TECHNET Archives

March 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Shrink Wrap for pcbs
From:
[log in to unmask] (Chris Messner)
Date:
Mon, 31 Mar 1997 15:04:01 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (52 lines) 
     My biggest problem relating to shrinkwrapping PCB's has been warpage 
     due to overstressing the boards in wrapping them. This overstressing 
     can actually cause a twist in an entire stack of boards that produces 
     large warpage.
       Other issues could include temperature differences between faciility 
     and storage (but would ned to be large) or moisture/humidity 
     differences.
     
     Chris Messner  
     Sr Process Engineer
     UT Electronic Controls


______________________________ Reply Separator _________________________________
Subject: Shrink Wrap for pcbs
Author:  Paul Greene <[log in to unmask]> at Internet
Date:    3/31/97 10:49 AM


I have experience in shrinkwraping food products but none in new position 
involving packaging pcb's. Looking for strategic considerations (pros and 
cons /upside and pitfalls to be aware of) for shrinkwrapping pcb's.
     
     
     
L.E. Perks
Manager, Logistics
Rexcan Circuits
     
*************************************************************************** 
* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
*************************************************************************** 
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   * 
* with <subject: subscribe/unsubscribe> and no text in the body.          * 
*************************************************************************** 
* If you are having a problem with the IPC TechNet forum please contact   * 
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      * 
***************************************************************************
     

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2