(FAB) Request for Film Processor Manufacturers (1 Message)
(Fwd) Re: FAB(Shifting Layers) (2 Messages)
50 mil pitch/30mil drill component, with 6 mil routing. (3 Messages)
80 pin QFP (2 Messages)
Accuracy of SnPb comp. meas. (2 Messages)
Acid copper bath (4 Messages)
Acoustic imaging of boards (1 Message)
Adhesive Squeeze Out (2 Messages)
Admin: New Opportunity (1 Message)
Advertisement on the Technet (4 Messages)
alloy 42 (1 Message)
Alpha-Prep (1 Message)
Alpha-Prep-responce (1 Message)
Alternative to HASL (3 Messages)
Alternatives to HASL (3 Messages)
analysis method for copper in effluent (5 Messages)
Any recommendations for test fixture drilling machine (1 Message)
ASM Gilbert Connectors (1 Message)
ass- gold/Ni solder skips (4 Messages)
ASSEM (6 Messages)
Assembly (2 Messages)
Assembly Test Defect Analysis (3 Messages)
Assembly: Solder plating height for TAB bonding (1 Message)
Assembly:Looking for optical Comparator (3 Messages)
ASST: Grainy wave solder joints (3 Messages)
ASSY (1 Message)
ASSY wirebonding (1 Message)
ASSY- Bake for component re (1 Message)
ASSY/TEST: Electrical Test; Solder contact problem (1 Message)
ASSY: Au-plated Kovar (1 Message)
Assy: BGA query (1 Message)
Assy: Blowhole (7 Messages)
Assy: Blowhole -- > Thanks (1 Message)
Assy: Blowhole(reply) (1 Message)
ASSY: brainstorm ways to acheive better wetting to Pd-Ag terminations? (2 Messages)
Assy: Component in tape counters. (1 Message)
ASSY: CONFORMAL COATING ADHESION (5 Messages)
ASSY: CONFORMAL COATING ADHESION -Reply (2 Messages)
ASSY: Double sided soldering (2 Messages)
ASSY: Fractured Solder Joints (2 Messages)
ASSY: Gold in the solder connection #2 (3 Messages)
ASSY: Gold in the solder connection. (2 Messages)
Assy: green stuff (2 Messages)
ASSY: HASL height for fine pitch bonding (1 Message)
Assy: Lifted lead (QFP) (6 Messages)
ASSY: LOOKING FOR COMPONENT SERVICE SUPPLIER (2 Messages)
ASSY: Magnetic pick-up tools (1 Message)
ASSY: manufacturers (1 Message)
Assy: Pad lifting (2 Messages)
ASSY: Pin Fracture (1 Message)
Assy: QFP Reflow (6 Messages)
Assy: resistor networks (2 Messages)
ASSY: Saponification shorts (1 Message)
Assy: Small PC Card (1 Message)
Assy: Small PC-Card (3 Messages)
Assy: Vapor Phase Reflow Oven (6 Messages)
ASSY:ALTERNATIVES TO HASL (3 Messages)
ASSY:baking of PBGAs (3 Messages)
Assy:Dwell time (1 Message)
ASSY:Grainy wave solder joints (3 Messages)
ASSY:search for conformal coat mat'l (1 Message)
Attaching methods for thermocouples (5 Messages)
Automatic Packaging needed (1 Message)
backplane bending (2 Messages)
BACKSIDE WAVE SOLDER OF IC'S (1 Message)
BAKING & STORAGE CONDITION OF PBGA (1 Message)
Balls after reflow (1 Message)
Bare Board electrical test equipment (1 Message)
Bare PWB for Pc computers (4 Messages)
Black-oxide layer turned red after pressing (7 Messages)
BOARD WARPAGE (2 Messages)
Brass inserts (1 Message)
BUM Technology (3 Messages)
Cartoon Box (1 Message)
cc:Mail UUCPLINK 2.0 Undeliverable Message (1 Message)
Ceramic panels that darken with electric current. (1 Message)
Change to J-STD-001 (1 Message)
Cleaning of BGA (6 Messages)
Commercial components in Military apps. (5 Messages)
Commercial Workmanship Standards (4 Messages)
conductive carbon ink (1 Message)
Conformal coating (1 Message)
Conformal coating of printed circuit boards (1 Message)
Contracts for Turnkey Manufacturing (1 Message)
Copper Peel Strength on microvia - dielectrics (2 Messages)
copper plating (2 Messages)
Copper Plating to Fe/Ni Alloys (2 Messages)
Crescent 30 Photoplotter Problems... (2 Messages)
Crystal Insulator Pads (1 Message)
Crystal Insulator Pads -Reply (1 Message)
Crystal Insulator Pads -Reply -Reply (1 Message)
Current Carring Capacity (3 Messages)
D.E.S.E. (3 Messages)
Data Protection (1 Message)
Defective PWB at customer's facility (1 Message)
DES (2 Messages)
DES FAB (1 Message)
DES/ASSY: Placement files (1 Message)
DES/FAB Moisture and Fungus Testing (1 Message)
DES: Breakaway hole design (1 Message)
DES: Cu fills on circuit layers (2 Messages)
Des: GigaHertz Loss (1 Message)
Des: Impedance Calc - special (1 Message)
DES: inexpensive plotter (4 Messages)
DES: Internal Connections On PWBs (2 Messages)
Des: IPC-D-356 Netlist From Allegro (1 Message)
DES: Viewlogic ISIS software (1 Message)
Design-IPC-D-356/RS274X format (1 Message)
Design-Microstrip (3 Messages)
Design: Hybrid Design Training (2 Messages)
DesignRules Wire and Ribbon Bonding (2 Messages)
DESMEAR FOLLOW-UP (3 Messages)
differential impedance testing (2 Messages)
dimensional stability (3 Messages)
Dk & Df (2 Messages)
DXF to Gerber?. (2 Messages)
Easter Weekend (1 Message)
EL (Electroluminescent) Flexible strips fabrication (1 Message)
elctroless nickel gold -an update (1 Message)
elctroless nickel gold -and dull Copper pads after stripping of Tin (1 Message)
ELECTROLESS NiAu - BACKGROUND PLATING (1 Message)
elimination of etch resists through differential etching (2 Messages)
elimination of etch resists through differential etching (fwd) (1 Message)
EMI/RFI/H-field Data Protection (2 Messages)
ESD PROBLEM ON ATI CNC ROUTING MACHINE (4 Messages)
Etchback vs Smear Removal (1 Message)
etching of microsections (1 Message)
Eutectic Solder Mechanical Properties (3 Messages)
Excessive caking of debris (DRILL) (4 Messages)
Experience users of Unline 2000 (test fixure drilling system) (1 Message)
Expo ATP Meeting - Title, Description (fwd) (1 Message)
exposed copper OSP (1 Message)
FAB (2 Messages)
fab - cleanning of innerlayers (1 Message)
FAB(Shifting Layers) (5 Messages)
Fab/Assy: Class3, 1/2 tented vias (1 Message)
FAB: ALTERNATIVE TO HASL (3 Messages)
FAB: BGA and uBGA phototool reqrmnts (1 Message)
Fab: C.B-200 Question (1 Message)
FAB: Conformal coating (3 Messages)
Fab: Multilayer Lamination - Image Transfer/Telegraphing (1 Message)
FAB: Nan Ya (2 Messages)
FAB: Palladium Plating (6 Messages)
FAB: Resin Recession (1 Message)
FAB: Silver-Fill (2 Messages)
FAB:Preclean parameters (2 Messages)
FAB:Prepreg shelf life - a functional test (1 Message)
FAB:SPC for PWB ET (1 Message)
Fiducials (8 Messages)
fine pitch SMT solder mask (1 Message)
Flex circuit heat sealing equipment (2 Messages)
FR-4 (2 Messages)
FR4 standard sizes (1 Message)
FWD>GEN- SPC software desig (1 Message)
Galvanic Corrosion (8 Messages)
Gen Arlon contact (1 Message)
Gen- Cu protective coating (1 Message)
GEN-Hollis Cleaners (2 Messages)
Gen: Arlon contact (2 Messages)
GEN: Carbamates (1 Message)
GEN: IPC Designers Council Chesapeake Chapter Meeting (3 Messages)
GEN: IPC Designers Council Chesapeake Chapter Minutes (1 Message)
GEN: Scanning Mylar (4 Messages)
GEN: SPC software designed for PCB production (1 Message)
Gerber format (4 Messages)
GERBER TO DXF?? (8 Messages)
gerber viewer (3 Messages)
Glass transition temperature (2 Messages)
Gold Embrittlement (3 Messages)
gold in solder joints (1 Message)
Gold Thickness on Pads (3 Messages)
Gold/Tin (1 Message)
Gold/Tin - How to Remove Sn and Replate Au (4 Messages)
Gold/Tin Lead (1 Message)
Handling silver halide wastes (3 Messages)
HASL (1 Message)
HASL Replacements (2 Messages)
help on failure analysis of modules (1 Message)
Help on PCBA qualify inspection (2 Messages)
How to obtain IPC spec compliance (1 Message)
Immersion gold for keypad contacts (4 Messages)
Immersion gold vs. Hot air solder level from component assembly point of view (1 Message)
Immersion Tin process (5 Messages)
impedance calculation software (4 Messages)
Impedance of parallel Traces (1 Message)
Impedance testing source (3 Messages)
Inner layer silver screen material. (2 Messages)
Interconnection Resistance, Multilayer Printed Wiring. (3 Messages)
Introduction to ISO (1 Message)
Ionic Contamination on PWA (5 Messages)
IPC / Industry MELF Components (1 Message)
IPC ARTWORK (6 Messages)
IPC Designers Council Chesapeake Chapter (1 Message)
IPC maillist maintainer on vacation :-) (1 Message)
IPC-2221 AND IPC-2222 , (1 Message)
IPC-2221 AND IPC-2222 , MIL-PRF-55110F (3 Messages)
IPC-RB-276 is OBSOLETE! -Reply -Reply (1 Message)
IPCchat session announcement (3 Messages)
IR Oven Calibration (3 Messages)
ISO Cleanroom Standard (3 Messages)
ITO Coated Film (1 Message)
JEDEC Component Trays (1 Message)
Lab for Impedance Testing (1 Message)
LAMINATION RIVETING (3 Messages)
Land Pattern Standard for Xtal Osc? (2 Messages)
Lead forming of ASICS - (DES???) (1 Message)
LOOKING FOR SUPPLIER OF LARGE FORMAT PCB - PTH - UL APPROVED (2 Messages)
mailstorm (1 Message)
Marine Environment (3 Messages)
marking standards (6 Messages)
maximum weight for DSR (1 Message)
Meaning of "ISO" (1 Message)
Mechanical Properties: Intermetallic Thickness! (6 Messages)
microphone (1 Message)
Microsection Etchants (1 Message)
Microsectioning (8 Messages)
Microvia technology (1 Message)
MIL-I-45208A (1 Message)
Multilayer PCB (1 Message)
Mylar removal on inners. (2 Messages)
NEED Gerber viewer with (1 Message)
NEED Gerber viewer with highlight capability (4 Messages)
need info on SSD process of PCMCIA (5 Messages)
Ni-Au Electroless (2 Messages)
Ni-Au Electroless -Reply (4 Messages)
Nitrogen Storage (2 Messages)
No Clean Bare Board Controls (8 Messages)
No Clean Bare Board Controls -Reply (1 Message)
No-Clean Solder Block Change Info Wanted (2 Messages)
Obsolete Transistors (4 Messages)
Odd symbols in messages (1 Message)
OSP Coatings -- Solderability (1 Message)
OSP pads not fully covered with solder (3 Messages)
OSP versus HASL (3 Messages)
Panel utilisation (1 Message)
Paste Flux for FCOB (1 Message)
Pattern plating considerations (2 Messages)
PCB (9 Messages)
PCB Design Software (2 Messages)
PCB Designers (1 Message)
PCB for high frequency (2 Messages)
PCB REPAIR (3 Messages)
PCB: Solder Joint issue (3 Messages)
Peelable Coating Mask (1 Message)
peelable mask (3 Messages)
Photo Via (3 Messages)
Photo-Defined Blind Vias - Technology Workshop - San Jos (2 Messages)
Photo-Defined Blind Vias - Technology Workshop - San Jose - Thurs afterno... (1 Message)
Photo-Defined Blind Vias - Technology Workshop - San Jose - Thurs afternoon March 13th - Red Lion Hotel (1 Message)
Placement files (3 Messages)
Plastic on LCCC pads (1 Message)
Preclean parameters (1 Message)
Prepreg shelf life. (3 Messages)
Printed Wire Assembly Solder Rework Reliability (1 Message)
Processing PTFE laminates. (2 Messages)
Protracer Driver (1 Message)
Pulse plating of copper and tin/lead (3 Messages)
PWB traveler generation software (2 Messages)
PWB's 1 pass ratio (1 Message)
PWB,PCB,PWBA,ETC. (1 Message)
PWB: Coating and White ID stringers (1 Message)
QUAL: MIL-STD Comparison (2 Messages)
Questionarie on Double Sided SMA (1 Message)
Re,Re:cleaning of BGA's (2 Messages)
Receipt of 3/27/97 4:46PM message (1 Message)
Recycle (1 Message)
Regarding SPC in PCB shops (2 Messages)
Removing solder from leads (1 Message)
REQUESTED SPC INFO ( 5 PAGES) (3 Messages)
Resend: Questionarie on Double Sided SMA (1 Message)
Resin Recession (4 Messages)
Response to : Black-oxide layer turned red after pressing (1 Message)
Response to SPC Question. (3 Messages)
Response to SPC Question. -Reply (1 Message)
Rework and Repair Station (6 Messages)
ROLAND - - LARGE BOARDS (1 Message)
Searching for Info on Bellcore Complaince Testing (1 Message)
Selective PCB plating (5 Messages)
Self limiting Immersion Gold Process (1 Message)
sequential build up (1 Message)
Shipping Automation (1 Message)
Shrink Wrap for pcbs (2 Messages)
Silver Halide Wastes (1 Message)
SMT Assembly and Flex Circuits (6 Messages)
SMT Assembly and Flex Circuits -Reply (1 Message)
SMT pre-owned equipments (2 Messages)
SMT REEL SPLICER (3 Messages)
Solder Joint issue (1 Message)
Solder Mask Coverage and exposed SN/PB and Copper (2 Messages)
Solder Mask on fine pitch SMT component (7 Messages)
Solder Mask on fine pitch SMT component -Reply (1 Message)
Solder mask question (1 Message)
Solder preforms. (3 Messages)
Solderability Shelf Life of Untreated Copper SMT Pads (1 Message)
Soldermask question (4 Messages)
Soldermask question -Reply (1 Message)
Solutions for Loading Databas using Mentor "Board Station" (1 Message)
Solutions for Loading Databas using Mentor "Board Station" (fwd) (1 Message)
SOT-23 lands for wave soldering (2 Messages)
SPC chart for % defective (4 Messages)
SPC for PCB fabrication (2 Messages)
SPC for PCBs (1 Message)
SPC software designed for PCB production (2 Messages)
Specs (1 Message)
Spots on Cu surfaces aft (1 Message)
Spots on Cu surfaces after OSP coating (1 Message)
Strategy for Baking Plastic Parts... (1 Message)
Surface Mount Reliability (1 Message)
Surface Mount test points (3 Messages)
Surface tension of molten Pb/Sn (2 Messages)
TCE (3 Messages)
Test coupans for controlled impedance boards. (3 Messages)
Testing Methodolgies (1 Message)
Testing strategies (1 Message)
Testing strategies -Reply (1 Message)
The meaning of ISO (6 Messages)
TSOPs (1 Message)
UL (2 Messages)
ultra fine pithch vs. fine pitch (1 Message)
Unidentified subject! (8 Messages)
Use of Microvia Technology (2 Messages)
Use of Microvia Technology/ Reply (1 Message)
Using Silver on Boards for Better Solderability (1 Message)
UTP - Unshielded Twisted Pair (3 Messages)
Vapor phase oven/Centech info. (1 Message)
WAVE SOLDER PALLETS (1 Message)
Wire bonding (3 Messages)
Wire Termination Spec. (1 Message)
Working to NHB5300.4(3A-1) (3 Messages)
Workmanship Standards (1 Message)
Workmanship Standards (fwd) (1 Message)
[Fwd: Re: Placement files] (1 Message)
[Fwd: Re[2]: Pulse plating of copper and tin/lead] (1 Message)