We presently have a design in production consisting of a 625 (1.27 mm 25 x
25)ceramic BGA which emits 7 watts.  The outer four rows of the array are
signal terminations while the internal array of 17 x 17 solder joints are
thermal dissipaters.  The top layer of the thermal area under the component
consists of a solid copper layer with pads defined by solder mask.  Vias
attached to this thermal pad go all the way through the board to a heat sink
which the board is mounted to.

If you would like to discuss this further, please let me know.

Jim Marsico
AIL Systems Inc.
(516) 595-5879
[log in to unmask]


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