We are about to embark on using microvia or sequential build-up technology 
to put small vias in the surface mount pads on our boards.  Part of our 
qualification process entails understanding the reworkability of the boards 
which contain Dycostrate/PERL technology.  We have detected pad lifting 
after 3 rework cycles, however the lifting is not so substantial as to 
require re-epoxying.  The pad would likely be trimmed and replaced.  Has 
anyone out there established guidelines for the extent of pad lifting 
before relabiltiy and/or quality is impacted?  Is anyone else experiencing 
pad lifting with these technologies.?  Thanks in advance.
Jenni Marcy
Sr. Sourcing Engineer
Storage Technology Corp.
Louisville, Colorado

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