We have had to use polyimide tape on the gold fingers when using Entek
160 OSP materials.

The major problem we have found is that the OSP isn't consistent from
board to board- some boards have 5000 angstroms others have 2000 (target
3200). The higher end thickness tend not to burn off and have caused us
problems. Our boards are used in standard PC systems, typically in the
AGP slot, so we don't have a lot of amperage to burn through any
residual during use either. Thus, any residual OSP is detrimental in our
case.

I have seen one company use a re-useable rubber boot  to cover the
fingers during application and solder, but this company was highly
integrated and produced its own boards and assembled its own products.

Regards,
> Bill Davis, Ph.D.
> Diamond Multimedia Systems
> Senior Scientist
> Tel. 408.325.7868
> Cell. 408.888.5650
> e-mail: [log in to unmask]
>
>


-----Original Message-----
From: Poh Kong Hui [mailto:[log in to unmask]]
Sent: Thursday, December 10, 1998 7:20 AM
To: [log in to unmask]
Subject: [TN] OCC coating on gold-finger


Hi Technetters,

Pardon my innocence. I am very curious to find out whether there is
taping or masking need to be done on the goldfinger before applying
the OCC material.

I understand that OCC can act as an insulator. So if there is no
masking on goldfinger, will the heat from the reflow oven able to
completely burn off the OCC material ?

Could you pls advise me.


Poh

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