Does anyone know of a guide how to design conduction cooled multilayer SMD
printed circuit VMEbus boards from a thermal perspective? Typical questions
I have:
1.      Are 2 or 4 power or ground planes sufficient to get the heat out?
2.      If 2 of these planes are on the component and solder side, is the
EMC benefit worthwhile?
3.      How thick must the copper be?
4.      Do vias help to get the heat into these planes?
5.      What matric material must be used?  FR4?  Polyamide?
6.      How useful is a rib placed legthwise in the boards centre?
7.      How is the heat transfered from this rib to the expanders?
8.      How must heat is extracted through the backplane connectors?
Regards
Gil
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