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Date: | Sun, 12 Oct 1997 18:47:45 -0500 |
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Hi Dan - I went through my files and found a couple of papers that might be
useful:
"The Rough or Grainy Solder Phenomenon", Ronald Bulwith, PC Fab October
1986, pp23-35.
"??? On Surface Mount Components", H. Steen, Circuit World, Vol. 112, No.
1, 1984,
(I lost the first title words due to a poor photocopy)
Most technologist would not want a cold solder joint (per IPC -T-50
definition) on an assembly because in most use environments the reliability
would be terrible. Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
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