Anil Francis spoke of surface treatment prior to plating - this would cause evident blistering - peeling - or no plating at all. yes - if the organic level in the bath is high - it would gas out during wave solder - but - as Kelly mentioned ( possibility ) or as stated previously ( possibility ) - underplated barrels ( vias ) are usually the cause. there just isn't enough copper there to take the thermal shock. Personal opinion - i would microsection - if hard to determine - maybe an SEM. Regards Richard ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################