We are about to embark on using microvia or sequential build-up technology to put small vias in the surface mount pads on our boards. Part of our qualification process entails understanding the reworkability of the boards which contain Dycostrate/PERL technology. We have detected pad lifting after 3 rework cycles, however the lifting is not so substantial as to require re-epoxying. The pad would likely be trimmed and replaced. Has anyone out there established guidelines for the extent of pad lifting before relabiltiy and/or quality is impacted? Is anyone else experiencing pad lifting with these technologies.? Thanks in advance. Jenni Marcy Sr. Sourcing Engineer Storage Technology Corp. Louisville, Colorado *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************