Anil

Francis spoke of surface treatment prior to plating - this would cause
evident blistering - peeling - or no plating at all. yes - if the organic
level in the bath is high - it would gas out during wave solder - but - as
Kelly mentioned ( possibility ) or as stated previously ( possibility ) -
underplated barrels ( vias ) are usually the cause. there just isn't enough
copper there to take the thermal shock.

Personal opinion - i would microsection - if hard to determine - maybe an SEM.

Regards

Richard

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