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Date: | Wed, 19 Mar 1997 13:31:25 -0400 |
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>From what I have read, Immersion Gold plating on nickel is a "self
limiting" process.
My question is what is, what is the limit? I have received conflicting
answers
(i.e. 0.1 micron, 0.2 micron, etc...). If I wanted less than the limit,
how controlled is the
immersion process to allow me to spec. a specific amount of gold? Also,
what is the
recommended minimum amount of gold that should be on the nickel?
I have also read that the gold content in the solder should be maintained
below 2%. Is this
just a matter of adding more solder paste?
One last matter. Does anyone know of place I can send Nickel/Gold plated
boards to have
the amount of gold plating verified?
Thank you all in advance!
Best Regards,
Mike Forrester
LeCroy Corp.
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