回覆 : [TN] "Delta Tg" (1 Message)
回覆 : [TN] Microscopes & Cross Sectioning equipment for HDIS (1 Message)
"Delta Tg" (3 Messages)
"DMG" or other test methods for gold porosity/Ni migration in ENIG process (1 Message)
0603 & 0402 assembly on flexible circuits (3 Messages)
1999 IPC PWB Designer Certification Training/Testing Calendar (1 Message)
2 [TN] OCC coating on gold-finger (1 Message)
20H Rule ... (1 Message)
560 Pin Aluminum BGA (1 Message)
: Flux activity monitoring system (4 Messages)
<No subject> (8 Messages)
aliminium pcb transportation trays (2 Messages)
Alternate surface finishes (1 Message)
aluminium PCB transportation trays (3 Messages)
ANY ONE HEARD OF NICHE TECH and what they can do? (1 Message)
AOI inspection (1 Message)
Assy : Rework / yield from the process (2 Messages)
Assy: LED Failures, I found out what happened... (8 Messages)
Assy: LED Failures... (7 Messages)
ASSY: Responses to my Posting: ASSY:mixing of high and low-temp PbSn alloys (2 Messages)
ASSY: Responses to my Posting: mixing of high and low-temp PbSn alloys (1 Message)
ASSY:mixing of high and low-temp PbSn alloys (1 Message)
Attaching heatsinks to IC's (3 Messages)
Au/Ni etch (1 Message)
AW: [TN] Inspection/scanning machines (1 Message)
BABT certified assembly house (5 Messages)
Back on the net (1 Message)
Back-seal compound. (1 Message)
Backplane guide (2 Messages)
Bare Board Test: Automatic Pin Loaders (4 Messages)
Bellcore Standards (1 Message)
Benchmark (2 Messages)
BGA Rework and Placement Stations and $$$ (3 Messages)
BGA rework stations (4 Messages)
BGA short (3 Messages)
BGA Socket (5 Messages)
Brady Labels (3 Messages)
Call For Papers: IPC Chip Scale/BGA National Symposium (1 Message)
CALL FOR PAPERS: IPC/CCA National Conference on Electrical Test (1 Message)
Cause/Effect (3 Messages)
Chip On Flex (2 Messages)
Chip temp measurement (1 Message)
Cleaning Options per J-STD-001B (2 Messages)
CMI unit (1 Message)
COA (chip-on-???) (6 Messages)
Coating Cure Time (2 Messages)
Comments Requested for IPC-4101 (1 Message)
Comments Requested for UL Flexible Circuit Specification (1 Message)
Copper foil evaluation item (3 Messages)
Copper Heat Sink (3 Messages)
Copper Heat Sink -Reply (1 Message)
Core Punch (1 Message)
Corrected Area Code For Rogers (1 Message)
CRX2000 (2 Messages)
Cutting & Marking flexible circuits (3 Messages)
Daisy Chain BGA samples (1 Message)
DATA sheet of XT_slot, At_slot and PCI_slot. (1 Message)
Depanelization Fixtures (3 Messages)
Dielectric Spacing Measurement (8 Messages)
double sided board with a twist (2 Messages)
Double Treat Copper (2 Messages)
Earl Moon/CIC (2 Messages)
Econopak (1 Message)
Edge Finishing Equipment (FAB) (1 Message)
Edges of FR4 material (1 Message)
Electroless Ni Thickness (2 Messages)
ESD Connector Shorting Bars (4 Messages)
Exposed copper on OSP coated board used for Grounding Hardware (2 Messages)
FAB: Lines Between Pins (1 Message)
FAB: Plating Pits (2 Messages)
FAB: Solder Filled Thermal Vias (3 Messages)
Fine-Pitch Soldering Problem (7 Messages)
Flex Material Cost Matrix (2 Messages)
Flexible print (1 Message)
Flowsoldering (2 Messages)
Flux activity monitoring system (2 Messages)
Flux for solderball apply (1 Message)
GD&T - was - Hole Tolerance of +/- .001" (3 Messages)
Going on vacation? - Sign off from the forums. (1 Message)
Gold analysis (3 Messages)
Gold and Tin Interconnect (5 Messages)
Gold mask etchant (1 Message)
Groundplane Defects on Backplanes (1 Message)
hand soldering criteria (1 Message)
Happy Holidays (1 Message)
Happy New Year (1 Message)
Happy New Year - Legends? (1 Message)
Happy New Year! (1 Message)
Happy New-Year (2 Messages)
HASL (4 Messages)
HASL / Fused Tin Lead (1 Message)
HASL vs. Fused Solder For CCA Assembly (10 Messages)
HASL vs. SMOTL (1 Message)
HASL/HASL vs. Fused Solder For CCA Assembly (1 Message)
Heat Sinks and CIC on PWBs (6 Messages)
Help: Can't place chip resistor networks (2 Messages)
High temperature solder training (2 Messages)
hole plug after HASL (1 Message)
hole plug after HASL -Reply (2 Messages)
Hole Tolerance of +/- .001" (10 Messages)
Holiday Greetings (1 Message)
Immersion Gold Reliability / Spectroscopy Analysis (2 Messages)
Inspection/scanning machines (5 Messages)
International PCB Association Contacts Sought (3 Messages)
IPC Hires Conference Director for New TradeShow (1 Message)
IPC News Release: IPC Issues Call for Papers for FlexConference (1 Message)
IPC-4101 (3 Messages)
IPC-4101 Form (1 Message)
Is there a Santa Clause? (The Proof) (3 Messages)
Lab services (1 Message)
Laminate suppliers (2 Messages)
Laminate: Pits and Dents (1 Message)
Lamp (1 Message)
Large format SMT.... (1 Message)
Laser Service Subcontractor (1 Message)
LAST ? (6 Messages)
LAST HASL - 3 (2 Messages)
Lead dia to Hole Dia ratio (3 Messages)
Lead forming (1 Message)
Lead Free Solder (3 Messages)
Lead Protrusion (6 Messages)
Lead-free Soldering (1 Message)
Legend Ink (1 Message)
Legends of the TechNet (6 Messages)
Locating Lugs and hole tolerances. (2 Messages)
Looking for packaging design software (1 Message)
Looking for Silver Chromate Paper to use for IPC-TM-650 (3 Messages)
Mechanical Fastening of "heavy" components (3 Messages)
metalisation (1 Message)
Microvia Laser Drilling (2 Messages)
MIL-C-28809 (1 Message)
Mil-Std-45662 (3 Messages)
Mixed Material PCB (1 Message)
More On UL (1 Message)
MY LAST HASL (1 Message)
MY LAST HASL - 1 (1 Message)
MY LAST HASL - 2 (2 Messages)
My recent query on TechNet (1 Message)
Nodules in copper plating process (2 Messages)
Now Available- IPC-2511, Official Publication (1 Message)
OCC coating on gold-finger (2 Messages)
Official Standards (1 Message)
Organic flux and J-STD 004 activity ratings. (2 Messages)
OSP,Press fit??? (1 Message)
Oxide rework (9 Messages)
Oxide rework > confirmation reconsideration hope ? (3 Messages)
Pad Design and IPC-SM-782 (3 Messages)
Pad to Pad Spacing on TO-92 (3 Messages)
Panasonic MV100 problems? (1 Message)
Part Numbering Systems (2 Messages)
Particulate Removal (2 Messages)
PBGA Word (3 Messages)
PBGA Word -Reply (1 Message)
PCB assembly packaging (1 Message)
PCB Association in JAPAN (2 Messages)
PCB GROUND PAD DESIGN (1 Message)
PCB micro-sectioning (3 Messages)
PCBA Routing Survey (2 Messages)
Pin-in-paste for 50 mil part (6 Messages)
plastic parts (7 Messages)
Plating of laser drilled vias (1 Message)
Plating Pits (3 Messages)
PNW Chapter IPC Designers Council meeting notices (1 Message)
PNW Chapter IPC Designers Council Newsletter (1 Message)
Polyester flex material (1 Message)
Problem with IC Sockets (1 Message)
Process Verification and Calibration Tools (9 Messages)
Protective laminates (5 Messages)
Q on Ion Chromatography (8 Messages)
Q on Ion Chromatography aResponse (1 Message)
Question about "differential stripine impedance" in IPC-D-317A (2 Messages)
Questions regarding rework process (2 Messages)
R O plant (2 Messages)
Reminder SNEC mtg (1 Message)
Request IPC-6012A (1 Message)
rework stations (4 Messages)
rigid-flex board (2 Messages)
Rogers Double Treat Foil Availablitiy (2 Messages)
Roku-Roku Sangyo, Ltd. (1 Message)
Root causes of lifted lead (1 Message)
Router survey (3 Messages)
Scoring PCAs (2 Messages)
Scrap Bare Boards (14 Messages)
Scrap Bare Boards -Reply (1 Message)
Screen-printer pallet (7 Messages)
SDSRS (1 Message)
Search for Independent LAB (1 Message)
Short solder problem of TO220 (2 Messages)
Short solder problem of TO220 -Reply (1 Message)
show boards (1 Message)
Show or Expo for PCB industry (2 Messages)
SIGNOFF TECHNET (1 Message)
Silk Screen of PCB artwork (1 Message)
Silver Soldering (1 Message)
SMD pressure sensors (2 Messages)
SMD Removal (3 Messages)
SMT adhesive (1 Message)
SMT Glue (1 Message)
SMT: Land Calc (1 Message)
SMT:Any such thing? (4 Messages)
SNEC Meeting (1 Message)
Solder Balls for BGA's (7 Messages)
Solder bridges during wave soldering (6 Messages)
solder fountain process (2 Messages)
Solder Joint Fatigue - Effect (1 Message)
Solder side components (1 Message)
Soldering Problem using OSP finished board (2 Messages)
Solvent for Underfills (2 Messages)
source for stand offs (3 Messages)
Source Inspection Guidelines (1 Message)
subscribe (1 Message)
Super solder mask? (1 Message)
Surface Mount Adhesive (4 Messages)
SURFACE PREPARATION OF ALUMINUM (5 Messages)
TDR Testing (4 Messages)
TechNet: confirmation required (0519CB) (1 Message)
TechNet: confirmation required (2905F7) (1 Message)
Temperature Rating For Flex (2 Messages)
Temperature Rise on a Trace (5 Messages)
Temperature Rise On Trace (1 Message)
test-please discard this msg (1 Message)
Testing of bare PCB's with microBGA pads (7 Messages)
through hole IPC standards-rotated pins (2 Messages)
Tin Oxide (1 Message)
TLC (1 Message)
tool for extraction of net geometries (2 Messages)
Top Line web site (3 Messages)
Top Line web site -Reply (1 Message)
UL - testing/approval (5 Messages)
UL approval material for PWB MFG. (4 Messages)
UNBELIEVABLE! (2 Messages)
Urgent: Entek Coated PCB processing at assembly house (4 Messages)
Very low temperature flex circuit testing (1 Message)
Very low temperature flex circuit testing... (1 Message)
Via Configuration (5 Messages)
vias vs. plated through holes (2 Messages)
Vision base Robots for Odd form Placement (1 Message)
W.Michael King's Theory? (1 Message)
Warped boards at PCI connector? (9 Messages)
WAS: [TN] Earl Moon/CIC IS:..ol' Navy stories (1 Message)
What happens when polarising occurs (1 Message)
What is "Bonddrahtmaterial"? (4 Messages)
What is UL and/or 94-V0 (1 Message)
Where's Coast Intelligen Inc? (2 Messages)
Wire Wrap Board (2 Messages)
[Fwd: Re: [TN] Gold analysis] (1 Message)
[TN] Dielectric Spacing Measurement (1 Message)
[TN] R O plant (1 Message)
[TN] Screen-printer pallet (1 Message)