已讀取的主旨: Thermode soldering (2 Messages)
閱讀:Thermode soldering (1 Message)
회신: [TN] New email (1 Message)
"allowable number of repair/rework defects." (3 Messages)
"SIGNOFF TechNet" (1 Message)
"Solderability Testing" In Use (3 Messages)
"Where the Boards Are" CALL FOR PAPERS (1 Message)
.vcf and .pcx attachments (1 Message)
4A02627D (1 Message)
<No subject> (3 Messages)
Acrylic adhesive resistance to temp (5 Messages)
adhesive to solder mask adherence issue (8 Messages)
Admin Info: automatic answer messages (2 Messages)
Admin Msg: VIRUS POSTED TO TECHNET (1 Message)
admin test msg (2 Messages)
AMRC 1997 report (1 Message)
Anybody here doing the Test S? (1 Message)
AOI Automation (5 Messages)
Autoclave Lamination Press (1 Message)
automatic answer messages (3 Messages)
automatic answer messages -Reply (1 Message)
AW: [TN] adhesive to solder mask adherence issue (1 Message)
AW: [TN] Material for PCB (1 Message)
AW: [TN] PCB blistering during wave (1 Message)
AW: [TN] WG: [TN] Embedment, potting - reliability, thermal cycli ng (1 Message)
Bareboard electrical test escapes (3 Messages)
Bend-Flex (2 Messages)
BGA Certification Body in China (2 Messages)
BGA joints after rework (3 Messages)
BGA rework (7 Messages)
BGA underfill (1 Message)
Bi Alloy (2 Messages)
Bicarbonate in Developer solutions (5 Messages)
blind and buried (1 Message)
Blind Via Construction (7 Messages)
Blind Vias (8 Messages)
Blooming problem (3 Messages)
Board baking (2 Messages)
bowed substrates (1 Message)
Castin (1 Message)
Ceramic Boards (2 Messages)
chemical spill (1 Message)
Chip bonders (1 Message)
CIBA Probimer 77 (1 Message)
Cleaning (2 Messages)
Cleaning Equipment (1 Message)
Cleaning solvent replacement (4 Messages)
Conformal Coating (4 Messages)
Copper clad molybdenum (1 Message)
Copper oxide removal (6 Messages)
CSP's (1 Message)
CTI testing (3 Messages)
Cu thickness varies from panel to panel (7 Messages)
DC Resistance (5 Messages)
Dek Proflow (1 Message)
dewetting (1 Message)
Dewetting Issues (22 Messages)
DFM Rule or Guide line (1 Message)
Dry film adherence problems (1 Message)
DSA anode (2 Messages)
DUAL DIELECTRIC MULTILAYER BOARD (3 Messages)
electroless gold (3 Messages)
Electroless Ni-AU for Si/Al Wafers (2 Messages)
EMAIL SCAN:VIRUS ALERT! IN ATTACHMENT~[TN] LAMINATE AND PREPREG (1 Message)
fab dwg notes...critique (5 Messages)
FAB-IPC-SM-840 (7 Messages)
FIDUCIAL SURVEY (9 Messages)
Flex-circuit electrical testing... (4 Messages)
Fluxes (9 Messages)
FR4 Replacement (8 Messages)
free Gerber visulization software (1 Message)
Freeze Spray and BGAs (10 Messages)
Freeze Spray and BGAs and Veeps (2 Messages)
Freezer Spray & BGAs (1 Message)
FST Outside Service (2 Messages)
Gerber visualization freeware (13 Messages)
gold plating (3 Messages)
Good Bye for the time being (1 Message)
graphic converter (8 Messages)
Graphite screening close to tracking (2 Messages)
HALF SLOT ON EDGE OF PCB (4 Messages)
happy99 (1 Message)
HASL co-planarity (6 Messages)
Hello! (2 Messages)
Hi Steve (4 Messages)
Horns on Tin Plated Screw (1 Message)
Humidity Measurement (3 Messages)
IGES files (4 Messages)
immersion nickel/gold (2 Messages)
Ionic testing for contamination (6 Messages)
IPC 2221/2222 or IPC-D-279 (and J-STD-001 or IPC-A-610) in Chin ese (1 Message)
IPC 610 and others in Japanese (6 Messages)
IPC board gerber data (1 Message)
IPC Lead Free Web Site Problems (1 Message)
IPC Lead Free Web Site Up and Running (2 Messages)
IPC Makes Lead Free Technical Papers Available for Free Download (1 Message)
IPC News Release: Lead-free Electronics Focus of IPCWorks '99 (1 Message)
IPC test standard (2 Messages)
IPC-D-356 (2 Messages)
IPC-R-700 vs. IPC-7721 (2 Messages)
IPCWorks '99 ― Conference Update ― Day 3 (1 Message)
IPCWorks '99 Hotel Reservations Reminder (1 Message)
J-STD-003, Sect. 1.8, Coating Durability (1 Message)
just wondering (2 Messages)
Key pad properties (2 Messages)
Killtimer (1 Message)
Laminate and Prepreg (4 Messages)
Large flexible circuit board (2 Messages)
Lead-free soldering (1 Message)
Light source (1 Message)
Limits on Solder Paste Height Measurements (1 Message)
Looking for a way to inspect solder connections (9 Messages)
low residue fluxes (1 Message)
Machine Rates (3 Messages)
Magnet wire insulation criteria (1 Message)
Material for PCB (2 Messages)
Methane Sulfonate vs. Fluoborate plating (3 Messages)
MicroVia Inc. - COMPLETE TURNKEY PCB FACILITY FOR SALE!!! (1 Message)
Mil-105 Replacement? (4 Messages)
Mixing solder bars from different manufacturer's (9 Messages)
Motorola Quality System questions (2 Messages)
Multilayer with embedded resistors (1 Message)
NCJ Standards (1 Message)
Net List (3 Messages)
New email (1 Message)
New Process Qualification (4 Messages)
NI/AU UNDER BETWEEN COPPER (7 Messages)
No clean flux residue (9 Messages)
No mail (1 Message)
Non-uniform copper plating (5 Messages)
Not read: Epoxy (2 Messages)
Not read: Thermode soldering (7 Messages)
NPL Electronics Interconnection Website (1 Message)
Offshore PCB Facility (1 Message)
PALLADIUM SILVER FINISH (4 Messages)
PCB blistering during wave (6 Messages)
PCB ECO and rework (1 Message)
PCB fab process (2 Messages)
PCB fab process -Reply (2 Messages)
PCB Fabrication Question (4 Messages)
PCB world Members Area (2 Messages)
PEM's in PWB's (1 Message)
Permanganate Problems (5 Messages)
Plating Calculations (1 Message)
Plugged Via (1 Message)
Pluritec collet cleaning (1 Message)
Prepregs (2 Messages)
Proof tracking index (PTI) and comparative tracking inde x (CTI) (1 Message)
Proof tracking index (PTI) and comparative tracking index (CTI) (1 Message)
question for board fabricators (3 Messages)
Question: TI-strate material? (1 Message)
R-Pak Wavesolder Footprint (1 Message)
Re : just wondering (2 Messages)
Read: Thermode soldering (9 Messages)
Recall: VIRUS in "Laminate and Prepeg from "My Computer" (1 Message)
Recycle Sn/Pb process (3 Messages)
Reflow furnace selection. (1 Message)
Repair of BGAs with underfill (1 Message)
RF Design (1 Message)
Rigid-Flex Board baking (7 Messages)
Rigid-Flex Board baking -Reply (1 Message)
RV: Dry film adherence problems (10 Messages)
second sources for hybrid leads? (1 Message)
Selective Wave Solder Pallet Problems (11 Messages)
Semi-Aqueous Cleaner... (8 Messages)
Sign Off (10 Messages)
sign off technet (4 Messages)
Sign-off (2 Messages)
SIGNOFF (5 Messages)
silkscreen and pads/holes (4 Messages)
Sloder bubbles on the VIAs (10 Messages)
small prototype shop in Boston area? (2 Messages)
Solder Paste Standards (3 Messages)
Soldering 492 PGBA on OSP/FR4 (2 Messages)
Solderpaste Recycling (6 Messages)
still round! (minimal technical content) (5 Messages)
Supplier of gold plating chemical (2 Messages)
Supplier of Molybden? (4 Messages)
TAPE AND REEL POCKET SIZES (2 Messages)
TDK RX-11As (1 Message)
TechNet Digest - 26 Jul 1999 (#1999-48) (1 Message)
Test (1 Message)
test message (2 Messages)
Texas Instruments 6701 BGA Package (3 Messages)
Thermal Pads under BGA's (2 Messages)
Thermode soldering (2 Messages)
Underfill on Micro BGA (2 Messages)
Underfill, BGA??? (2 Messages)
VIRUS in "Laminate and Prepeg from "My Computer" (1 Message)
Virus Warning (1 Message)
Viscous models for solder flow (2 Messages)
wave solder masking tapes (3 Messages)
Wave Soldering Questions (4 Messages)
Wave soldering Solder balls spec. (3 Messages)
WG: [TN] Embedment, potting - reliability, thermal cycling (2 Messages)
What's the future? (8 Messages)
White Tin (2 Messages)
White Tin land patterns (9 Messages)
Who know the packaging algorithm? (1 Message)
wirebonding (4 Messages)
wiring standards, defect tracking (1 Message)
Wobbler Virus Hoax (1 Message)
Wobbler Virus Hoax Posting (1 Message)
WORM WARNING (was:Re: [TN] Laminate and Prepreg) (3 Messages)
www.pcbworld.com (2 Messages)
Yoo-hoo! I'm still around! (Even less technical content) (1 Message)
Yoo-hoo! I'm still around! (No technical content) (3 Messages)
[Fwd: Acrylic adhesive resistance to temp] (1 Message)
[LF] "Drop-In" Replacement (4 Messages)
[TN] DFM Rule or Guide line (1 Message)
[TN] Humidity Measurement (1 Message)