>From what I have read, Immersion Gold plating on nickel is a "self limiting" process. My question is what is, what is the limit? I have received conflicting answers (i.e. 0.1 micron, 0.2 micron, etc...). If I wanted less than the limit, how controlled is the immersion process to allow me to spec. a specific amount of gold? Also, what is the recommended minimum amount of gold that should be on the nickel? I have also read that the gold content in the solder should be maintained below 2%. Is this just a matter of adding more solder paste? One last matter. Does anyone know of place I can send Nickel/Gold plated boards to have the amount of gold plating verified? Thank you all in advance! Best Regards, Mike Forrester LeCroy Corp. [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************