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March 1997

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Subject:
Acid copper bath
From:
tonghh <[log in to unmask]>
Date:
Mon, 17 Mar 1997 22:49:23 +0800
Content-Type:
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   To all technet users ,

   Quite often I experience copper crystallization in the acid copper bath which
results in plating distribution problem .Apart from the several factors that
affect this crystallisation -fluctuating current , concentration of the 
bath , anode bag , anode basket etc -maybe someone would like to share more
on this problem and how to overcome this in the plating line.

Thanks . 

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