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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 17 Dec 1998 07:36:40 -0600 |
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Hi Ralph! Add one more vote to the "where did the rosin bad, no clean good
logic hatch?" responses you have received! We build military/commercial
electronics with a high mix of rosin/low residue/no cleaning process
operations that include both ceramic and plastic components with few
problems. I would echo Doug Paul's comments: what is the logic behind your
component engineers decision? They are extremely out of touch with the rest
of the industry.
Dave Hillman
Rockwell Collins
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"Vaughan, Ralph H" <[log in to unmask]> on 12/16/98 01:35:14 PM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
to "Vaughan, Ralph H" <[log in to unmask]>
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cc:
Subject: [TN] plastic parts
Season's Greets,
A query (actually re-query) to those in the know on the usage of plastic
microcircuits instead of ceramics.
I have some component guys who have ruled that plastic parts can only be
assembled on a no-clean flux line. Anyone using a rosin (RMA) flux is
dis-qualified from assembling for us. I know the theory is that the
microcracks formed at reflow temperatures will entrap corrosive residues,
but I have trouble buying the NO-CLEAN GOOD, ROSIN-BAD generalization.
Opinions?
Ralph Vaughan
Boeing-Atlanta
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