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October 1997

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Subject:
Re: Solder resist blisters
From:
David P Ho <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 1 Oct 1997 23:41:53 -0700
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 We had a simular problem in the past, the small vias that get covered with
Lpi resist will pop during final bake or at HAL.  We've gone to a different
brand of resist and this problem is eliminated.  ( The current resist is a
nova epoxy based material)

-----Original Message-----
From: chiman chan <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>

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