SMUTTING (9 Messages)
Software Programming Negotiations (1 Message)
solder balls (1 Message)
Solder Joint Failures (1 Message)
solder joint thickness (2 Messages)
SOLDER MASK T-UP (2 Messages)
Solder paste inspection equipment (2 Messages)
SOLDER PASTE ON FIDUCI (1 Message)
SOLDER PASTE ON FIDUCIALS (4 Messages)
Solder resist blisters (4 Messages)
Solder Stencil Guidelines Wanted... (2 Messages)
solder-ball free LPISM? (2 Messages)
Solderability requirements per ANSI/J-STD-002 (2 Messages)
solderballs (2 Messages)
Source for temperature-indicating labels (3 Messages)
Sparkgaps (2 Messages)
SPC for primary image process (2 Messages)
Spraying Matte LPI (1 Message)
Static charge on PCB lamin (1 Message)
Static charge on PCB laminate (1 Message)
steam age (3 Messages)
Stencil printing problems (1 Message)
subscribe (4 Messages)
Suppliers of Teflon Material (4 Messages)
SV: [TECHNET] Inboard Ni/Au contacts (1 Message)
Switch To Immersion Gold (1 Message)
Tape and Reel (1 Message)
TEchnet (1 Message)
Temperature and humidity parameters (1 Message)
Test Fixture Generation (1 Message)
Test Laboratory (3 Messages)
test method (2 Messages)
Time Way Software (2 Messages)
Tombstoning (2 Messages)
Torque (2 Messages)
ULTIboard (1 Message)
UNSUBSCRIBE (2 Messages)
Using crystals in refow (1 Message)
Via Hole ratio's (5 Messages)
Viod Inspect (4 Messages)
Volume resistivity (1 Message)
waste treatment (8 Messages)
Water Quality (1 Message)
WAVE SOLDER DROSS & MARBLES (3 Messages)
Wave Solder Profile Questions (1 Message)
Wave soldering SMD actives (5 Messages)
Wire Bonder Comments (1 Message)
X-Ray Inspection Equipment (3 Messages)
X-section Mounting Media (8 Messages)
XRF (1 Message)
YTECHNET? IMMERSION AU, NPTH DEPOSITS (1 Message)
YTN? RESIST REMOVAL FROM TOOLING HOLES (1 Message)
[Fwd: Re: PC card (populated) burn-in] (1 Message)
[TECHNET] assem: shape code library (1 Message)
[TECHNET] Assembly (2 Messages)
[TECHNET] Assembly Inspection Equipment (1 Message)
[TECHNET] Assy: BGA, dummies, pad finishes, stencils, profiles, SM o (1 Message)
[TECHNET] ASSY: Conformal Coating Coverage (2 Messages)
[TECHNET] ASSY: Solder compatibility (5 Messages)
[TECHNET] Assy: Solder Failures (1 Message)
[TECHNET] Assy: Soldering on gold plated pads (3 Messages)
[TECHNET] ASSY:PCB Assy that is Potted (1 Message)
[TECHNET] Brittle Solder Joints N (2 Messages)
[TECHNET] CANADIAN PROPOSAL TO REDUCE LEAD CONTENT IN CHILDREN'S/CONSUMER PRODUCTS (1 Message)
[TECHNET] Cupric Chloride Etchant (4 Messages)
[TECHNET] Design of Experiments soft (2 Messages)
[TECHNET] Exposed copper pads/Immersion NiAu (1 Message)
[TECHNET] FAB: software to view gerber (1 Message)
[TECHNET] Gold and BGA devices (4 Messages)
[TECHNET] Inboard Ni/Au contacts (1 Message)
[TECHNET] Lifted Lands per IPC-6012 (2 Messages)
[TECHNET] Need help on solder paste stencils (2 Messages)
[TECHNET] PTFE laminates. (3 Messages)
[TECHNET] PTFE laminates. -Reply (1 Message)
[TECHNET] RE:FAB Date Codes (1 Message)
[TECHNET] Resist Defined Lands (1 Message)
[TECHNET] SCreenprinting (1 Message)
[TECHNET] SMT soldering (1 Message)
[TECHNET] Solder Stencil Guidelines Wanted... (1 Message)
[TECHNET] Sparkgaps (1 Message)
[TECHNET] TEchnet (1 Message)
[TECHNET] Testing of Solder (1 Message)
[TECHNET] X-Ray Inspection Equipment (1 Message)
[TECHNET] [Technet] Assy: Placement Machine Measurement (1 Message)
[Technet]: FAB: FR4 material (3 Messages)
[Technet]: FAB: Specificition (2 Messages)
[TERNATE] Cracking of 1206 components (1 Message)
[TN] Free!!! 125 sex channels when u join (1 Message)
[T] Brittle Solder Joints (2 Messages)
[T] Corner cracks in electrolytic copper plating. (1 Message)
[T] Cracking of 1206 components (4 Messages)
[T] Englemaier?? (1 Message)
[T] Gold Immersion Plating (1 Message)
[T] Gold Immersion Plating -Reply (1 Message)
[T] PC card (populated) burn-in (1 Message)
[T] Post separation & Resin smear (1 Message)
[T] Pull and cross-section test (1 Message)
[T] Request For Info (1 Message)
[T] RESIST DEFINED LANDS (2 Messages)
[T] RESIST DEFINED LANDS, amongst other things ... (1 Message)
[T] Solder compatibility (1 Message)
[T] Solder Failures (1 Message)
[T] Soldering on gold plated pads (1 Message)
[T]*Stress Test Barrel********** (2 Messages)
[T]BGA stuff (2 Messages)