That really depends on what kind of wire bonding you intend to do.  For
aluminum wedge bonding, immersion gold may be adequate, but for gold ball
and crescent bonding, usually a thickness of 15 - 20 microinches is the
minimum (usually you see thicknesses of 30 - 60 microinches specified). 
This is more than an immersion gold process can put down.

Can you provide more information?

Dave Anderson

>>> <[log in to unmask]> 03/20/97 01:02am >>>
     To all technet users ,
     
     Currently we are having a discussion on the wire bonding with the
     ENIG , immersion gold process .I am interested to know the gold
     quality to enable to be applicable for wire bonding purpose .Any
     comments are highly welcome .Thanks .

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************